• 제목/요약/키워드: Edge devices

검색결과 451건 처리시간 0.044초

결함 제어를 통한 금속산화물 소재의 전기화학 특성 제어

  • 정형모;신원호
    • 세라미스트
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    • 제21권2호
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    • pp.49-58
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    • 2018
  • Metal oxide based materials have been widely used to fields of electrochemical applications. Recently, various type of defects from microstructures of metal oxides and their nanocomposites have been raised as the important material design factors for realizing highly improved electrochemical properties. Previous experimental and theoretical works have suggested that controlling the reaction activity and kinetics of the key electrochemical reactions by activated interfaces originating from the defect sites can play an important role in achieving the robust energy storage and conversion. Therefore, this paper focuses on the role of defect-controlled metal oxide materials such as doping, edge-sites, grain boundaries and nano-sized pores for the high performances in energy storage devices and electrocatalysts. The research approaches demonstrated here could offer a possible route to obtain noble ideas for designing the metal oxide materials for the energy storage and conversion applications.

설계민감도해석과 요소망 변형법을 이용한 전자소자의 3차원 형상최적화 (3D Shape Optimization of Electromagnetic Device Using Design Sensitivity Analysis and Mesh Relocation Method)

  • 류재섭;;고창섭
    • 대한전기학회논문지:전기기기및에너지변환시스템부문B
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    • 제52권7호
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    • pp.307-314
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    • 2003
  • This paper presents a 3D shape optimization algorithm for electromagnetic devices using the design sensitivity analysis with finite element method. The structural deformation analysis based on the deformation theory of the elastic body under stress is used for mesh renewing. The design sensitivity and adjoint variable formulae are derived for the 3D finite element method with edge element. The results of sensitivity analysis are used as the input data of the structural analysis to calculate the relocation of the nodal points. This method makes it possible that the new mesh of analysis region can be obtained from the initial mesh without regeneration. The proposed algorithm is applied to the shape optimization of 3D electromagnet pole to net a uniform flux density at the target region.

사파이어웨이퍼의 기계-화학적인 연마 가공특성에 관한 연구 (A Study on the chemical-mechanical polishing process of Sapphire Wafers for GaN thin film growth.)

  • 남정환;황성원;신귀수;김근주;서남섭
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 춘계학술대회 논문집 기술교육전문연구회
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    • pp.31-34
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    • 2003
  • The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by chemical and mechanical polishing(CMP) process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of sapphire crystalline wafer at surfaces has a full width at half maximum 89 arcses. The surfaces of sapphire wafers were mechanically affected by residual stress and surface default. Sapphire wafers's waveness has higher abrasion rate in the edge of the wafer than its center due to Newton's Ring interference.

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FUTURE HEAD/MEDIA TECHNOLOGIES IN RIGID DISK DRIVES

  • Byun, Chong-Won
    • 한국자기학회:학술대회 개요집
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    • 한국자기학회 1994년도 춘계연구발표회 논문개요집
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    • pp.12-13
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    • 1994
  • Magnetic recording is still considered to be a.leader in storage industries in general. The rigid disk drive, in particular, has an advantage over tape, optical, magneto-optical, or flash memories, because of high areal density and fast access time with reasonably low cost per Mbyte. However, to be competitive in the market and to keep an edge over other storage devices, head and media in rigid disk drives require better performance per cost and more aggressive improvement in areal density, as shown in Fig. 1, than before. In this review paper, the future trend in head/media technologies of the rigid disk drive has been reviewed. Thin film media and thin film inductive/MR heads will be mainly discussed, since they are expected to be dominant in the future high-end drives over other technologies, such as particulate media or MIG heads.(omitted)mitted)

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사파이어 웨이퍼의 기계-화학적인 연마 가공특성에 관한 연구 (Chemo-Mechanical Polishing Process of Sapphire Wafers for GaN Semiconductor Thin Film Growth)

  • 신귀수;황성원;서남섭;김근주
    • 대한기계학회논문집A
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    • 제28권1호
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    • pp.85-91
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    • 2004
  • The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by chemical and mechanical polishing process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of sapphire crystalline wafer at surfaces has a full width at half maximum of 89 arcsec. The surfaces of sapphire wafer were mechanically affected by residual stress during the polishing process. The wave pattern of optical interference of sapphire wafer implies higher abrasion rate in the edge of the wafer than its center from the Newton's ring.

모바일 엣지 컴퓨팅 기반 모바일 디바이스의 전력 소비량 감소를 위한 작업 할당 알고리즘 (Job Allocation Algorithm for Power Consumption of Mobile Devices Based on Mobile Edge Computing)

  • 유기성;한석현;김현우;송은하;이강만;정영식
    • 한국정보처리학회:학술대회논문집
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    • 한국정보처리학회 2017년도 추계학술발표대회
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    • pp.168-169
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    • 2017
  • 모바일 디바이스는 제한된 프로세서 및 저장 공간, 배터리 수명의 문제로 인해 새로운 대안으로 모바일 엣지 컴퓨팅이 연구되고 있다. 그러나 모바일 디바이스는 제한된 자원을 활용하기 때문에 전력 공급에 제약이 따른다. 모바일 엣지 컴퓨팅의 자원으로 활용 되려면 전력 소비량에 대한 관리가 필요하다. 본 논문에서는 모바일 엣지 컴퓨팅 기반 모바일 디바이스의 전력 소비량 감소를 위한 작업 할당 알고리즘을 제안한다.

설계툴을 사용한 저전력 SoC 설계 동향 (Low Power SoC Design Trends Using EDA Tools)

  • 박남진;주유상;나중찬
    • 전자통신동향분석
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    • 제35권2호
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    • pp.69-78
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    • 2020
  • Small portable devices such as mobile phones and laptops currently display a trend of high power consumption owing to their characteristics of high speed and multifunctionality. Low-power SoC design is one of the important factors that must be considered to increase portable time at limited battery capacities. Popular low power SoC design techniques include clock gating, multi-threshold voltage, power gating, and multi-voltage design. With a decreasing semiconductor process technology size, leakage power can surpass dynamic power in total power consumption; therefore, appropriate low-power SoC design techniques must be combined to reduce power consumption to meet the power specifications. This study examines several low-power SoC design trends that reduce semiconductor SoC dynamic and static power using EDA tools. Low-power SoC design technology can be a competitive advantage, especially in the IoT and AI edge environments, where power usage is typically limited.

GFRP 보강근의 단면 위치에 따른 부착특성 (Bond Characteristics of Glass Fiber Reinforced Polymer Rebar according to the Bar Location)

  • 박지선;박영환;유영준;황금식;김긍환
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2006년도 추계 학술발표회 논문집
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    • pp.197-200
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    • 2006
  • The bond characteristics of three different types of glass fiber reinforced polymer(GFRP) reinforcing bars with different surface deformations were studied experimentally. Each specimen consisted of a concrete prism, 150 by 150 mm on each edge, with the longer axis in the vertical direction. Two rebars were embedded in each specimen, perpendicular to the longer axis and parallel to and equidistant from the sides of the prism. In vertical direction, one rebar was located at 75 mm from the bottom of the prism, and the other 225 mm from the bottom. All testing procedures including specimens preparation, set-up of test equipments and measuring devices were made according to the recommendations of CSA Standard S806-02.It was found that the bottom reinforcements showed higher bond stress than that of the top rebars.

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내장형 3차원 그래픽 렌더링 처리기의 전력소모 (Power Estimation of The Embedded 3D Graphics Renderer)

  • 장태홍;이문기
    • 한국게임학회 논문지
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    • 제4권3호
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    • pp.65-70
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    • 2004
  • 모바일 기기에 대한 다양한 멀티미디어 기능의 요구로 입체감을 제공하는 3차원 그래픽 가속기의 구현이 절실한 상황이다. 하지만 다양한 멀티미디어 기능을 가져야 하는 최근의 휴대폰의 경향과 상대적으로 발전이 더딘 배터리의 문제를 생각할 때 3차원 그래픽 가속기의 저전력화는 필수적이라고 할 수 있다. 이에 본 논문에서는 내장형 3차원 그래픽 가속기 각 내부모듈별 전력소비를 측정하고 이를 내부 그래픽 처리과정과 함께 분석하였다.

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Push-N-Scheme with Timeout for Content Delivery of Social Networking Services

  • Jun, Kyungkoo
    • Journal of Information Processing Systems
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    • 제10권1호
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    • pp.81-91
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    • 2014
  • Widely spreading smart devices have become an important information sharing channel in everyday life. In particular, social networking services (SNS) are the hub for content creation and sharing. Users post their contents on SNS servers and receive contents of interest. Contents are delivered in either pull or push. Regarding delivery, cost and wait time are two important factors to be minimized, but they are in a trade-off relationship. The Push-N-scheme (PNS) and timeout-based push scheme (TPS) have been proposed for content delivery. PNS has an advantage in cost over TPS, whereas TPS has an edge in terms of the wait time over PNS. We propose a hybrid push scheme of PNS and TPS, called push-N-scheme with timeout (PNT), to balance the cost and the wait time. We evaluate PNT through simulations, with the results showing that PNT is effective in balancing PNS and TPS.