• Proceedings of the KSME Conference
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• 2007.05b
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• pp.1876-1881
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• 2007

The micro plated heat exchangers were designed to transfer more heat/volume or mass than previous heat exchangers within the context of the design constraints specified. The increase of the surface-to-volume ratio results in an increase of the interfacial area. This enhances considerably the performance of a heat exchanger. This can be an important component in a wide range of applications fuel cell, aerospace, automotive, electronic system and home heating, etc). In this study, the performance evaluation of micro plated heat exchangers under the counter flows with straight and S-shaped channel are carried out. The pressure drop as well as inlet and outlet fluid temperature were measured at steady state under various operating conditions and the total heat transfer rate were also calculated.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.10
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• pp.12-19
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• 1993

Because of their high sensitivity and moderate bandwidth, superconducting receivers with SIS (Superconductor Insulator Superconductor) tunnel junction mixer are now widely used for millimeter wave radio astronomy. In this paper we have introduced how to determine the parameters of SIS tunnel junction which have to be optimized to achieve a good mixer performance. From these results of optimized junction parameters determined by this methods, SIS junctions which consist of a series array of four Nb/Al-AlOx/Nb junctions with each area 3.4${\mu}m^{2}$ have been fabricated by SNEP (Selective Niobium Etching Process) and RIE (Reactive Ion Eching). Also we have tested their DC current-voltage characteristics. These SIS junctions will be used as a mixer for 100GHz band cosmic waves receiver.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.229-234
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• 2007

Microscale heat transfer and microfluidics have become increasingly important to overcome some very complex engineering challenges. The use of very small passages to gain heat transfer enhancement is a well documented method for achieving high heat flux dissipation. As the passage size is decreased, the heat transfer performance increases but the pressure drop increases sharply when the passage size is reduced. In this study, the performance evaluation of micro plated heat exchangers under the counter flows with straight, V-shaped and Y-shaped channel are carried out.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.45-48
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• 2000

High dielectric (Ba,Sr)TiO$_3$ thin films were etched in an inductively coupled plasma (ICP) as a function of C1$_2$/Ar gas mixing ratio. Under Cl$_2$(20)/Ar(80), the maximum etch rate of the BST films was 400$\AA$/min and selectivities of BST to Pt and PR were obtained 0.4 and 0.2, respectively. We investigated the etched surface of BST by x-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM) and x-ray diffraction (XRD). From the result of XPS analysis, we found that residues of Ba-Cl and Ti-Cl bonds remained on the surface of the etched BST for high boiling point. The surface roughness decreased as Cl$_2$ increases in Cl$_2$/Ar plasma because of non-volatile etching products. This changed the nature of the crystallinity of BST. From the result of XRD analysis, the crystalliility of etched BST film maintained as similar to as-deposited BST under Ar only and Cl$_2$(20)/Ar(80). However, (100) orientation intensity of etched BST film abruptly decreased at Cl$_2$ only plasma. It was caused that Cl compounds were redeposited on the etched BST surface and damaged to crystallinity of BST film during the etch process.

• Restorative Dentistry and Endodontics
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• v.24 no.1
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• pp.240-250
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• 1999

The purpose of this study was to evaluate the effect of different etching time on the shear bond strength and adaptibility of composite to enamel and dentin when used one-bottle adhesive Prime & Bond$^{TM}$ 2.0. The proximal and occlusal surfaces of 88 extracted human molars were ground to expose enamel(n=44) and dentin (=44) using diamond wheel saw. Teeth were randomly assigned to four test groups(n=11) and received the following treatments : Control group were conditioned with 36% phosphoric acid for 20 sec. according to the manufacturer's directions. Experimental 10 sec. group, 30 sec. group and 60 sec. group were conditioned with 36% phosphoric acid for 10 sec., 30 sec. and 60 sec., respectively. Teeth were rinsed and dried for 2 sec. Prime & Bond$^{TM}$ 2.0 were applied according to the manufacturer's directions and Spectrum$^{TM}$ TPH composite resins were bonded to enamel and dentin surfaces. All specimens were stored in distilled water for 24 hours. Eighty specimens were sheared in a Universal Testing Machine with a crosshead speed of 5mm/minute. One way ANOVA and LSD test were used for statistical analysis of the data. Failure modes of all specimens after shear bond strength test were examined and listed. Also, representive postfracture modes and eight specimens were examined under scanning electron microscope. The results of this study were as follows: 1. The shear bond strength to enamel was the highest value in 30 sec. group (20.68${\pm}$8.54MPa) and the lowest value in 10 sec. group (14.92${\pm}$6.07MPa), so there was significant difference of shear bond strength between two groups (p<0.05). But there was no significant difference among other groups (p>0.05). With longer etching time to enamel from 10 sec. to 30 sec., higher the shear bond strength was obtained, but the shear bond strength was decreased at 60 sec. etching time. 2. The shear bond strength to dentin was the highest value in control group (13.08${\pm}$6.25MPa) and the lowest value in 60 sec. group (9.47${\pm}$3.35MPa), but there was no significant difference among the all groups (p>0.05). The eching time over 20 sec. decreased the shear bond strength to dentin. 3. In SEM observation, the enamel and resin interfaces were showed close adaptation with no relation to etching time of enamel. And the dentin and resin interfaces were showed close adaptation at 20 sec. and 30 sec. etching time, but showed some gaps at 10 sec. and 60 sec. etching time. Accordingly, these results indicated that a appropriate etching time in Prime & Bond$^{TM}$ 2.0 was required to be 30 sec. in enamel and 20 sec. in dentin for the high shear bond strength and good adaptation between the composite resin and tooth substance.