• Journal of Ocean Engineering and Technology
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• v.16 no.4
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• pp.13-18
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• 2002

The magnitude of the plastic zone around the crack tip of DENT(Double Edge Notched Tension) specimen and the crack growth length under cyclic loading were measured by ESPI(Electronic Speckle Pattern Interferometry) system. The measured magnitude of plastic zone was compared with the equations proposed by Irwin and calculated by a nonlinear static method of MSC/NASTRAN. The measured crack growth length by ESPI system was also compared with the obtained data by the image analysis system. From the study, it is confirmed that the plastic zone and crack growth length can be measured accurately with the high-tech equipment.

• Journal of the Korean Society for Nondestructive Testing
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• v.22 no.6
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• pp.643-648
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• 2002

In this study, shearography and ESPI have been used for quantitative analysis of an inside crack of pipeline and both of them appeared suitable to qualitatively detect inside crack. However, shearography needs several effective factors including the amount of shearing, shearing direction and induced load for the quantitative evaluation of the inside crack. In this study, the factors were optimized for the quantitative analysis and the site of cracks has been determined. Although the effective factors in shearography has been optimized, it is difficult to determine the factors exactly because they are related to the details of tracks. On the other hand, ESPI is independent on the details of a crack and only the induced load plays an important role. The out-of-plane displacement was measured under the optimized load and the measured were numerically differentiated, which resulted in an equivalent to the shearogram. The size of cracks can be determined quantitatively without any detail of a crack.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.4
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• pp.485-490
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• 2010

Recently, environment problems have effects on the electronic equipments. Security problems are presented. For security reasons, it is necessary to study electronic equipments. In this paper, we handle the Elasticity modulus on the polymer insulator by UV irradiation. The types of material are used in this experiment, is the EPDM (Ethylene Propylene Diene Monomer). For increasing the reliability, real material specimens are used. For this study, we used ESPI (Electronic speckle pattern interferometry), UTM (Universal thesting machine) device, Accelerated weathering tester. Through this measurement, we evaluated how much UV irradiation has effect on polymer insulator and how long does it take to change the polymer insulator. Also this paper will give a help in electronic industry and the method of measuring the insulator elasticity modulus of polymer could be utilized in life estimation and replacement time of the products of electronic equipment that is used in real industrial fields.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.4
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• pp.693-700
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• 2002

Recently, the mechanical structures applied to many industrial products, especially in electronic products, appear to be miniaturized and complicated. This trend makes it difficult to analyze the stress distribution of those mechanical structures and generates new challenges for precise measurement of strain. In order to solve this measurement problem many optical measurement techniques have been suggested. Among those, the ESPI(Electronic Speckle Pattern Interferometry) has been considered as one of the most useful tools. But the shortage of recognition and difficulties of measurement have limited its industrial applications in spite of its excellent capabilities. Therefore in this study, not only the verification of the FEA result but the enhancement of industrial application of ESPI was tried by measuring the in-plane displacement of mechanical structure with ESPI, which is difficult to be measured with strain gauge.

• Journal of Korean Ophthalmic Optics Society
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• v.12 no.4
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• pp.77-81
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• 2007

The spherical lens is typically classified by the refractive power into two groups such as (+) diopter lens and (-) diopter lens. The deformation occurred by the external force that is applied to a lens is caused by the increase or the decrease in the diopter of a lens. In this paper, the deformation of the lens was quantitatively measured by using ESPI (Electronic Speckle Pattern Interferometry) which have been used in the optical measurement field for past few years. ESPI has an advantage that the deformation of an object can be measured precisely by using coherence of the light. The experiment was carried out to the totally 16 types of plastic lens. It was confirmed that the deformation was decreased by increasing the diopter of the lens when same displacement was applied to the lens in case of (+) diopter lens and was increased by decreasing the diopter of the lens in case of (-) diopter lens. Also, it was found that the deformation of (+) diopter lens is less than that of (-) diopter lens. Therefore, with these results, it is expected that the possibility of the quantitative measurement for variation of the optical defect caused by the deformation of a lens when the deformation is occurred to the various types of the lens can be presented and that the application in the lens industrial field can be performed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.7
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• pp.597-601
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• 2008

Currently knowledge of strain in welds has mainly been obtained from strain gaging method: that is directly attaching most of the material to the gage. The very few non-contact methods are still in the early stage. One of the non-contact methods is by the use of the laser that has high-level of the accuracy for the measurement, and this laser also has excellent characteristics on which many studies for its applications are focused throughout the many fields. A method of study is on the measurement of the strain caused by the characteristics of the spot welded zone which is used with 3-D ESPI system that is functionally modified through the laser ESPI(Electronic Speckle Pattern Interferometry) system. This system employed the SGCC 1.2t which are mainly used for the steel plate such as automobile, structure, building material and electronic appliances.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.930-933
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• 2005

Non-destructive inspection techniques using laser have been breading their application areas as well as growing their measurement skills together with the rapid development of circumferential technology like fiber optics. computer and image processing The ESPI technique is already on the stage of on-line testing with commercial products in developed country nations. Especially, this technique is expected to be applied to the nuclear industry, automobile and aerospace because it is proper for the vibration measurement and it can be applied to objects of a high temperature. This paper describes the use of the ESPI system for measuring vibration patterns on the reflecting objects. Using this system, high-quality Jo fringes for identifying mode shapes are displayed. A bias vibration is introduced into the reference beam to shift the Jo fringes so that fringe shift algorithms can be used to determine vibration amplitude. Using this method. amplitude fields for vibrating objects were obtained directly from the time-average interferometer recorded by the ESPI system.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.54-63
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• 2006

Enhancement methods of sensitivity to in-plane strain measurement by micro-ESPI(Electronic Speckle Pattern Interferometry) technique were proposed using TiN and Au thin films. Micro-tensile strain over the micro-tensile specimens, prepared in micro-scale by those films, was measured by micro-tensile loading system and micro-ESPI system developed in this study. The subsequent measurement of in-plane tensile strain in the micro-sized specimens was introduced using the micro-ESPI technique, and the micro-tensile stress-strain curves for these films were determined. To enhance the sensitivity to measurement of in-plane tensile strain, algorithms of the phase estimation by using curve fitting of inter-fringe and the discrete Fourier Transform with object-induced dynamic phase shifting were developed. Using these two algorithms, the micro-tensile strain-stress curves were generated. It is shown that the algorithms for enhancement of the sensitivity suggested in this study make the sensitivity to measurement of the in-plane tensile strain increase.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1315-1320
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• 2003

The thermal expansion coefficient, which causes the micro failure at the interfacial state of thin films is necessary to consider for proper designing MEMS. The effect of temperature on the coefficient of thermal expansion(CTE) of $SiO_2$ and $Si_3N_4$ film was investigated. Thermal strain induced by mismatch of CTE between substrate and thin film continuously measured with resolution-improved electronic speckle pattern interferometry(ESPI). The thermal stress induced by mismatch of CTE derivate through thermal strain. The thermal expansion coefficients of thin film were calculated with the general equation of CTE and thermal stress in thin films, and it confirmed that CTE of $SiO_2$changed from $0.25{\times}10^{-6}/^{\circ}C$ to $1.4{\times}10^{-6}/^{\circ}C$ with temperature increasing from 50 to $600^{\circ}C$

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.516-521
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• 2000

Most of studies, using ESPI method, have handled tension, thermal and vibration analysis, and is limited to isotropic materials. However, tension and vibration simultaneously are loaded in real structure. Also, almost study using ESPI method is locally limited to the analysis on the isotropic materials and a few studies on the anisotropic materials have reported. Existing methods, such as the accelerometer method and FEA method, to analyze vibration have some disadvantages. Using the accelerometer method that is generally used to analyze vibration phenomena, it is impossible to analyze vibration on the oscillating body and one can observe no vibration mode shape during experiment. In case of the FEA method, it is difficult to define boundary conditions correctly if the shape of a body tested is complex, and one can just obtain vibration mode shapes on the peak amplitude in each modes. In this study, plane plate of stainless steel(STS304), isotropic material, that is used as structural steel is analyzed about vibration characteristics under tension. Also, in the study of stainless steel, the characteristics of composite material(AS4/PEEK) used as high strength structural material in aircraft is evaluated about vibration under tension, and studies the effect of tension on vibration.