• Title/Summary/Keyword: ESPI(Electronic speckle pattern interferometry)

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A Study on Measurement and Analysis of In-Plane Deformations by Using Laser Speckle Interferometry (II) (레이저 스페클 간섭법을 이용한 면내 변형 측정 및 해석에 대한 연구 (II))

  • 강영준;노경완;나의균
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.12
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    • pp.113-119
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    • 1998
  • Recently Electronic Speckle Pattern Interferometry(ESPI) has been studied because it has the advantages to be able to measure the whole-field surface deformations of engineering components and materials in industrial areas with noncontact. The speckle patterns to be formed with interference phenomena of scattering light from rough surfaces illuminated by laser light have phase informations of surface deformations. In this study we used this interference phenomena and the phase shifting method to measure the inplane deformations, together with the use of digital image equipment to process the informations contained in the speckle pattern and to display consequent interferograms on TV monitor. FEA was performed before experiments and we obtained good agreement between the experimental results and FEA.

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Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry

  • Kim, Koung-Suk;Kang, Ki-Soo;Jung, Seung-Tack
    • Journal of Mechanical Science and Technology
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    • v.19 no.3
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    • pp.820-825
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    • 2005
  • This paper proposes non-destructive ESPI technique to evaluate inside defects of semiconductor package quantitatively. Inspection system consists of ESPI system, thermal loading system and adiabatic chamber. The technique has high feasibility in non-destructive testing of semiconductor and gives solutions to the drawbacks in previous technique, time-consuming and the difficulty of quantitative evaluation. In result, most of defects are classified in delamination, from which it is inferred to the insufficiency of adhesive strength between layers and nonhomogeneous heat spread. The $90\%$ of tested samples have a delamination defect started at the around of the chip which may be related to heat spread design.

A Study on the Development of Image Processing Measurement System on the Structural Analysis by Optical Non-contact Measurement (광학적 비접촉 측정에 의한 구조물 해석의 화상처리 계측 시스템 개발에 관한 연구)

  • 김경석
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.8 no.6
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    • pp.78-83
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    • 1999
  • This study discusses a non-contact optical technique, electronic speckle pattern interformetry(ESPI), that is well suited for in-plane and out-of-plane deformation measurement. However, the existing ESPI methods that are based on dual-exposure, real-time and time-average method have difficulties for accurate measurement of structure, due to irregular intensity and shake of phase. Therefore, phase shifting method has been proposed in order to solve this problem. About the method, the path of reference light in interferometry is shifted and added to least square fitting method to make the improvement in distinction and precision. This proposed method is applied to measure in -plane displacement that is compared with the previous method. Also, Used as specimen AS4/PE따 [30/=30/90]s was analyzed by ESPI based on real-time to determine the characteristics of vibration under no-load and tension. These results are quantitatively compared with those of FEM analysis inmode shapes.

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The Study on Measurement of In-Plane Displacement in Mechanical Structure applied to Washing Machine using ESPI (ESPI를 이용한 세탁기 적용 기계 구조물의 면내변위 측정에 관한 연구)

  • Lee, Hac-Ju;Kim, Sang-Tea;Choi, Eun-Oh;Chang, Seog-Weon
    • Proceedings of the KSME Conference
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    • 2001.06a
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    • pp.108-113
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    • 2001
  • Recently, the mechanical structures applied to many industrial products, especially in electronic products, appear to be miniaturized and complicated. This trend makes it difficult to analyze the stress distribution of those mechanical structures and generates new challenges for precise measurement of strain. Therefore, generally most of those cases largely depend on the finite element analysis. But the development of optical metrology which has the capability of non-contact, full-field and precise measurement makes it possible to solve these measuring problems. Among the optical measurement techniques, the electronic speckle pattern interferometry (ESPI) has been developed and considered as one of the most useful tools for measuring displacement and deformation. But the shortage of recognition and difficulties of measurement have limited its industrial applications in spite of its excellent capabilities. Therefore in this study, in order to enhance the industrial application of ESPI, the measurement of in-plane displacement of mechanical structure with ESPI, which is applied to washing machine and cannot be measured by strain gauges, was performed. And the verification of validity of FEA results was also done.

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A Study on the Rotating Displacement Measurement of Rigid Body by ESPI Method (ESPI법에 의한 강체 회전 변위 측정에 관한 연구)

  • 김경석;홍명석
    • Transactions of the Korean Society of Automotive Engineers
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    • v.1 no.2
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    • pp.125-133
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    • 1993
  • Electronic Speckle Pattern Interferometry(ESPI) using a CW laser, a video system and image processor was applied to the rotating displacement of rigid body. ESPI require no special surface preparation or attachments and displacements between any two arbitrary points on the surface can be measured. The characteristic speckle pattern formed when imaging a scattering surface illuminated by laser light retains phase information, which can be used for interferometric measurement of surface displacement. The application of this principle to measuring in-plane displacement resolved in one direction is described, together with the novel use of television equipment to detect and process the information contained in the speckle pattern. This is faster, and more convenient and versatile than customary photographic methods.

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Quantitative Evaluation of Delamination Inside of Composite Materials by ESPI (ESPI를 이용한 복합재료 박리결함의 정량평가)

  • Kim, Koung-Suk;Yang, Kwang-Young;Kang, Ki-Soo;Ji, Chang-June
    • Journal of the Korean Society for Nondestructive Testing
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    • v.24 no.3
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    • pp.246-252
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    • 2004
  • Electronic speckle pattern interferometry (ESPI) for quantitative evaluation of delaminations inside of a composite material plate is described. Delaminations caused by the impact on composite materials are difficult to detect visual inspection and ultrasonic testing due to non-homeogenous structure. This paper proposes the quantitative evaluation technique of the defects made in the composite plates by impact load. Artificial defects are introduced inside of the composite plate for the development of a reliable ESPI inspection technique. Real defects produced by impact tester are inspected and compared with the results of visual inspection which shows a good agreement within 5% error.

A Study on the Vibration Characteristics of Symmetry, Asymmetry Laminated Composite Materials by using Time-Average ESPI (시간평균 ESPI를 이용한 대칭.비대칭 적층 복합재료의 진동 특성 비교에 관한 연구)

  • Hong Kyung-Min;Ryu Weon-Jae;Kang Young-Jung;Kang Shin-Jae
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.259-260
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    • 2006
  • The ESPI(Electronic Speckle Pattern Interferometry) is a real time, full-field, non-destructive optical measurement technique. In this study, ESPI is proposed for the purpose of vibration analysis for new material, composite material. Composite materials have various complicated characteristics according to the ply materials, ply orientations, ply stacking sequences and boundary conditions. Therefore, it is difficult to analysis composite materials. For efficient use of composite materials in engineering applications the dynamic behavior, that is, natural frequencies, nodal patterns should be informed. If use Time-Average ESPI, can analyze vibration characteristic of composite material by real time easily. This study manufactured laminated composite of symmetry, asymmetry two kinds that is consisted of CFRP(Carbon Fiber Reinforced Plastics) and shape of test piece is rectangular form.

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Vibration characteristics analysis on the composite laminate plate under the tensile loading by ESPI method (ESPI법에 의한 인장을 받는 복합재 평판의 진동 특성 해석)

  • 김경석
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1999.10a
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    • pp.69-73
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    • 1999
  • This study discusses a non-contact optical technique, electronic speckle pattern interferometry(ESPI), that is well suited for in-plane and out-of-plane deformation measurement. AS4/PEEK[30/-30/90]s, composite laminate plate was analyzed by ESPI to determine the vibration characteristics with tensile loading and without it. vibration mode shapes are quantitatively compared with the result of numerical analysis. The experimental results agree well with those of numerical analysis. we found that when the composite laminate plate is under the tensile loading, vibration modes can be measured with high accuracy by ESPI.

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Optical-fiber Electronic Speckle Pattern Interferometry for Quantitative Measurement of Defects on Aluminum Liners in Composite Pressure Vessels

  • Kim, Seong Jong;Kang, Young June;Choi, Nak-Jung
    • Journal of the Optical Society of Korea
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    • v.17 no.1
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    • pp.50-56
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    • 2013
  • Optical-fiber electronic speckle pattern interferometry (ESPI) is a non-contact, non-destructive examination technique with the advantages of rapid measurement, high accuracy, and full-field measurement. The optical-fiber ESPI system used in this study was compact and portable with the advantages of easy set-up and signal acquisition. By suitably configuring the optical-fiber ESPI system, producing an image signal in a charge-coupled device camera, and periodically modulating beam phases, we obtained phase information from the speckle pattern using a four-step phase shifting algorithm. Moreover, we compared the actual defect size with that of interference fringes which appeared on a screen after calculating the pixel value according to the distance between the object and the CCD camera. Conventional methods of measuring defects are time-consuming and resource-intensive because the estimated values are relative. However, our simple method could quantitatively estimate the defect length by carrying out numerical analysis for obtaining values on the X-axis in a line profile. The results showed reliable values for average error rates and a decrease in the error rate with increasing defect length or pressure.