• 제목/요약/키워드: ESPI(Electronic speckle pattern interferometry)

검색결과 114건 처리시간 0.045초

전자스패클패턴 간섭시스템을 이용한 피로하중을 받는 균열선단에서 탄소성 영역 측정에 관한 연구 (A Study on the Measurement of Elastic-Plastic Zone at the Crack Tip under Cyclic Loading using ESPI System)

  • 김경수;심천식
    • 한국해양공학회지
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    • 제16권4호
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    • pp.13-18
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    • 2002
  • The magnitude of the plastic zone around the crack tip of DENT(Double Edge Notched Tension) specimen and the crack growth length under cyclic loading were measured by ESPI(Electronic Speckle Pattern Interferometry) system. The measured magnitude of plastic zone was compared with the equations proposed by Irwin and calculated by a nonlinear static method of MSC/NASTRAN. The measured crack growth length by ESPI system was also compared with the obtained data by the image analysis system. From the study, it is confirmed that the plastic zone and crack growth length can be measured accurately with the high-tech equipment.

Analysis of an Inside Crack of Pressure Pipeline Using ESPI and Shearography

  • Kim, Kyung-Suk;Kang, Ki-Soo
    • 비파괴검사학회지
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    • 제22권6호
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    • pp.643-648
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    • 2002
  • In this study, shearography and ESPI have been used for quantitative analysis of an inside crack of pipeline and both of them appeared suitable to qualitatively detect inside crack. However, shearography needs several effective factors including the amount of shearing, shearing direction and induced load for the quantitative evaluation of the inside crack. In this study, the factors were optimized for the quantitative analysis and the site of cracks has been determined. Although the effective factors in shearography has been optimized, it is difficult to determine the factors exactly because they are related to the details of tracks. On the other hand, ESPI is independent on the details of a crack and only the induced load plays an important role. The out-of-plane displacement was measured under the optimized load and the measured were numerically differentiated, which resulted in an equivalent to the shearogram. The size of cracks can be determined quantitatively without any detail of a crack.

ESPI를 이용한 자외선조사량에 따른 폴리머애자의 탄성계수 변화 연구 (Elasticity Modulus Change Research of Polymer Ultraviolet Dosage by using ESPI)

  • 김경석;김동수;장호섭;박찬주;장완식;정현철
    • 한국생산제조학회지
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    • 제19권4호
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    • pp.485-490
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    • 2010
  • Recently, environment problems have effects on the electronic equipments. Security problems are presented. For security reasons, it is necessary to study electronic equipments. In this paper, we handle the Elasticity modulus on the polymer insulator by UV irradiation. The types of material are used in this experiment, is the EPDM (Ethylene Propylene Diene Monomer). For increasing the reliability, real material specimens are used. For this study, we used ESPI (Electronic speckle pattern interferometry), UTM (Universal thesting machine) device, Accelerated weathering tester. Through this measurement, we evaluated how much UV irradiation has effect on polymer insulator and how long does it take to change the polymer insulator. Also this paper will give a help in electronic industry and the method of measuring the insulator elasticity modulus of polymer could be utilized in life estimation and replacement time of the products of electronic equipment that is used in real industrial fields.

비틀림하중을 받는 기계구조물의 ESPI를 이용한 면내변위 측정에 관한 연구 (A Study on Measurement of In-Plane Displacement using ESPI in Mechanical Structure under torsional load)

  • 장석원;이학주;최은오;정찬희
    • 대한기계학회논문집A
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    • 제26권4호
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    • pp.693-700
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    • 2002
  • Recently, the mechanical structures applied to many industrial products, especially in electronic products, appear to be miniaturized and complicated. This trend makes it difficult to analyze the stress distribution of those mechanical structures and generates new challenges for precise measurement of strain. In order to solve this measurement problem many optical measurement techniques have been suggested. Among those, the ESPI(Electronic Speckle Pattern Interferometry) has been considered as one of the most useful tools. But the shortage of recognition and difficulties of measurement have limited its industrial applications in spite of its excellent capabilities. Therefore in this study, not only the verification of the FEA result but the enhancement of industrial application of ESPI was tried by measuring the in-plane displacement of mechanical structure with ESPI, which is difficult to be measured with strain gauge.

ESPI를 이용한 구면 안경렌즈의 면외 변형 측정 (Out-of-plane Deformation Measurement of Spherical Glasses Lens Using ESPI)

  • 양승필;김경석;장호섭;김현민
    • 한국안광학회지
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    • 제12권4호
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    • pp.77-81
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    • 2007
  • 구면 렌즈는 굴절력에 따라 크게 (+)디옵터와 (-)디옵터 렌즈로 구분할 수 있다. 렌즈에 가해지는 외력에 의해 발생되는 변형은 디옵터의 증가 또는 감소에 따라 다르게 발생된다. 본 논문에서는 수년간 광계측 분야에서 널리 사용되고 있는 ESPI를 이용하여 렌즈에 발생되는 변형을 정량적으로 측정 하였다. ESPI(Electronic Speckle Pattern Interferometry: ESPI)는 빛의 가간섭성을 이용하여 대상물의 변형을 비접촉으로 정밀하게 측정할 수 있다는 장점을 지니고 있다. 실험은 총 16종의 플라스틱 안경 렌즈를 대상으로 수행 하였다. 동일한 변위를 주었을 때, (+)렌즈는 디옵터가 증가함에 따라 변형량이 감소하고, (-)렌즈의 경우 (+)디옵터 렌즈와는 반대로 디옵터가 감소함에 따라 변형량이 증가한다는 것을 확인 하였다. 또한 (+)디옵터 렌즈가 (-)디옵터 렌즈에 비해 상대적으로 변형량이 적게 발생한 사실을 알 수 있었다. 따라서 본 논문의 결과는 다양한 렌즈에 외부 변위가 가해지는 경우 렌즈의 변형에 의한 광학적 결함 등을 정량적으로 측정 할 수 있는 가능성을 제시하고 렌즈 산업 분야에 다양하게 응용 될 것으로 기대된다.

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3-D ESPI법을 이용한 단점용접부의 변형률 측정 (The Strain Measurement of One Point Spot Welded Zone Using the 3-D ESPI)

  • 차용훈;강대진;장훈;장경천;성백섭
    • 대한기계학회논문집A
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    • 제32권7호
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    • pp.597-601
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    • 2008
  • Currently knowledge of strain in welds has mainly been obtained from strain gaging method: that is directly attaching most of the material to the gage. The very few non-contact methods are still in the early stage. One of the non-contact methods is by the use of the laser that has high-level of the accuracy for the measurement, and this laser also has excellent characteristics on which many studies for its applications are focused throughout the many fields. A method of study is on the measurement of the strain caused by the characteristics of the spot welded zone which is used with 3-D ESPI system that is functionally modified through the laser ESPI(Electronic Speckle Pattern Interferometry) system. This system employed the SGCC 1.2t which are mainly used for the steel plate such as automobile, structure, building material and electronic appliances.

시간 평균 ESPI를 이용한 진동 물체의 공진 주파수 검출 신뢰도 검증에 대한 연구 (A Study on Reliability Verification of Resonance Frequency Detection of Vibration Object using Time-average ESPI)

  • 홍경민;유원재;강영준;이동환
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.930-933
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    • 2005
  • Non-destructive inspection techniques using laser have been breading their application areas as well as growing their measurement skills together with the rapid development of circumferential technology like fiber optics. computer and image processing The ESPI technique is already on the stage of on-line testing with commercial products in developed country nations. Especially, this technique is expected to be applied to the nuclear industry, automobile and aerospace because it is proper for the vibration measurement and it can be applied to objects of a high temperature. This paper describes the use of the ESPI system for measuring vibration patterns on the reflecting objects. Using this system, high-quality Jo fringes for identifying mode shapes are displayed. A bias vibration is introduced into the reference beam to shift the Jo fringes so that fringe shift algorithms can be used to determine vibration amplitude. Using this method. amplitude fields for vibrating objects were obtained directly from the time-average interferometer recorded by the ESPI system.

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마이크로 ESPI 기법에 의한 면내 변형 측정 민감도 향상 (Improvement of Sensitivity to In-plane Strain/Deformation Measurement by Micro-ESPI Technique)

  • 김동일;기창두;허용학
    • 한국정밀공학회지
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    • 제23권8호
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    • pp.54-63
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    • 2006
  • Enhancement methods of sensitivity to in-plane strain measurement by micro-ESPI(Electronic Speckle Pattern Interferometry) technique were proposed using TiN and Au thin films. Micro-tensile strain over the micro-tensile specimens, prepared in micro-scale by those films, was measured by micro-tensile loading system and micro-ESPI system developed in this study. The subsequent measurement of in-plane tensile strain in the micro-sized specimens was introduced using the micro-ESPI technique, and the micro-tensile stress-strain curves for these films were determined. To enhance the sensitivity to measurement of in-plane tensile strain, algorithms of the phase estimation by using curve fitting of inter-fringe and the discrete Fourier Transform with object-induced dynamic phase shifting were developed. Using these two algorithms, the micro-tensile strain-stress curves were generated. It is shown that the algorithms for enhancement of the sensitivity suggested in this study make the sensitivity to measurement of the in-plane tensile strain increase.

ESPI를 이용한 MEMS용 소재의 열팽창 계수 온도 의존성 평가 (Evaluation of Temperature-dependency of CTE of Materials for MEMS Using ESPI)

  • 김동원;김홍재;이낙규;최태훈;나경환;권동일
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.1315-1320
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    • 2003
  • The thermal expansion coefficient, which causes the micro failure at the interfacial state of thin films is necessary to consider for proper designing MEMS. The effect of temperature on the coefficient of thermal expansion(CTE) of $SiO_2$ and $Si_3N_4$ film was investigated. Thermal strain induced by mismatch of CTE between substrate and thin film continuously measured with resolution-improved electronic speckle pattern interferometry(ESPI). The thermal stress induced by mismatch of CTE derivate through thermal strain. The thermal expansion coefficients of thin film were calculated with the general equation of CTE and thermal stress in thin films, and it confirmed that CTE of $SiO_2$changed from $0.25{\times}10^{-6}/^{\circ}C$ to $1.4{\times}10^{-6}/^{\circ}C$ with temperature increasing from 50 to $600^{\circ}C$

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ESPI에 의한 인장하중 하에서의 복합재 적층판의 진동 거동에 관한 연구 (A Study on the Vibration Behavior of Composite Laminate under Tensile Loading by ESPI)

  • 양승필;김경석;정현철;장호섭;김종수
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2000년도 추계학술대회논문집A
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    • pp.516-521
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    • 2000
  • Most of studies, using ESPI method, have handled tension, thermal and vibration analysis, and is limited to isotropic materials. However, tension and vibration simultaneously are loaded in real structure. Also, almost study using ESPI method is locally limited to the analysis on the isotropic materials and a few studies on the anisotropic materials have reported. Existing methods, such as the accelerometer method and FEA method, to analyze vibration have some disadvantages. Using the accelerometer method that is generally used to analyze vibration phenomena, it is impossible to analyze vibration on the oscillating body and one can observe no vibration mode shape during experiment. In case of the FEA method, it is difficult to define boundary conditions correctly if the shape of a body tested is complex, and one can just obtain vibration mode shapes on the peak amplitude in each modes. In this study, plane plate of stainless steel(STS304), isotropic material, that is used as structural steel is analyzed about vibration characteristics under tension. Also, in the study of stainless steel, the characteristics of composite material(AS4/PEEK) used as high strength structural material in aircraft is evaluated about vibration under tension, and studies the effect of tension on vibration.

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