• 제목/요약/키워드: EMI Shielding Layers

검색결과 11건 처리시간 0.015초

무전해 도금법을 이용한 전자소재용 은-구리 복합분말의 제조 (Synthesis of Ag-Cu Composite Powders for Electronic Materials by Electroless Plating Method)

  • 윤치호;안종관;김동진;손정수;박제신;안양규
    • 한국분말재료학회지
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    • 제15권3호
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    • pp.221-226
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    • 2008
  • Silver coated copper composite powders were prepared by electroless plating method by controlling the activation and deposition process variables such as feeding rate of silver ions solution, concentration of reductant and molar ratio of activation solution $(NH_4OH/(NH_4)_2SO_4)$ at room temperature. The characteristics of the product were verified by using a scanning electron microscopy (SEM), X-ray diffraction (XRD) and atomic absorption (A.A.). It is noted that completely cleansing the copper oxide layers and protecting the copper particles surface from hydrolysis were important to obtain high quality Ag-Cu composite powders. The optimum conditions of Ag-Cu composite powder synthesis were $NH_4OH/(NH_4)_2SO_4$ molar ratio 4, concentration of reductant 15g/l and feeding rate of silver ions solution 2 ml/min.