• Proceedings of the KSME Conference
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• 2001.06c
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• pp.71-76
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• 2001

In general, it is known that the wear rate of the abrasive and the removal rate of the metal bond of the grinding wheel should be balanced to maintain the depth of the insulating surface layer to an appropriate level. In order to accomplish, the high quality ELID grinding, therefore, it is necessary to measure the depth of the insulating layer in real-time and then to control the electrolytic conditions to keep the depth to a certain level. In this study, an in-process measurement system of the insulated layer using two gap sensors - a capacitor type and an eddy current type - developed and the change of the status of the insulated layer during ELID grinding is detected. And from the experimental data, we have chosen the best mathematical model to predict the depth of the insulating layer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.629-632
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• 2005

ELID(ELectrolytic In-process Dressing) grinding is an excellent technique for mirror grinding of various advanced metallic or nonmetallic materials. A polishing process is also required for elimination of scratches present on ELID grinded surfaces. MAP(Magnetic Assisted Polishing) has been used as a polishing method due to its high polishing efficiency and to its resulting in a superior surface quality. This study describes an effective fabrication method combining ELID and MAP of nano-precision mirror grinding for glass-lens molding mould, such as WC-Co, which are extensively used in precision tooling material. And for the optics glass-ceramic named Zerodure, which is extensively used in precision optics components too. The experimental results show that the combined method is very effective in reducing the time required for final polishing. The best surface roughness of the polished glass-ceramic was within 1.7nm Ra in this study.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.65-68
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• 1995

A slicing method by thin diamond blade is widely usd slicing of hard and brittle materials such as ceramics,glass and ferrite etc.. In this study, a new slicing system which realizes highly efficient and mirror surface slicing was developed by applying ELID-grinding with metallic bond diamond blades and its performance was evaluated. Hard and brittle materials such as ceramics,glass and ferrite were used as workpiece. Metallic bond diamond blades with grit sizes #325 and #2000 were used. Experimental results show that highly efficient slicing and good mirror surface can be successfully obtained using the developed slicing system with ELID features.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.3
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• pp.149-154
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• 2015

This study has focused on the deburring technology of a vacuum plate for MLCC lamination using electrolytic in-process dressing (ELID) grinding, and the magnetic-assisted polishing (MAP) process. The surface of the vacuum plate has many micro-holes for vacuum suction. They are easily blocked by the burrs created in the surface-flattening process, such as the conventional grinding process. In this study, the MAP process, the ELID grinding process, and an ultrasonic vibration table are examined to remove the micro-burrs that lead to the blockage of the holes. In the results of the experiments, the MAP process and ELID grinding technology showed significant improvements of surface roughness and deburring performance.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.5
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• pp.157-164
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• 2001

The grinding for hard-to-machine materials, such as ceramics, super alloys etc., has proven to be a very difficult and consuming process utilizing ordinary methods. In order to conduct high efficiency machining of such materials, grinding processes using metallic bond diamond wheels and applying electrolytic in-process dressing(ELID) have been attempted on a surface grinding machine. In this study, the effects of grinding parameters, and grit sizes have been evaluated in view of surface roughness, grinding force as well as step difference in simultaneous grinding of different materials. The study and experimental results are presented in this paper.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.3
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• pp.13-18
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• 2012

We investigated the cell activity of controlled titanium surface using various grinding methods including ELID (Electrolytic In-Process Dressing) grinding method. The influence of titanium surface condition by each grinding process on the cell activity was evaluated by ALP activity of MSC(Mesenchymal Stem Cells). The ALP activity of controlled surface by ELID grinding process using # 2000 wheel was higher than that of other titanium surface. The morphological, chemical properties of machined surface by grinding method was observed using various analytical method.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.8
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• pp.99-105
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• 1995

This paper provides a highly efficient grinding for ferrous materials using ELID-grinding method. The grinding efficiency using ELID gring method with CIFB-cBN wheel and CB-cBN wheel is compared with general grinding method with V-cBN wheel. This paper measured grinding ratio for plunge grinding and grinding resistance for traverse grinding in order to investigate grinding ability. The results show that ELID grinding methods is useful for the high efficient grinding of ferrous materials.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.6 s.183
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• pp.29-36
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• 2006

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.5
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• pp.58-64
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.946-949
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• 2001

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some grinding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametral silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpiece are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipped with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6nm in Ra.