• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.999-1002
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• 1997

In this study, in order to set ELID conditions in the internal grinding wheel, the characteristics with the variations of grit size, output voltage and peak current were examined by using conventional machining center(M/C) equipped with electrolytic in-process dressing(EL1D). The initial working voltage was lowered and the working current was high with increasing grit size. The insulating layer thickness increased, as the final voltage increased with the output voltage and peak current. The initial wear rate of the wheel machined with ELID were measured indirectly by using surface roughness tracer. The initial wear rate of the wheel with ELID increased along with high grit size. In case that the grit size with ELID was low, the output voltage and peak current had to be increased to increase the insulating layer thickness. In case of the high grit size, the output voltage and the peak current were established low, which made the insulating layer thickness decreased.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.5
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• pp.58-64
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.946-949
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• 2001

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some grinding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametral silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpiece are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipped with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6nm in Ra.

• 연구논문집
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• s.28
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• pp.59-71
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• 1998

The ELID(electrolytic in-process dressing) grinding method is a new precision grinding technique with the special electrolytic in-process dressing by metal bonded grinding wheel, fluid, and power supply. It is possible to make a efficient precision machining of hard and brittle materials such as ceramics, hard metals, and quenched steels by using this method, In this study, a new efficient precision grinding method with ELID was attempted for application to the machining and finishing processes of cylindrical structural components. And, we try to develop the cylindrical grinding technique for mirror surface of ceramics, tungsten carbide and SCM steel, and for the high efficiency grinding of machined parts, for example, ball screw shaft. Electrical characteristics of three different wheel grit sizes of #325, #2000 and #4000 were investigated experimentally. ELID grinding method is proved to be useful for mirror surface generation and efficient machining.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.53-56
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• 1995

Electrolytic In-Process Dressing grinding technique which enables application of metal bond wheels with fine superabrasives in mirror surface grinding operations has developed. This paper provides charateristic evaluation of power supply supply that we developed and general charateristics of ELID grinding. The electric behaviors are compared each about two different electrode which has 1/4, 1/6 the area of entire wheel surface, and two different fluids which has 1:50, 1:30 the quantity of water was used to dillute grinding fluids. The results show that ELID grinding method is useful for mirror surface machining.

• Proceedings of the KSME Conference
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• 2001.06c
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• pp.71-76
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• 2001

In general, it is known that the wear rate of the abrasive and the removal rate of the metal bond of the grinding wheel should be balanced to maintain the depth of the insulating surface layer to an appropriate level. In order to accomplish, the high quality ELID grinding, therefore, it is necessary to measure the depth of the insulating layer in real-time and then to control the electrolytic conditions to keep the depth to a certain level. In this study, an in-process measurement system of the insulated layer using two gap sensors - a capacitor type and an eddy current type - developed and the change of the status of the insulated layer during ELID grinding is detected. And from the experimental data, we have chosen the best mathematical model to predict the depth of the insulating layer.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.5
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• pp.157-164
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• 2001

The grinding for hard-to-machine materials, such as ceramics, super alloys etc., has proven to be a very difficult and consuming process utilizing ordinary methods. In order to conduct high efficiency machining of such materials, grinding processes using metallic bond diamond wheels and applying electrolytic in-process dressing(ELID) have been attempted on a surface grinding machine. In this study, the effects of grinding parameters, and grit sizes have been evaluated in view of surface roughness, grinding force as well as step difference in simultaneous grinding of different materials. The study and experimental results are presented in this paper.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.660-665
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.