• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.6
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• pp.993-997
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• 2006

This research presented experimental results obtained from the bench test of a 1800cc LPG vehicle, fitted with ECM for fuel supplying controlled system. The comparison study was made with non-ECM-equipped in terms of performances and emission characteristics. CVS-75 emission tests was conducted in order to meet emission regulations.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.5
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• pp.134-140
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• 2015

A control program of an engine control module (ECM) was developed, and its control performance was verified on a 750Ps marine diesel engine. The control method was designed for an engine rotational speed control system. For ECM hardware, the commercial rapid control prototype (RCP) ECM was used. The programming tool for control algorithm development was the MatLab/Simulink. The main control algorithm assembled many control models as engine cranking, run, and stall. Each model has sub-models to input/output control signals. The target engine speed was input signal from a speed control lever, and control output signal of the ECM was sent to the unit-injectors for fuel injection. The engine test was performed under various conditions of engine rotational speeds and dynamometer loads. The test results show that the control function of the ECM is suitable for electrical marine diesel engines.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.1-6
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• 2004

The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the ECM(Engine Control Module) alumina substrate and the intermetallic compound layer between Sn-37wt%Pb solder and pad joints after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, conductor pad roughness were increased from 304 nm to 330 nm. $Cu_6/Sn_5$ formed during initial reflow process at the interface between TiWN/Cu pad and solder grew by the succeeding reflow process, so the grains became coarse. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about 0.1∼0.6 $\mu\textrm{m}$. And a needle-shaped was also observed at the inside of the solder.