• 제목/요약/키워드: E. Chemical vapor deposition

검색결과 226건 처리시간 0.033초

FIB-CVD의 가공 공정 특성 분석 (The Analysis of Chemical Vapor Deposition Characteristics using Focused Ion Beam)

  • 강은구;최병열;홍원표;이석우;최헌종
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.593-597
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    • 2005
  • FIB equipment can perform sputtering and chemical vapor deposition simultaneously. It is very advantageously used to fabricate a micro structure part having 3D shape because the minimum beam size of ${\phi}$ 10nm and smaller is available. Currently FIB is not being applied in the fabrication of this micro part because of some problems to redeposition and charging effect of the substrate causing reduction of accuracy with regards to shape and productivity. Furthermore, the prediction of the material removal rate information should be required but it has been insufficient for micro part fabrication. The paper have the targets that are FIB-CVD characteristic analysis and minimum line pattern resolution achievement fur 3D micro fabrication. We make conclusions with the analysis of the results of the experiment according to beam current, pattern size and scanning parameters. CVD of 8 pico ampere shows superior CVD yield but CVD of 1318 pico ampere shows the pattern sputtered. And dwell time is dominant parameter relating to CVD yield.

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직교배열표를 쓴 remote-PECVD 산화막형성의 공정최적화 및 특성 (Optimization of remote plasma enhanced chemical vapor deposition oxide deposition process using orthogonal array table and properties)

  • 김광호;김제덕;유병곤;구진근;김진근
    • E2M - 전기 전자와 첨단 소재
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    • 제8권2호
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    • pp.171-175
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    • 1995
  • Optimum condition of remote plasma enhanced chemical vapor deposition using orthogonal array method was chosen. Characteristics of oxide films deposited by RPECVD with SiH$_{4}$ and N$_{2}$O gases were investigated. Etching rate of the optimized SiO$_{2}$ films in P-etchant was about 6[A/s] that was almost the same as that the high temperature thermal oxide. The films showed high dielectric breakdown field of more than 7[MV/cm] and a resistivity of 8*10$^{13}$ [.ohmcm] around at 7[MV/cm]. The interface trap density of SiO$_{2}$/Si interface around the midgap derived from the high frequency C-V curve was about 5*10$^{10}$ [/cm$^{2}$eV]. It was observed that the dielectric constant of the optimized SiO$_{2}$ film was 4.29.

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Diethylzinc를 Source로 사용하는 화학증착법(MOCVD)에 의한 ZnO 박막의 제조 및 물성에 관한 연구 (Preparation and Properties of ZnO Thin Films by Metal-Organic Chemical Vapor Deposition Using Diethylzinc Source)

  • 김경준;김광호
    • 한국세라믹학회지
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    • 제28권8호
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    • pp.585-592
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    • 1991
  • ZnO films were deposited onto Corning glass 7059 substrate in the temperature range from $200^{\circ}C$ to $450^{\circ}C$ by chemical vapor deposition technique using the hydrolysis of Diet ylzinc (DEZ). As the deposition temperature increased from $200^{\circ}C$ to $350^{\circ}C$, the deposition rate increased with the apparent activation energy of ∼23kJ/mole. Further increase of the deposition temperature above $400^{\circ}C$, however, resulted in a reduction of the rate. It was found that ZnO film grew with a strong C-axis preferred orientation at the temperature of $400^{\circ}C$. As the deposition temperature increased, the film resistivity decreased down to ∼0.2 $\Omega$cm at $450^{\circ}C$. The electrical resistivity was governed more likely by electron concentration rather than by electron mobility. Average optical transmission of the films in the optical wavelength range of 400 nm to 900 nm was over 90% and the optical energy band gap of 3.28∼3.32 eV was obtained from the direct transition.

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Thermal Chemical Vapor Deposition of Graphene Layers

  • Kwon, Kyoeng-Woo;Do, Woo-Ri;Hwang, Jinha
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.644-644
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    • 2013
  • Graphene is a two-dimensional sp2 layer material. Despite the short history in the empirical synthesis of the graphene layers, the academic/industrial unique features have brought highly significant interest in research and development related to graphene-related materials. In particular, the electrical and optical performances have been targeted towards pre-existing microelectronicand emerging nanoelectronic applications. The graphene synthesis relies on a variety of processing factors, such as temperature, pressure, and gas ratios involving H2, CH4, and Ar, in addition to the inherent selection of copper substrates. The current work places its emphasis on the role of experimental factors in growing graphene thin films. The thermally-grown graphene layers are characterized using physical/chemical analyses, i.e., four point resistance measurements, Raman spectroscopy, and UV-Visible spectrophotometry. Ultimately, an optimization strategy is proposed in growing high-quality graphene layers well-controlled through empirical factors.

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고온벽 화학기상증착법을 이용한 에피 실리콘 증착과 열화학적 해석 (Growth of epitaxial silicon by hot-wall chemical vapor deposition (CVD) technique and its thermochemical analysis)

  • 윤덕선;고욱현;여석기;이홍희;박진호
    • 한국결정성장학회지
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    • 제12권4호
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    • pp.215-221
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    • 2002
  • $SiH_2Cl_2/H_2$ 기체혼합물을 원료로 사용하여 (100) Si 기판 위에 고온벽 화학기상증착법(hot-wall CVD)으로 에피 실리콘을 증착시켰다. 공정변수(증착온도, 반응기 압력, 입력 기체의 조성비($H_2/SiH_2Cl_2$)등)가 실리콘 증착에 미치는 영향을 조사하기 위해 열화학적 전산모사를 수행하였으며, 전산모사를 통해 얻은 공정조건의 범위를 바탕으로 실험한 결과, 전산모사의 결과와 실험이 잘 일치함을 알 수 있었다. 실험을 통해 얻은 최적 증착 조건은 증착온도가 850~$950^{\circ}C$, 반응기 압력은 2~5 Torr, $H_2/SiH_2Cl_2$비는 30~70 정도임을 알 수 있었고, 증착된 에피 실피콘은 두께 및 비저항의 균일도가 우수하고 불순물 함량이 낮은 양질의 박막임을 확인할 수 있었다.

$C_{x}F_{y}$ Polymer Film Deposition in rf and dc $C_{7}F_{16}$ Vapor Plasmas

  • Sakai, Y.;Akazawa, M.;Sakai, Yosuke;Sugawara, H.;Tabata, M.;Lungu, C.P.;Lungu, A.M.
    • Transactions on Electrical and Electronic Materials
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    • 제2권1호
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    • pp.1-6
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    • 2001
  • $C_{x}F_{y}$ polymer film was deposited in rf and dc Fluorinert vapor ($C_{7}F_{16}$) plasmas. In the plasma phase, the spatial distribution of optical emission spectra and the temporal concentration of decomposed species were monitored, and kinetics of the $C_{7}F_{16}$ decomposition process was discussed. Deposition of $C_{x}F_{y}$ film has been tried on substrates of stainless steel, glass, molybdenum and silicon wafers at room temperature in the vapor pressures of 40 and 100 Pa. The films deposited in the rf plasma showed excellent electrical properties as an insulator for multi-layered interconnection of deep-submicron LSI, i.e. the low dielectric constant ∼2.0, the dielectric strength ∼2 MV/cm and the high deposition rate ∼100nm/min at 100W input power.

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The Mg Solid Solution far the P-type Activation of GaN Thin Films Grown by Metal-Organic Chemical Vapor Deposition

  • Kim, KeungJoo;Chung, SangJo
    • Transactions on Electrical and Electronic Materials
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    • 제2권4호
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    • pp.24-29
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    • 2001
  • GaN films were grown for various Mg doping concentrations in metal-organic chemical vapor deposition. Below the Mg concentration of 10$^{19}$ ㎤, the thermally annealed sample shows the compensated phase to n-type GaN in Hall measurement. In the MB concentration of 4$\times$10$^{19}$ ㎤ corresponding to the hole carrier concentration of 2.6$\times$1$^{19}$ ㎤ there exists a photoluminescence center of the donor and the acceptor pair transition of the 3.28-eV band. This center is correlated with the defects for a shallow donor of the $V_{Ga}$ and for an acceptor of $Mg_{Ga}$ . The acceptor level shows the binding energy of 0.2-0.25 eV, which was observed by the photon energy of the photocurrent signal of 3.02-3.31 eV. Above the Mg concentration of 4$\times$10$^{19}$ ㎤, both the Mg doping level and Mg concentration were saturated and there Is a photoluminescence center of a deep donor and an acceptor pair transition of the 2.76-eV blue band.

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유기금속기상증착법에 의한 InGaN/GaN 양자점 구조의 성장거동 (Growth Behavior of InGaN/GaN Quantum Dots Structure Via Metal-organic Chemical Vapor Deposition)

  • 정우광;장재민;최승규;김진열
    • 한국재료학회지
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    • 제18권10호
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    • pp.535-541
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    • 2008
  • Growth behavior of InGaN/GaN self-assembled quantum dots (QDs) was investigated with respect to different growth parameters in low pressure metalorganic chemical vapor deposition. Locally formed examples of three dimensional InGaN islands were confirmed from the surface observation image with increasing indium source ratio and growth time. The InGaN/GaN QDs were formed in Stranski-Krastanow (SK) growth mode by the continuous supply of metalorganic (MO) sources, whereas they were formed in the Volmer-Weber (V-W) growth mode by the periodic interruption of the MO sources. High density InGaN QDs with $1{\sim}2nm$ height and $40{\sim}50nm$ diameter were formed by the S-K growth mode. Dome shape InGaN dots with $200{\sim}400nm$ diameter were formed by the V-W growth mode. InN content in InGaN QDs was estimated to be reduced with the increase of growth temperature. A strong peak between 420-460 nm (2.96-2.70 eV) was observed for the InGaN QDs grown by S-K growth mode in photoluminescence spectrum together with the GaN buffer layer peak at 362.2 nm (3.41 eV).

원격 플라즈마 화학기상 증착법으로 성장된 미세 결정화된 SiGe 박막 형성 (The Formation of Microcrystalline SiGe Film Using a Remote Plasma Enhanced Chemical Vapor Deposition)

  • 김도영
    • 한국전기전자재료학회논문지
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    • 제31권5호
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    • pp.320-323
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    • 2018
  • SiGe thin films were deposited by remote plasma enhanced chemical vapor deposition (RPE-CVD) at $400^{\circ}C$ using $SiH_4$ or $SiCl_4$ and $GeCl_4$ as the source of Si and Ge, respectively. The growth rate and the degree of crystallinity of the fabricated films were characterized by scanning electron microscopy and Raman analysis, respectively. The optical and electrical properties of SiGe films fabricated using $SiCl_4$ and $SiH_4$ source were comparatively studied. SiGe films deposited using $SiCl_4$ source showed a lower growth rate and higher crystallinity than those deposited using $SiH_4$ source. Ultraviolet and visible spectroscopy measurement showed that the optical band gap of SiGe is in the range of 0.88~1.22 eV.

유도결합형 플라즈마 화학기상 증착법을 이용한 탄소나노튜브의 성장 및 전계방출 특성 연구 (A Study on the Growth of Carbon Nanotubes Using ICPCVD and Their Field Emission Properties)

  • 김광식;류호진;장건익
    • 한국전기전자재료학회논문지
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    • 제14권10호
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    • pp.850-854
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    • 2001
  • In this study, carbon nanotubes was vertically grown pm Ni/Cr-deposited glass substrates by Inductively Coupled Plasma Chemical Vapor Deposition. Using Radio-Frequence(RF) plasma below temperature of 600$^{\circ}C$. The grown CNTs shows field emission properties and high quality materials. Turn-on fields and current density showed 5V/${\mu}$m and 1.06${\times}$10$\^$-6/ A/$\textrm{cm}^2$, respectively.

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