• 대한기계학회논문집A
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• 제24권8호
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• pp.2007-2014
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• 2000

It has been reported that the dynamic stress intensity factor for a propagating crack is increasing or decreasing according to the increasement of the crack propagating velocity. It is confirmed in this study that the increasement or decreasement of stress intensity factor with crack growing velocity is accused by loading condition. When the crack propagates under a constant displacement along upper and lower boundary in finite plate, the dynamic stress intensity factor decreases according to the increasement of the propagating crack velocity. When the crack propagates under a constant stress along upper and lower boundary in finite plate, the dynamic stress intensity factor increases according to the increasement of the propagating crack velocity. The increasement or decreasement of stress intensity factor with crack growing velocity is greater in a fast crack propagation velocity than in a slow one.

• Journal of Mechanical Science and Technology
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• 제15권2호
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• pp.172-179
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• 2001

The effects of the interface and two holes located near the crack path in the hybrid specimen on the dynamic crack propagation behavior have been investigated using dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system. The dynamic stress field around the dynamically propagating interface crack tip in the three point bending specimens under a dynamic load applied by a hammer dropped from 0.6m high without initial velocity are recorded. The complex stress intensity factors for the dynamically propagating interface crack are extracted by using a overdeterministic least square method. Theoretical dynamic interface isochromatic fringe loops generated by using the numerically determined complex stress intensity factors are compared with the experimental results. Furthermore, the influence of the hole to the dynamic interface crack velocities has been investigated experimentally.

• 한국자동차공학회논문집
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• 제4권2호
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• pp.69-79
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• 1996

Dynamic stress intensity factors are derives when the crack is propagating with constant velocity under longitudinal shear stress in orthotropic disk plate. General stress fields of crack tip propagating with constant velocity and least square method are used to obtain the dynamic stress intensity factor. The dynamic stress intensity factors of GLV/GTV=1(=isotropic material or transversely isotropic material) which is obtained in out study nearly coincides with Chiang's results when mode Ⅲ stress is applied to boundary of isotropic disk. The D.S.I.F. of mode Ⅲ stress is greater when α(=angle of crack propagation direction with fiber direction) is 90° than that when α is 0°. In case of a/D(a:crack length, D:disk diameter)<0. 58, the faster crack propagation velocity, the less D.S.I.F. but when crack propagation velocity arrive on ghear stress wave velocity, the D.S.I.F. but when crack propagation velocity arrive on shear stress wave velocity, the D.S.I.F. unexpectedly increases and decreases to zero.

• 대한기계학회논문집A
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• 제25권7호
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• pp.1055-1063
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• 2001

When the interfacial crack of isotropic/orthotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for the bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid developed in this research are valid. Separating method of stress components is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 69∼71% of Rayleigh wave velocity of epoxy resin. The near-field stress components of bonded interface of bimaterial are similar with those of pure isotopic material and two dissimilar isotropic bimaterials under static or dynamic loading, but very near-field stress components of bonded interface of bimaterial are different from those.

• 대한기계학회논문집A
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• 제25권3호
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• pp.434-442
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• 2001

When the interfacial crack of two dissimilar isotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid method developed in this research are valid. Separating method of stress component is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 80∼85% (in case of aluminum, 24.3∼25.9%) of Rayleigh wave velocity of epoxy resin. The near-field stress components of crack-tip are similar with those of pure isotropic material under static or dynamic loading, but very near-field stress components of crack-tip are different from those.

• 대한기계학회논문집A
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• 제24권7호
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• pp.1863-1870
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• 2000

When an impact stress is applied on the external boundary of double cantilever beam of orthotropic material which crack length is greater than specimen hight and anistropic ratio is very high, dyna mic energy release rate is derived, and the relationship between dynamic energy release rate and crack propagating velocity is studied. Dynamic energy release rate to static energy release rate is decreased with increasment of crack propagating velocity. The relationships between dynamic energy release rate and vertical strain have a similar pattern with those between static energy release rate and vertical strain. When normalized time(Cstla) is greater than or equal to 2, dynamic energy release rate approaches to a constant value.

• 한국정밀공학회지
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• 제18권2호
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• pp.146-151
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• 2001

The effects of slant interface in the hybrid specimen on the dynamic crack propagation behavior have been investigated using dynamic photoelasticity. The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamic stress field around the dynamically propagating inclined interface crack tip in the three point bending specimens. The dynamic load is applied by a hammer dropped from 0.08m high without initial velocity. The dynamic crack propagation velocities and dynamic stresses field around the interface crack tips are investigated. Theoretical dynamic isochromatic fringe loops are compared with the experimental reults. It is interesting to note that the crack propagating velocity becomes comparable to the Rayleigh wave speed of the soft material of a specimen when slant angle decreases.

• 대한기계학회논문집A
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• 제26권7호
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• pp.1217-1222
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• 2002

The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of the interface crack. This paper investigates the effects of the hole (existed along the path of the crack propagation) shape on the dynamic interface crack propagation behavior by comparing the experimental isochromatic fringes to the theoretical stress fields.

• 대한기계학회논문집A
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• 제27권8호
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• pp.1273-1280
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• 2003

In this paper, transparent dynamic photoelastic experimental hybrid method for propagating cracks in orthotropic material was developed. Using transparent dynamic photoelastic experimental hybrid method, we can obtain stress intensity factor and separate the stress components from only isochromatic fringe patterns without using isoclinics. When crack is propagated with constant velocity, the contours of stress components in the vicinity of crack tip in orthotropic material are similar to those of isotropic material or orthotropic material with stationary crack under the static load. Dynamic stress intensity factors are decreased as crack growths. It was certified that the dynamic photoelastic experimental hybrid method was very useful for the analysis of the dynamic fracture mechanics.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집A
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• pp.292-297
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• 2000

In this research, the dynamic photoelastic experimental hybrid method for bimaterial is introduced. Dynamic biaxial loading device is developed, its strain rate is 31.637 s-1 and its maximum impact load is 20 ton. Manufactured methods for model of the dynamic photoelastic experiment for bimaterial are suggested. They are bonding method(bonding material: AW106, PC-1) and molding method. In the bonding method, residual stress is not occurred in the manufactured bimaterial. Crack is propagated along the interface or sometimes deviated from the interface. While in the molding method, residual stress is occurred in the manufactured bimaterial. Crack is always deviated from the interface and propagated in the epoxy region(softer materila). In order to propagate with constant velocity along the interface of bimaterial with arbitrary stiffer material, edge crack should be located along the interface of the acute angle side of the softer material in the bimaterial.