• 한국재료학회지
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• 제13권4호
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• pp.266-270
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• 2003

We studied BCl$_3$ dry etching of GaAs in a planar inductively coupled plasma system. The investigated process parameters were planar ICP source power, chamber pressure, RIE chuck power and gas flow rate. The ICP source power was varied from 0 to 500 W. Chamber pressure, RIE chuck power and gas flow rate were controlled from 5 to 15 mTorr, 0 to 150 W and 10 to 40 sccm, respectively. We found that a process condition at 20 sccm $BCl_3$ 300 W ICP, 100 W RIE and 7.5 mTorr chamber pressure gave an excellent etch result. The etched GaAs feature depicted extremely smooth surface (RMS roughness < 1 nm), vertical sidewall, relatively fast etch rate (> $3000\AA$/min) and good selectivity to a photoresist (> 3 : 1). XPS study indicated a very clean surface of the material after dry etching of GaAs. We also noticed that our planar ICP source was successfully ignited both with and without RIE chuck power, which was generally not the case with a typical cylindrical ICP source, where assistance of RIE chuck power was required for turning on a plasma and maintaining it. It demonstrated that the planar ICP source could be a very versatile tool for advanced dry etching of damage-sensitive compound semiconductors.

• 한국안광학회지
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• 제9권2호
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• pp.333-343
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• 2004

Impression cytology는 결막상피의 표층을 떼어내기 위해 안구 표면에 cellulose acetate filter 재질을 같이 이용한다. 이 방법은 비 침습적이고 쉽게 시행할 수 있으며 환자에게 최소한의 불편감을 주며 결막표면에 반복해서 시행하여 변화를 관찰하기 위해 사용될 수 있다. 이 방법으로 결막 표면의 형태학적 연구와 squmaous metaplasia의 정도를 평가할 수 있다. 본 연구는 건성안 환자에서 impression cytology를 이용하여 결막표면을 평가하기 위해 수행되었다. 70명의 콘택트렌즈 비착용 학생을 대상으로 조사하였는데 먼저 조사 대상자들에게 McMonnies dry eye symptom questionnaire을 작성하도록 하였다. 그리고 비침습성 tear thinning time(TTT) 검사를 시행하고 다음에 침습성 검사인 Schirmer tear test(SIT), tear film break-up time(TBUT) tests 그리고 Rose-bengal staining올 시행하여 건성안 의심자를 분류하였다. 하 안구결막으로부터 결막 상피세포는 impression cytology기법으로 수집하여 PAS(Periodic Acid Schift)-haematoxylin 염색을 시행하였다. 배상세포와 결막상피세포는 광학현미경 400배에서 관찰하여 squamous metaplasia의 정도에 근거한 Nelson Grading scale에 따라 분류하였는데 이는 배상세포 밀도, 세포의 크기와 형태, 핵:세포질 비 등을 포함한다. 건성안 의심자는 상피세포의 형태적 변화, 핵의 변화, 배상세포 밀도 감소를 보였다. 세포학적 변화 정도는 건성안 조건의 정도에 관련이 있었다. 상피세포 형태를 Nelson의 분류시스템으로 단계를 나눈 결과 대조군의 91.43%가 grade 0 이었고 8.57%가 약간의 이상형태인 grade 1이었다. 반면에 건성안 의심자에서는 20%가 grade 0, 42.86%가 grade 1, 34.29%가 grade 2 그리고 2.86%가 심한 형태적 변화를 보인 grade 3를 나타냈다. Impression cytology는 부작용이나 거부반응이 없는 안구 표면 상피의 비 침습적 또는 최소 침습적 생검법으로 생각되며 안구표면을 포함하는 광범위한 과정을 위한 유용한 진단 기법으로 안전하고 간단하며 건성안 의심자의 다양한 안구 표면 변화의 이해를 증진시키는데 도움을 줄 수 있을 것으로 사료된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.300-303
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• 1999

For the fast dry of the aqueous tape, the process which water was replaced by organic solvent was proposed. So-called, it was the solvent washing dry, Three organic solvents (methanol, ethanol, and acetone) were selected for the washing solvent. The weight loss of the washed tapes was measured to evaluate the dry rate of the tapes and dried tapes were examined the generation of the cracks with the variations of the organic solvent and the washing time. Methanol, ethanol, and acetone were all available organic solvents for this method. The tapes washed in methanol, ethanol, and acetone were dried rapidly for twenty minutes. After thirty minutes, the weight losses were not any more. The solvent of the lower surface tension can decreases the crack of dried tape. If solvent substitutes water completely, though it was fast dried, crack can be eliminated. The tape casting system was designed for the solvent washing dry and prepared. An homogeneous tape was established by continuous tape casting process.

• 대한기계학회논문집
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• 제18권12호
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• pp.3404-3412
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• 1994

The present study was undertaken to investigate the dry wear process and wear mechanism of the alumina ceramics in the purity variation which are used for the mechanical seal, roll, liner and dies. The wear test was carried out under different experimental condition using the wear testing device and in which the annular surface rubbed on dry sliding condition various sliding speed, contact pressure and sliding distance. In case of alumina purity 95%, there was speed range which wear loss increased rapidly owing to enlargement of heat impact force and temperature rise of wear surface. According as the alumina purity increased, wear loss decreased but alumina purity 85% with much void and defect had the most wear loss than any other alumina purity. The friction coefficient of sliding initial stage of wear curves has a large value but according to increase of sliding distance, it decreased owing to drop of the shear strength of wear surfaces.

• Journal of Welding and Joining
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• 제19권5호
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• pp.540-547
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• 2001

This study has evaluated the wear behavior of PTA (Plasma Transferred Arc) Inconel 625 and Stellite 6 overlays on Nimonic 80A substrate. Nimonic 80A alloy was also included for comparison. In order to evaluate the wear performance, three-body abrasive wear test and pin-on-disk dry sliding wear test were performed. Microstructural development during the solidification of deposits is also discussed. Wear test results show that the wear rate of Stellite 6 deposit is lower than that of Inconel 625 deposit and Nimonic 80A. The sliding wear resistance of overlay deposits follows a similar trend to the abrasive wear resistance, but for Nimonic 80A. The main wear mechanisms were abrasive wear for Inconel 625 deposit, adhesive wear and delamination for Stellite 6 deposit in pin-on-disk dry sliding wear test and ploughing in three-body abrasive wear test. Cross sectional examinations of the worn surface of pin specimens after pin-on-disk dry sliding wear test implies that the plastic deformation near worn surface has occurred during the wear testing.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2013년도 춘계학술대회
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• pp.795-797
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• 2013

본 논문에서는 지문센서 칩에서 추출된 건조한 지문이미지의 질을 향상시키기 위한 전하분할 방식의 용량성 회로를 제안하고 있다. 건조지문에서 지문표면의 저항이 크므로 이미지의 질에 저하를 가져온다. 건조지문에서 양질의 이미지를 획득하기 위해 수정된 회로가 제안되어 있고 이 회로는 센서표면에서 전하를 제어하기 위한 부가적인 센서플레이트를 적용하고 있다. 제안된 회로는 0.35마이크론 표준 CMOS 공정에서 검증되었다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 추계학술대회논문집
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• pp.238-244
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• 2004

This research conducted milling tests to study effects of cutting environment conditions of ball end milts on the characteristics of high speed milling cutting process. KP4 steels and STD11 heat treated steels were used as the workpiece and WC-Co ball end mill tools with TiAIN coated were utilized in the cutting tests. Dry cutting without coolant and semidry cutting using botanical oil coolant by the MQL(Minimum Quantity Lubricant) device were conducted. Cutting forces, tool wear and surface roughness were measured in the cutting tests. Results showed that MQL spray cutting of KP4 and hardened STD11 specimens produced better surface quality and wear performance than dry cutting did.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 추계학술대회 논문집
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• pp.180-181
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• 2015

본 논문에서는 ICP Poly Etcher를 이용한 Dry Etch에서 몇가지 공정조건의 변화에 따른 Etching 특성 변화를 연구하였다. 주요 가스유량들이 증가 할 때, Poly-Si 의 Etch rate는 증가 하였으며 Uniformity는 나빠진 것을 확인 할 수 있었고 다른 특성들은 특별한 변화를 보이지 않았다. 주요 Gas인 HBr의 증가는 PR(Photo Resist)와 Uniformity에 영향을 주었다. 이 논문을 통해 HBr의 유량이 Poly-Si Etching에 영향을 주는 결과를 알아 볼 수 있었고 HBr 가스의 유량 증가가 Polymer의 생성에 영향을 줘 Selectivity와 Uniformity를 증가 시킨다는 것도 확인 해 볼 수 있었다.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2008년도 추계학술대회 논문집
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• pp.253-255
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• 2008

This paper gives a basic data of the surface discharge characteristics for epoxy resin in Dry-Air. Used electrodes are needle to plane, sphere to plane and KS M3015 electrodes. With the changing electrodes in same condition, we can obtain different creeping lengthes, breakdown voltages and dielectric strengths, respectively. Dielectric strengths of Needle to plane electrodes are more higher than the others. Breakdown voltage and dielectric strength increase as the thickness of epoxy resin and creeping strength increase.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.417-420
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• 2004

The electrical effects of dry-etch on n-type GaN by an inductively coupled $Cl_2/CH_4/H_2/Ar$ plasma were investigated as a function of ion energy, by means of ohmic and Schottky metallization method. The specific contact resistivity(${\rho}_c$) of ohmic contact was decreased, while the leakage current in Schottky diode was increased with increasing ion energy due to the preferential sputtering of nitrogen. At a higher rf power, an additional effect of damage was found on the etched sample, which was sensitive to the dopant concentration in terms of the ${\rho}_c$ of ohmic contact. This was attributed to the effects such as the formation of deep acceptor as well as the electron-enriched surface layer within the depletion layer. Furthermore, thermal annealing process enhanced the ohmic and Schottky property of heavily damaged surface.