• 한국생산제조학회지
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• 제24권1호
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• pp.117-123
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• 2015

The need for drop simulations for board-leveled flip chips in micro-system packaging has been increasing. There have been many studies on flip chips with various solder ball compositions. However, studies on flip chips with Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu have rarely been attempted because of the unknown material properties. According to recent studies, drop simulations with these solder ball compositions have proven feasible. In this study, predictions of the impact lifetime by drop simulations are performed considering Cu and Cu/Ni UBMs using LS-DYNA to alter the design parameters of the flip chips, such as thickness of the flip chip and size of the solder ball. It was found that a smaller chip thickness, larger solder ball diameter, and using the Cu/Ni UBM can improve the drop lifetime of solder balls.

• Nuclear Engineering and Technology
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• 제56권3호
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• pp.916-921
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• 2024

The control rod worth sensitivity to the neutron detector position in the rod drop experiment is studied by the time-dependent Monte Carlo (TDMC) neutron transport calculations for AGN-201K educational reactor and the Kyoto University Critical Assembly. The TDMC simulations of the rod drop experiments are conducted by the Seoul National University Monte Carlo (MC) code, McCARD, yielding time-dependent neutron densities at detector positions. The detector-position-dependent results of the total control rod worth calculated by the extrapolation, the integral counting, and the inverse methods are compared with the numerical reference using the MC eigenvalue calculations and the experimental results. From these comparisons, it is observed that the total control rod worth can be estimated with a considerable difference depending on the detector position through the rod drop experiment. The proposed TDMC simulation of the rod drop experiment can be applied for searching a better detector position or quantifying a bias for the control rod worth measurement.

• 한국생산제조학회지
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• 제23권3호
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• pp.237-242
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• 2014

Recently much research are has been done into the compositions of lead-free solders. As a result, there has been a rapid increase in the number of new compositions. In the past, the properties of these new compositions were determined and verified through drop-impact tests. However, these drop tests were expensive and it took a long time to obtain a result. The main goal of this study was to establish an analytical method capable of predicting the impact life-time of a new solder composition for board-level flip chips though the application of drop simulations using LS-DYNA. Based on the reaction load obtain with LS-DYNA, the drop-impact fracture cycles were predicted. The study was performed using a Sn-3.0Ag-0.5Cu solder (305 composition). To verify the reliability of the proposed analytical method, the results of the drop-impact tests and life-time analysis were compared, and were found to be in good agreement. Thus, the new analytical method was shown to be very useful and effective.

• 한국생산제조학회지
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• 제20권2호
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• pp.193-201
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• 2011

Recently, mechanical reliabilities including a drop test have been a hot issue. In this paper, solder balls with new components which are Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu-0.05N are introduced, and board level drop test for them are conducted under JEDEC standard in which the board with 15 flip chips is dropped as 1,500g acceleration during 0.5ms. The drop simulations are studied by using a implicit method in the ANSYS LS-DYNA, and modal analysis is made. Through both analyses, the solder balls with new components are evaluated under the drop. It is found that the maximum stress of each chip is occurred between the solder ball and the PCB, and the highest value among the maximum stresses in the chips is occurred on the chip nearest to fixed holes on the board in the drop tests and simulations.

• 한국생산제조학회지
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• 제21권2호
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• pp.225-231
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• 2012

Drop simulations of the board level in the flip chips with solder joints have been highlighted for years, recently. Also, through the study on the life prediction of thermal fatigue in the flip chips considering underfill, its importance has been issued greatly. In this paper, dynamic analysis using the implicit method in the Finite Element Analysis (FEA) is carried out to assess the factors effecting on flip chips considering underfill. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard is modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. Modal analysis is simulated to find out the relation between drop impact and vibration of the board system.

• Korea-Australia Rheology Journal
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• 제18권2호
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• pp.41-49
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• 2006

A modified Volume-of-Fluid (VOF) numerical method is used to predict the dynamics of a liquid drop of a low viscosity dilute polymer solution, forming in air from a circular nozzle. Viscoelastic effects are rep-resented using an Oldroyd-B model. Predicted drop shapes are compared with experimental observations. The main features, including the timing of the shape evolution and the 'bead-on-a-string' effect, are well reproduced by the simulations. The results confirm published conclusions of the third author, that the deformation is effectively Newtonian until near the time of Newtonian pinch-off and that the elastic stress becomes large in the pinch region due to the higher extensional flow there.

• Nuclear Engineering and Technology
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• 제53권8호
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• pp.2682-2695
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• 2021

This paper aims to evaluate the structural dynamic responses and damage/failure of the nuclear fuel reprocessing plant under the free drop impact of spent fuel cask (SFC) and fuel assembly (FA) during the on-site transportation. At the present Part I of this paper, the large-scale SFC model free drop test and the corresponding numerical simulations are performed. Firstly, a composite target which is composed of the protective structure, i.e., a thin RC plate (representing the inverted U-shaped slab in the loading shaft) and/or an autoclaved aerated concrete (AAC) blocks sacrificial layer, as well as a thick RC plate (representing the bottom slab in the loading shaft) is designed and fabricated. Then, based on the large dropping tower, the free drop test of large-scale SFC model with the mass of 3 t is carried out from the height of 7 m-11 m. It indicates that the bottom slab in the loading shaft could not resist the free drop impact of SFC. The composite protective structure can effectively reduce the damage and vibrations of the bottom slab, and the inverted U-shaped slab could relieve the damage of the AAC blocks layer dramatically. Furthermore, based on the finite element (FE) program LS-DYNA, the corresponding refined numerical simulations are performed. By comparing the experimental and numerical damage and vibration accelerations of the composite structures, the present adopted numerical algorithms, constitutive models and parameters are validated, which will be applied in the further assessment of drop impact effects of full-scale SFC and FA on prototype nuclear fuel reprocessing plant in the next Part II of this paper.

• Advances in Computational Design
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• 제5권2호
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• pp.111-125
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• 2020

The flow behavior of polymer melts within a slit die is an important consideration when designing a die geometry. The quality of the extruded polymer product can be determined through an evaluation of the flow homogeneity, wall shear rate and pressure drop across the central height of the die. However, mathematical formulations cannot fully determine the behavior of the flow due to the complex nature of fluid dynamics and the nonlinear physical properties of the polymer melts. This paper examines two slit die geometries in terms of outlet velocity uniformity, shear rate uniformity at the walls and pressure drop by using the licensed computational fluid dynamics package, Ansys POLYFLOW, based on the finite element method. The Carreau-Yasuda viscosity model was used for the rheological properties of the polypropylene. Comparative analysis of the simulation results will conclude that the modified die design performs better in all three aspects providing uniform exit velocity, uniform wall shear rates, and lower pressure drop.

• 디지털산업정보학회논문지
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• 제8권2호
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• pp.81-94
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• 2012

This paper suggests PARED algorithm, a modified RED algorithm, that actively reacts to dynamic changes in network to apply packet drop probability flexibly. The main idea of PARED algorithm is that it compares the target queue length to the average queue length which is the criterion of changes in packet drop probability and feeds the gap into packet drop probability. That is, when the difference between the average queue length and the target queue length is great, it reflects as much as the difference in packet drop probability, and reflects little when the difference is little. By doing so, packet drop probability could be actively controled and effectively dealt with in the network traffic situation. To evaluate the performance of the suggested algorithm, we conducted simulations by changing network traffic into a dynamic stat. At the experiments, the suggested algorithm was compared to the existing RED one and then to ARED one that provided the basic idea for this algorithm. The results proved that the suggested PARED algorithm is superior to the existing algorithms.

• 한국수소및신에너지학회논문집
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• 제34권5호
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• pp.497-504
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• 2023

This study analyzes pressure distribution and pressure drop in the receptacle used in charging system of hydrogen fuel cell vehicles. The objective is to minimize receptacle-induced pressure drop by redesigning internal flow channels. Through numerical simulations, three receptacle variants are compared with a baseline case. Results show reduced pressure drop in the filter section. However, the check valve section exhibits higher pressure drop, requiring further improvement. By increasing throat diameter, pressure drop is decreased by 28% between inlet and outlet of the receptacle. This study shows the relationship between dynamic pressure and pressure drop, providing a guideline for receptacle performance optimization. The redesigned receptacle offers potential for enhancing hydrogen charging efficiency.