• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.3
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• pp.237-242
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• 2014

Recently much research are has been done into the compositions of lead-free solders. As a result, there has been a rapid increase in the number of new compositions. In the past, the properties of these new compositions were determined and verified through drop-impact tests. However, these drop tests were expensive and it took a long time to obtain a result. The main goal of this study was to establish an analytical method capable of predicting the impact life-time of a new solder composition for board-level flip chips though the application of drop simulations using LS-DYNA. Based on the reaction load obtain with LS-DYNA, the drop-impact fracture cycles were predicted. The study was performed using a Sn-3.0Ag-0.5Cu solder (305 composition). To verify the reliability of the proposed analytical method, the results of the drop-impact tests and life-time analysis were compared, and were found to be in good agreement. Thus, the new analytical method was shown to be very useful and effective.

• Transactions of the Society of Information Storage Systems
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• v.9 no.2
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• pp.56-61
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• 2013

The recent increased use of mobile phone has resulted in a technical focusing on reliability issues related to drop performance. Since mobile phone may be dropped several times during their use, it is required to survive common drop accidents. The plastic injection parts such as base stopper and carrier in the encoder type actuator can be broken easily in the actual reliability test of 1.5m free drop. So, we analyzed the shock resistance characteristics of auto focus actuator with variables in the material properties using finite element method. By applying the new resin materials, we can decrease the breakage of plastic injection parts and improve the reliability of mobile phone.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.33-38
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• 2009

The use of portable devices has created the need for new reliability criterion of drop impact tests because of the tendency to accidentally drop in the use of these devices. The effects of different PCB surface finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) and high temperature storage (HTS) test on the drop reliability were studied. Various drop test conditions were used to evaluate a drop reliability of assemblies to endure such impact and shock load. In the case of the as-reflowed samples (no HTS test), the SAC/OSP boards exhibited a better drop impact reliability than that of SAC/ENIG. However, the reverse was true if HTS test is performed. In addition, significant decrease of drop reliability was observed for both SAC/ENIG and SAC/OSP assemblies after HTS test. It was also observed that the thickness of intermetallic compound layer do play an important role in the brittle fracture of drop test.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.35-41
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• 2011

Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.65-69
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• 2010

In this study, we investigated the effects of UBM(Under Bump Metallization) and solder composition on the drop impact reliability of wafer level packaging. Fan-in type WLP chips were prepared with different solder ball composition (Sn3.0Ag0.5Cu, and Sn1.0Ag0.5Cu) and UBM (Cu 10 ${\mu}m$, Cu 5 ${\mu}m$\Ni 3 ${\mu}m$). Drop test was performed up to 200 cycles with 1500G acceleration according to JESD22-B111. Cu\Ni UBM showed better drop performance than Cu UBM, which could be attributed to suppression of IMC formation by Ni diffusion barrier. SAC105 was slightly better than SAC305 in terms of MTTF. Drop failure occurred at board side for Cu UBM and chip side for Cu\Ni UBM, independent of solder composition. Corner and center chip position on the board were found to have the shortest drop lifetime due to stress waves generated from impact.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.20 no.2
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• pp.133-149
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• 2022

The design of a wooden impact limiter equipped to a transportation cask for radioactive materials was optimized. According to International Atomic Energy Agency Safety Standards, 9 m drop tests should be performed on the transportation cask to evaluate its structural integrity in a hypothetical accident condition. For impact resistance, the size of the impact limiter should be properly determined for the impact limiter to absorb the impact energy and reduce the impact force. Therefore, the design parameters of the impact limiter were optimized to obtain a feasible optimal design. The design feasibility criteria were investigated, and several objectives were defined to obtain various design solutions. Furthermore, a probabilistic approach was introduced considering the uncertainties included in an engineering system. The uncertainty of material properties was assumed to be a random variable, and the probabilistic feasibility, based on the stochastic approach, was evaluated using reliability. Monte Carlo simulation was used to calculate the reliability to ensure a proper safety margin under the influence of uncertainties. The proposed methodology can provide a useful approach for the preliminary design of the impact limiter prior to the detailed design stage.

• Journal of Power System Engineering
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• v.13 no.3
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• pp.53-58
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• 2009

The importance of cost reduction has grown bigger to ensure the competetive power of products in the electric home appliances industry. Thus, it is necessary to assess the reliability due to drop-impact happenning in process of distribution of microwave ovens with the panel and cavity of thinner thickness for cost reduction. In the present study, the drop/impact simulation using the explicit code LS-DYNA3D has been carried out for improving the impact resistance of a microwave oven. This CAE-based design approach can be successfully applied to enhance the deteriorated dynamic behavior under the impact conditions of dropping height 70cm according to ISTA procedure 2A.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.49-53
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• 2022

Ultra-thin glass (UTG) has been widely used in foldable display as a cover window for the protection of display and has a great potential for rollable display and various flexible electronics. The foldable display is under impact loading by bending and touch pen and exposed to other external impact loads such as drop while people are using it. These external impact loads can cause cracks or fracture to UTG because it is very thin under 100 ㎛ as well as brittle. Cracking and fracture lead to severe reliability problems for foldable smartphone. Thus, this study constructs finite element analysis (FEA) model for the pen drop test which can measure the impact resistance of UTG and conducts mechanical modeling to improve the reliability of UTG under impact loading. When a protective layer is placed to an upper layer or lower layer of UTG layer, stress mechanism which is applied to the UTG layer by pen drop is analyzed and an optimized structure is suggested for reliability improvement of UTG layer. Furthermore, maximum principal stress values applied at the UTG layer are analyzed according to pen drop height to obtain maximum pen drop height based on the strength of UTG.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.11-17
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• 2009

The drop impact reliability comes to be important for evaluation of the life time of mobile electronic products such as cellular phone. The drop impact reliability of solder joint is generally affected by the kinds of pad and reflow number, therefore, the reliability evaluation is needed. Drop impact test proposed by JEDEC has been used as a standard method, however, which requires high cost and long time. The drop impact reliability can be indirectly evaluated by using high speed shear test of solder joints. Solder joints formed on 3 kinds of surface finishes OSP (Organic Solderability Preservation), ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) was investigated. The shear strength was analysed with the morphology change of intermetallic compound (IMC) layer according to reflow number. The layer thickness of IMC was increased with the increase of reflow number, which resulted in the decrease of the high speed shear strength and impact energy. The order of the high speed shear strength and impact energy was ENEPIG > ENIG > OSP after the 1st reflow, and ENEPIG > OSP > ENIG after 8th reflow.