• 한국생산제조학회지
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• 제23권3호
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• pp.237-242
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• 2014

Recently much research are has been done into the compositions of lead-free solders. As a result, there has been a rapid increase in the number of new compositions. In the past, the properties of these new compositions were determined and verified through drop-impact tests. However, these drop tests were expensive and it took a long time to obtain a result. The main goal of this study was to establish an analytical method capable of predicting the impact life-time of a new solder composition for board-level flip chips though the application of drop simulations using LS-DYNA. Based on the reaction load obtain with LS-DYNA, the drop-impact fracture cycles were predicted. The study was performed using a Sn-3.0Ag-0.5Cu solder (305 composition). To verify the reliability of the proposed analytical method, the results of the drop-impact tests and life-time analysis were compared, and were found to be in good agreement. Thus, the new analytical method was shown to be very useful and effective.

• 정보저장시스템학회논문집
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• 제9권2호
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• pp.56-61
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• 2013

The recent increased use of mobile phone has resulted in a technical focusing on reliability issues related to drop performance. Since mobile phone may be dropped several times during their use, it is required to survive common drop accidents. The plastic injection parts such as base stopper and carrier in the encoder type actuator can be broken easily in the actual reliability test of 1.5m free drop. So, we analyzed the shock resistance characteristics of auto focus actuator with variables in the material properties using finite element method. By applying the new resin materials, we can decrease the breakage of plastic injection parts and improve the reliability of mobile phone.

• 마이크로전자및패키징학회지
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• 제16권1호
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• pp.33-38
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• 2009

전자 기기 제품들이 소형화 및 휴대화 되면서 낙하충격 신뢰성에 대한 관심이 높아지고 있다. 본 연구에서는 대표적인 무연솔더인 Sn-3.0Ag-0.5Cu 솔더를 이용하여 ENIG (Electroless Nickel Iimmersion Gold), OSP (Organic Solderability Preservative) 표면 처리와 등온 시효 시험 (High Temperature Storage test)에 따른 보드 레벨 패키지 (board level package)의 낙하충격 신뢰성 (drop reliability) 시험을 수행하였다. 또한 충격 조건을 변화시켜 시편에 가해지는 가속도 (G:acceleration)와 충격 지속 시간 (pulse duration)에 따른 신뢰성을 평가하였다. 기판의 strain측정 결과 중앙 부위가 가장 응력이 컸으며, 충격가속도에 비례하여 응력이 증가하였다. 시효 처리 전에는 OSP처리된 기판이 다소 우수한 신뢰성을 보였지만, 시효 처리후에는 ENIG기판에서 신뢰성이 우수하였고, 반대로 OSP는 감소하는 경향을 보였다. OSP의 경우 과도한 금속간화합물 (intermetallic compound)의 성장으로 인해 접합 계면에서 취성파괴 (brittle fracture)가 일어난 것을 관찰할 수 있었다.

• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.35-41
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• 2011

Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

• 마이크로전자및패키징학회지
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• 제17권3호
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• pp.65-69
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• 2010

In this study, we investigated the effects of UBM(Under Bump Metallization) and solder composition on the drop impact reliability of wafer level packaging. Fan-in type WLP chips were prepared with different solder ball composition (Sn3.0Ag0.5Cu, and Sn1.0Ag0.5Cu) and UBM (Cu 10 ${\mu}m$, Cu 5 ${\mu}m$\Ni 3 ${\mu}m$). Drop test was performed up to 200 cycles with 1500G acceleration according to JESD22-B111. Cu\Ni UBM showed better drop performance than Cu UBM, which could be attributed to suppression of IMC formation by Ni diffusion barrier. SAC105 was slightly better than SAC305 in terms of MTTF. Drop failure occurred at board side for Cu UBM and chip side for Cu\Ni UBM, independent of solder composition. Corner and center chip position on the board were found to have the shortest drop lifetime due to stress waves generated from impact.

• 방사성폐기물학회지
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• 제20권2호
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• pp.133-149
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• 2022

The design of a wooden impact limiter equipped to a transportation cask for radioactive materials was optimized. According to International Atomic Energy Agency Safety Standards, 9 m drop tests should be performed on the transportation cask to evaluate its structural integrity in a hypothetical accident condition. For impact resistance, the size of the impact limiter should be properly determined for the impact limiter to absorb the impact energy and reduce the impact force. Therefore, the design parameters of the impact limiter were optimized to obtain a feasible optimal design. The design feasibility criteria were investigated, and several objectives were defined to obtain various design solutions. Furthermore, a probabilistic approach was introduced considering the uncertainties included in an engineering system. The uncertainty of material properties was assumed to be a random variable, and the probabilistic feasibility, based on the stochastic approach, was evaluated using reliability. Monte Carlo simulation was used to calculate the reliability to ensure a proper safety margin under the influence of uncertainties. The proposed methodology can provide a useful approach for the preliminary design of the impact limiter prior to the detailed design stage.

• 동력기계공학회지
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• 제13권3호
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• pp.53-58
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• 2009

The importance of cost reduction has grown bigger to ensure the competetive power of products in the electric home appliances industry. Thus, it is necessary to assess the reliability due to drop-impact happenning in process of distribution of microwave ovens with the panel and cavity of thinner thickness for cost reduction. In the present study, the drop/impact simulation using the explicit code LS-DYNA3D has been carried out for improving the impact resistance of a microwave oven. This CAE-based design approach can be successfully applied to enhance the deteriorated dynamic behavior under the impact conditions of dropping height 70cm according to ISTA procedure 2A.

• 한국생산제조학회지
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• 제20권5호
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• 마이크로전자및패키징학회지
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• 제29권3호
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• pp.49-53
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• 2022

초박형 유리(Ultra-Thin Glass, UTG)는 디스플레이 보호용 커버 윈도우로 폴더블(foldable) 디스플레이에 사용되고 있으며, 향후에는 롤러블(rollable) 디스플레이나 다양한 플렉시블(flexible) 전자기기에 확대 적용될 것으로 예상되고 있다. 폴더블 디스플레이의 경우, 사용자들에 의해 굽힘과 터치 펜에 의해 충격을 받게 되고, 이 외에도 낙하 등 다른 외부충격에 쉽게 노출되어 있다. 초박형 유리는 100 ㎛ 이하로 두께가 얇고 취성하여 여러 외부 충격에 의해 쉽게 균열이나 파단이 발생할 수 있고, 이러한 균열이나 파단은 폴더블 디스플레이에 심각한 신뢰성 문제를 야기한다. 따라서, 본 연구에서는 초박형 유리의 내충격 신뢰성을 평가하는 펜 낙하 실험을 유한 요소 모델로 구성하고, 초박형 유리의 내충격 신뢰성을 향상시키기 위한 기계적 모델링을 진행하였다. 초박형 유리층 상부 혹은 하부에 보강층을 삽입했을 때, 펜 낙하에 의해 초박형 유리층에 작용하는 응력 메커니즘을 분석하였고, 그에 따라 신뢰성 향상을 위한 최적의 구조를 제시하였다. 또한 초박형 유리의 강도에 따른 최대 펜 낙하 높이를 예측할 수 있도록 펜 낙하 높이에 따라 초박형 유리층에 작용하는 최대 주 응력 값을 분석하였다.

• 마이크로전자및패키징학회지
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• 제16권3호
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• pp.11-17
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• 2009

휴대폰 및 휴대기기의 낙하 충격에 대한 관심이 증가되고 있는 상황에서 솔더 볼 접합부의 낙하 충격특성은 패드의 종류와 리플로우 횟수에 영향을 받게 되어 이에 따른 신뢰성 평가가 요구된다. 이와 관련한 평 가법으로 일반적으로는 JEDEC에서 제정한 낙하충격 시험법을 사용하고 있으나 이 방법은 고 비용과 장시간이 소모되는 문제가 있어 본 연구에서는 낙하충격 특성을 간접적으로 평가하는 시험항목인 고속 전단시험을 실시하여 리플로우 횟수에 의해 성장하는 금속간 화합물 층과 OSP(Organic Solderability Preservative), ENIG(Electroless Nickel Immersion Gold) 및 ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold) 등 표면처리에 따른 고속 전단특성을 비교, 분석하였다. 그 결과 리플로우 횟수가 증가함에 따라 IMC 층의 성장으로 고속 전단강도와 충격 에너지 값은 점차 감소하였다. 리플로우 횟수가 1회일 때는 ENEPIG, ENIG, OSP 순으로 고속 전단강도와 충격 에너지 값이 높았고 8회일 때는 ENEPIG, OSP, ENIG 순으로 충격 에너지 값이 높게 측정되었다.