• Title/Summary/Keyword: Double printing

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Screen Printing Electrode Formation Process for Crystalline Silicon Solar Cell (결정질 실리콘 태양전지용 스크린 프린팅 전극 공정 개발)

  • Eom, Taewoo;Lee, Sang Hyeop;Song, Chan Moon;Park, Sang Yong;Lim, Donggun
    • Current Photovoltaic Research
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    • v.5 no.1
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    • pp.9-14
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    • 2017
  • The screen printing technique is one of process to form electrode for crystalline silicon solar cell and has been studied a lot, because it has many advantages such as low price, high efficiency and mass production due to simple and fast process. The reason why electrode formation is important is for influence of series resistance and amount of incident light in crystalline silicon solar cell. In this study, electrode was formed by screen printing method with various conditions like squeegee angle, printing speed, snap off, printing pressure. After optimizing various conditions, double printing method was applied to obtain low series resistance and high aspect ratio. As a result, we obtained electrode resistance 45.31 ohm, aspect ratio 4.38, shading loss 7.549% mono-crystalline silicon solar cell with optimal double screen printing condition.

The Screen Printing using Double Layer Screen Plate (이중층 스크린 인쇄판을 사용한 스크린 인쇄)

  • Kang, Young-Reep;Jung, Gi-Young
    • Journal of the Korean Graphic Arts Communication Society
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    • v.28 no.2
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    • pp.57-67
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    • 2010
  • The double layer screen plate tensioned with two sheets screen mesh is more thicker than that of one screen sheet. The double layer screen plate piled up with two sheets screen 200# or overlapped with a sheet screen 110# and a sheet screen 305# is more thicker than single layer screen plate with one sheet screen 420#. As the screen plate composed of two sheets screen has more accumulated ink capacity than one sheet of screen, printing printed with it has a good plasticity. And the single layer screen plate that accumulate a small quantity of ink has an excellent representation than the double layer screen plate but lower plasticity.

A study on the $ALU^+$ crystalline solar cell characteristics affected by counts of rear side screen printings ($ALU^+$를 이용한 결정질 태양전지 후면 전극 Screen Printing 횟수에 따른 특성)

  • Choi, Jaewoo;Kim, Hyunyup;Yi, Junsin
    • 한국신재생에너지학회:학술대회논문집
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    • 2011.05a
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    • pp.123.1-123.1
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    • 2011
  • 기존의 p-type 태양전지 공정과 유사한 공정으로 제작되는 n-type $ALU^+$태양전지는 후면에 Al을 screen printing하여 emitter층을 형성한 구조이다. screen printing은 공정의 단순화와 제조 단가의 저비용으로 인해, metalization 공정에서 많이 쓰이고 있다. 본 연구에서는 양산 가능한 n-type $ALU^+$태양전지 제작을 위해, 후면 Al emitter 층을 single, dobule, triple로 변경하며 Al의 양을 가변하였고, 그에 따른 특성의 변화를 연구하였다. screen printing 횟수가 변경된 후면 Al emitter 층의 특성은 DIV와 LIV 측정을 통해 분석하였다. 실험 결과 Al을 single printing 하였을 때보다, double, triple printing을 통하여 Al의 양을 증가하였을 때, DIV 데이터에서 직렬저항(Rs)가 $24.44{\Omega}/cm^2$에서 $0.31{\Omega}/cm^2$으로 감소하였고, 단락전류(Jsc)는 1.26mA/$cm^2$에서 37.7mA/$cm^2$으로 약 300% 증가한 것을 확인할 수 있었다. 프린팅 횟수에 따른 LIV 데이터의 Fill Factor를 분석하게 되면, double printing이 64.35%로 54.75%의 triple printing보다 약 1.17배 더 향상된 것으로 확인하였다. 이러한 결과를 바탕으로 후면 Al emitter 형성시에 Al의 양이 적절하지 못한 이유로, Al emitter가 제대로 형성되지 못하거나 과하게 형성되면, 태양전지 내부에 누설 저항의 변화와 누설 전류의 증가로 인해, 단락전류(Jsc)와 Fill Factor 감소의 주요 원인이 된다는 것을 확인할 수 있었다.

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The Thickness of a Sensitive Emulsion on the Double Layer Screen Plate (이중층 스크린 인쇄판에 도포된 감광유제의 두께)

  • Jung, Gi-Young;Kang, Young-Reep
    • Journal of the Korean Graphic Arts Communication Society
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    • v.29 no.3
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    • pp.125-132
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    • 2011
  • Is very simple in tension work of screen mesh for effective printing if worker uses screen mesh of player who desire at screen print process. General method is methods that use mesh of player who want on screen frame as screen plate because tensioned. The single layer screen plate was made from one sheet screen mesh and the double layer screen plate was made from two sheets screen mesh overlapped. The thickness of sensitive emulsion applied to double layer screen plate is more thicker than two time s of thickness of emulsion applied to single layer screen plate. It seems that the sensitive emulsion inserted between an upper layer and a lower layer of double layer screen mesh.

Reduce on the Cost of Photovoltaic Power Generation for Polycrystalline Silicon Solar Cells by Double Printing of Ag/Cu Front Contact Layer

  • Peng, Zhuoyin;Liu, Zhou;Chen, Jianlin;Liao, Lida;Chen, Jian;Li, Cong;Li, Wei
    • Electronic Materials Letters
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    • v.14 no.6
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    • pp.718-724
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    • 2018
  • With the development of photovoltaic industry, the cost of photovoltaic power generation has become the significant issue. And the metallization process has decided the cost of original materials and photovoltaic efficiency of the solar cells. Nowadays, double printing process has been introduced instead of one-step printing process for front contact of polycrystalline silicon solar cells, which can effectively improve the photovoltaic conversion efficiency of silicon solar cells. Here, the relative cheap Cu paste has replaced the expensive Ag paste to form Ag/Cu composite front contact of silicon solar cells. The photovoltaic performance and the cost of photovoltaic power generation have been investigated. With the optimization on structure and height of Cu finger layer for Ag/Cu composite double-printed front contact, the silicon solar cells have exhibited a photovoltaic conversion efficiency of 18.41%, which has reduced 3.42 cent per Watt for the cost of photovoltaic power generation.

Paper-Based Pattern Switchable Antenna Using Inkjet-Printing Technology (잉크젯 프린팅 기술을 이용한 종이 기반의 방사패턴 가변 안테나)

  • Eom, Seung Hyun;Lim, Sungjoon
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.26 no.7
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    • pp.613-619
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    • 2015
  • In this paper, we proposed a paper-based pattern-switchable antenna using inkjet-printing technology. The proposed antenna is composed of two bow-tie antennas and a switching network. The bow-tie antennas are inkjet-printed on paper using a low cost home printer. The switching network is built on a printed-circuit-board(PCB) and consists of a single-pole-double-throw(SPDT) switch and balun element. A double-sided parallel-strip line(DSPSL) can convert the unbalanced microstrip mode to the balanced strip mode. Two bow-tie antennas have different radiation patterns because of the different orientation of the reflectors. It is demonstrated from EM simulation and measurement that the radiation patterns of the proposed antenna are successfully switched by the SPDT.

Enhancement of Light Extraction in White LED by Double Molding (이중 몰딩에 의한 백색 LED의 광추출 효율 향상)

  • Jang, Min-Suk;Kim, Wan-Ho;Kang, Young-Rea;Kim, Ki-Hyun;Song, Sang-Bin;Kim, Jin-Hyuk;Kim, Jae-Pil
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.10
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    • pp.849-856
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    • 2012
  • Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.

HV-SoP Technology for Maskless Fine-Pitch Bumping Process

  • Son, Jihye;Eom, Yong-Sung;Choi, Kwang-Seong;Lee, Haksun;Bae, Hyun-Cheol;Lee, Jin-Ho
    • ETRI Journal
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    • v.37 no.3
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    • pp.523-532
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    • 2015
  • Recently, we have witnessed the gradual miniaturization of electronic devices. In miniaturized devices, flip-chip bonding has become a necessity over other bonding methods. For the electrical connections in miniaturized devices, fine-pitch solder bumping has been widely studied. In this study, high-volume solder-on-pad (HV-SoP) technology was developed using a novel maskless printing method. For the new SoP process, we used a special material called a solder bump maker (SBM). Using an SBM, which consists of resin and solder powder, uniform bumps can easily be made without a mask. To optimize the height of solder bumps, various conditions such as the mask design, oxygen concentration, and processing method are controlled. In this study, a double printing method, which is a modification of a general single printing method, is suggested. The average, maximum, and minimum obtained heights of solder bumps are $28.3{\mu}m$, $31.7{\mu}m$, and $26.3{\mu}m$, respectively. It is expected that the HV-SoP process will reduce the costs for solder bumping and will be used for electrical interconnections in fine-pitch flip-chip bonding.

Fabrication of Double Textured Selective Emitter Si Solar Cell Usning Electroless Etching Process (이중 텍스쳐 구조를 적용한 선택적 에미터 태양전지의 특성 분석)

  • Kim, Changheon;Lee, Jonghwan;Lim, Sangwoo;Jeong, Chaehwan
    • Current Photovoltaic Research
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    • v.2 no.3
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    • pp.130-134
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    • 2014
  • We have fabricated the selective emitter solar cell using double textured nanowires structure. The $40{\times}40mm2$-sized silicon substrates were textured to form the pyramid-shaped surface and the nanowires were fabricated by metal assisted chemical etching process using Ag nanoparticles, subsequently. The heavily doped and shallow emitters for selectiv eemitter solar cells were prepared through the thermal $POCl_3$ diffusion and chemical etch-back process, respectively. The front and rear electrodes were prepared following conventional screen printing method and the widths of fingers have been optimized. The selective emitter solar cell using double textured nanowires structure achieved a conversion efficiency of 17.9% with improved absorption and short circuit current density.

Effect of Substrate Porosity on Double Coating Structure (기질의 공극성의 이중 도공 구조에 미치는 영향)

  • 김병수;박중열;정현찬
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.30 no.4
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    • pp.79-84
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    • 1998
  • The process of double coating consists of bottom coating using relatively coaser pigments to improve characteristics of base paper and top coating using finer pigments to cover unevenness of the bottom coating and to give various function of the coated paper. The structure of precoating is influenced not only by its components, but also characteristics of base paper, Moreover pore size and its size distribution of precoating are expected to influence the top coating properties, but this is not well understood. Coating and printing operations involve the application of pigmented fluid on top of a porous substrate. The porosity of the substrate has been shown to influence the properties of the coating, but a good understanding of the mechanisms is lacking in the literature. The role of pore size and void volume on top coating structure is unclear.

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