• 한국광학회지
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• 제14권4호
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• pp.359-364
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• 2003

편광에 따른 성능 변화가 작은 deep-ridge 도파관 구조에 제작이 용이한 double-sided 프로세스를 이용하여 구현할 수 있는 편광에 무관한 매우 짧은 결합 길이를 가지는 double-sided deep-ridge 도파관 구조를 가지는 새로운 수직 방향성 결합기를 제안하고 여러 가지 구조 파라미터들이 결합길이에 미치는 영향에 대하여 연구하였다. 도파관 폭의 변화에 대한 결합길이의 변화는 코어 두께의 변화에 대한 결합길이의 변화보다 작게 나타나는 것을 볼 수 있었다. 내부 클래딩 영역의 두께가 감소할수록, 코어 두께가 감소할수록 결합 길이가 감소함을 볼 수 있었다. 또한 같은 코어 두께에 대해서는 내부 클래딩 영역의 두께가 감소할수록, 같은 내부 클래딩 영역의 두께에 대해서는 코어 두께가 감소할수록 편광에 관계없이 결합 길이가 같아지는 도파관 폭이 작아짐을 볼 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Steel and Composite Structures
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• 제29권1호
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• pp.1-22
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• 2018

Multi-storey precast concrete skeletal structures are assembled from individual prefabricated components which are erected on-site using various types of connections. In the current design of these structures, beam-to-column connections are assumed to be pin jointed. Welded plate beam to-column connections have been used in the precast concrete industry for many years. They have many advantages over other jointing methods in component production, quality control, transportation and assembly. However, there is at present limited information concerning their detailed structural behaviour under bending and shear loadings. The experimental work has involved the determination of moment-rotation relationships for semi-rigid precast concrete connections in full scale connection tests. The study reported in this paper was undertaken to clarify the behaviour of such connections under symmetrical vertical loadings. A series of full-scale tests was performed on sample column for which the column geometry and weld arrangements conformed with successful commercial practice. Proprietary hollow core slabs were tied to the beams by tensile reinforcing bars, which also provide the in-plane continuity across the connections. The strength of the connections in the double sided tests was at least 0.84 times the predicted moment of resistance of the composite beam and slab. The secant stiffness of the connections ranged from 0.7 to 3.9 times the flexural stiffness of the attached beam. When the connections were tested without the floor slabs and tie steel, the reduced strength and stiffness were approximately a third and half respectively. This remarkable contribution of the floor strength and stiffness to the flexural capacity of the joint is currently neglected in the design process for precast concrete frames. In general, the double sided connections were found to be more suited to a semi-rigid design approach than the single sided ones. The behaviour of double sided welded plate connection test results are presented in this paper. The behaviour of single sided welded plate connection test results is the subject of another paper.

• Steel and Composite Structures
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• 제29권5호
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• pp.603-622
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• 2018

Precast concrete structures are erected from individual prefabricated components, which are assembled on-site using different types of connections. In the present design of these structures, beam-to-column connections are assumed pin jointed. Bolted billet beam to-column connections have been used in the precast concrete industry for many years. They have many advantages over other jointing methods in component production, quality control, transportation and assembly. However, there is currently limited information concerning their detailed structural behaviour under vertical loadings. The experimental work has involved the determination of moment-relative rotation relationships for semi-rigid precast concrete connections in full-scale connection tests. The study reported in this paper was undertaken to clarify the behaviour of such connections under symmetrical vertical loadings. A series of full-scale tests was performed on sample column for which the column geometry and bolt arrangements conformed to successful commercial practice. Proprietary hollow core floor slabs were tied to the beams by 2T25 tensile reinforcing bars, which also provide the in-plane continuity across the connections. The contribution of the floor strength and stiffness to the flexural capacity of the joint is currently neglected in the design process for precast concrete frames. The flexural strength of the connections in the double-sided tests was at least 0.93 times the predicted moment of resistance of the composite beam and slab. The secant stiffness of the connections ranged from 0.94 to 1.94 times the flexural stiffness of the attached beam. In general, the double-sided connections were found to be more suited to a semi-rigid design approach than the single sided ones. The behaviour of double sided bolted billet connection test results are presented in this paper. The behaviour of single sided bolted billet connection test results is the subject of another paper.

• Journal of Advanced Marine Engineering and Technology
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• 제20권1호
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• pp.49-55
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• 1996

In this paper, the characteristics of a double-sided linear pulse motor (DLPM) with permanent magnet are analysed using the method which combined the coenergy method and the equivalent magnetic circuit method. In the process of computation, the magnetic material nonlinealities of the permanent magnet, the primary and the secondary core are interpolated by the cubic spline method. Then, the equivalent magnetic circuit modelled by the permeance method including airgap reluctance, which is a function of displacement, is obtained. The static thrust which is the derivative of coenergy is computed by Newton Raphson method at each dispacement. And, in order to investigate the characteristics of the DLPM, the thrust shows as a function of displacement, input current and air gap. The simulation resuls are compared with experimental ones obtained from the DLPM with 2 phase and 4 poles.

• 한국광학회지
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• 제15권1호
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• pp.12-16
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• 2004

편광에 관계없이 매우 짧은 결합 길이를 가지는 Double-Sided Deep-Ridge (DSDR) 도파관 구조를 가지는 수직 방향성 결합기의 두 코어 굴절율에 약간의 비대칭성을 줌으로써 편광에 관계없이 소멸비가 크게 향상됨을 보였다. 내부 클래딩의 두께와 두 코어의 두께가 감소할수록 두 코어는 강하게 결합되기 때문에 최대 소멸비를 보이는 두 코어 사이의 굴절율의 비대칭값과 30 ㏈ 이상의 소멸비를 보이는 코어 굴절율의 공차는 증가한다. 또한 내부 클래딩의 두께와 두 코어의 두께가 감소할수록 두 코어사이의 결합이 강하게 되어 결합기 길이와 30 ㏈ 이상의 소멸비를 가지는 결합길이의 공차는 감소한다. 편광에 관계없이 100 $\mu\textrm{m}$ 이하의 매우 짧은 소자길이를 가지며 30 ㏈ 이상의 매우 높은 소멸비를 가지는 DSDR수직 방향성 결합기를 구현할 수 있음을 보였다.

• 한국광학회지
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• 제15권4호
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• pp.293-298
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• 2004

Double-Sided Deep-Ridge(DSDR) 수직 방향성 결합기의 날개구조부 폭과 두께가 편광에 따른 결합길이에 미치는 영향에 관하여 연구하였다. 날개구조부가 존재하지 않는 DSDR 수직 방향성 결합기는 편광에 무관한 결합길이를 가질 수 없음을 볼 수 있었다. 일정한 날개구조부 두께에 대하여 날개구조부 폭이 특정 길이 이상이 되면 TE 모드와 TM 모드의 결합길이의 변화는 거의 없으며 또한 두 모드의 결합길이의 차이도 거의 발생하지 않음을 볼 수 있었다. 따라서 편광에 무관한 결합길이를 가지는 DSDR 수직 방향성 결합기를 구현하기 위한 최소 날개구조부 폭이 존재함을 볼 수 있었다. 이러한 최소 날개구조부 폭은-같은 코어 두께에 대해서는 날개구조부 두께가 증가할수록, 같은 날개구조부 두께에 대해서는 코어 두께가 감소할수록-증가함을 볼 수 있었다. 또한 최소 날개구조부 두께는 코어의 두께에 의하여 결정됨을 볼 수 있었고 코어의 두께가 증가할수록 최소 날개구조부 두께는 감소함을 볼 수 있었다.

• 센서학회지
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• 제31권1호
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• pp.36-40
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• 2022

High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.

• 한국금형공학회:학술대회논문집
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• 한국금형공학회 2008년도 하계 학술대회
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• pp.209-213
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• 2008

In this work, we have proposed a method for calculating the residual stress developed during the PCB thermo-compression bonding precess. Residual stress is the most important factor that causes PCB warpage in accordance with the pattern design. In this work, a single-layed double-sided PCB, which is comprised of the dielectric (FR-4) substrate in the middle and copper cladding on the both top and bottom sides, is considered. A reference temperature, where all stress is free, is calculated by comparing the calculated and measured warapge of a PCB of which copper cladding of the top side is removed. Then, the reesidual stress values is calculated for the double-sided PCB.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.111-118
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• 2018

강성도가 서로 다른 두 polydimethylsiloxane (PDMS) 탄성고분자와 flexible printed circuit board (FPCB)로 이루어진 soft PDMS/hard PDMS/FPCB 구조의 강성도 국부변환 신축기판을 개발하기 위해 PDMS와 FPCB를 acrylic-silicone 양면테이프를 사용하여 접합한 후 접합공정에 따른 PDMS/FPCB 계면접착력을 분석하였다. 완전 경화된 PDMS에 acrylic-silicone 양면테이프의 silicone 접착제로 접착한 FPCB의 pull 강도는 259 kPa이었으며, pull 시험시 PDMS와 silicone 접착제 사이에서 박리가 발생하였다. 반면에 $60^{\circ}C$에서 15~20분 유지하여 반경화시킨 PDMS에 acrylic-silicone 양면테이프의 silicone 접착제로 FPCB를 접착 후 $60^{\circ}C$에서 12시간 유지하여 PDMS를 완전 경화시키면 pull 강도가 1,007~1,094 kPa로 크게 향상되었으며, pull 시험시 계면 박리가 acrylic-silicone 양면테이프의 acrylic 접착제와 FPCB 사이에서 발생하였다.