• 제목/요약/키워드: Distribution uniformity

검색결과 677건 처리시간 0.021초

Testing Uniformity Based on Vasicek's Estimator

  • Kim, Jong-Tae;Cha, Young-Joon
    • Journal of the Korean Data and Information Science Society
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    • 제15권1호
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    • pp.119-127
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    • 2004
  • To test uniformity of a population, we modify the test statistic based on the sample entropy in the literature, and establish its limiting distribution under weaker conditions, which improves the existing results. It is also to study the proposed test statistic based on Vasicek's entropy estimator is consistent.

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Slit-Coater 노즐에서 Photo Resist의 유동 특성 (Flow Characteristics of Photo Resist in a Slit-Coater Nozzle)

  • 김장우
    • 반도체디스플레이기술학회지
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    • 제3권3호
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    • pp.37-40
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    • 2004
  • This study presents numerical solutions of three-dimensional laminar flow-field formed by photo resist flow in a slit-coater model. We discuss on the governing equations, laminar viscosities and the computational model applied in our numerical calculation and some results. We prove that the structure of tapered-cavity aid to make uniform pressure-field and boundary effect is an important problem to improve coating uniformity. In view of uniformity improvement, it is necessary to study for the structure of cavity and flow path.

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이상계 혼합기에서의 분진운의 공간분포에 대한 평가 (Evaluation for Space Distribution of Dust Cloud in Hybrid Mixtures)

  • 한우섭;정국삼
    • 한국안전학회지
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    • 제10권1호
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    • pp.35-40
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    • 1995
  • This study dealed with problem to estimate the uniformity of dust clouds, as a fundamental study to estimate the ignition hazardous evaluation of hybrid mixtures. The developed method was proposed to grasp space distribution of dusts, and also, an experimental apparatus considering with dispersion and reproduction of dusts were uniquely devised and studied.

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방열관의 배치와 관내 유속이 온수난방 온실의 온도분포에 미치는 영향 (Effect of Pipes Layout and Flow Velocity on Temperature Distribution in Greenhouses with Hot Water Heating System)

  • 신현호;김영식;남상운
    • 생물환경조절학회지
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    • 제28권4호
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    • pp.335-341
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    • 2019
  • 본 연구는 난방온실의 온도분포 균일화를 위한 기초자료 제공을 목적으로 온수난방 방식의 토마토 재배 온실에서 난방실험을 통하여 난방배관의 표면온도와 실내기온 사이의 상관관계를 분석하고, 난방배관의 열전달특성 분석과 난방배관 배치의 개선을 통하여 난방배관 표면온도의 편차를 줄이고 균일도를 향상시키기 위한 방안을 도출하였다. 서로 다른 두 온실의 온도분포를 분석하여 최대편차와 균일도를 검토한 결과, 온수의 유량이 많고 난방배관의 길이가 짧게 배치된 온실의 온도편차가 작고, 균일도는 높은 것으로 나타났다. 또한 순환팬을 가동한 경우에 온도편차는 작아지고 균일도가 개선되는 것을 확인할 수 있었다. 난방배관의 표면온도와 실내기온 사이의 상관관계를 분석한 결과, 두 온실 모두에서 유의적인(p<0.01) 정적 상관관계가 있는 것으로 나타났다. 온수난방 온실에서 실내기온의 분포는 난방배관 표면온도의 분포에 영향을 받는다는 것을 확인할 수 있었고, 온도편차가 최소화 되도록 난방배관을 배치함으로써 실내기온 분포의 균일도를 개선할 수 있는 것으로 판단되었다. 난방배관의 열전달 특성을 분석한 결과 배관의 길이가 길어지면 온도편차는 커지고, 관내의 유속이 빨라지면 온도편차는 작아지는 것으로 나타났다. 따라서 지선배관의 길이가 짧아지도록 난방배관을 배치하고, 관내의 유속을 제어함으로써 온실의 온도분포와 환경의 균일성을 개선할 수 있을 것으로 판단되었다. 국내 온실에서 가장 많이 사용하고 있는 튜브레일(40A) 방식의 온수난방시스템에서 하나의 지선배관에서의 온도편차를 $3^{\circ}C$ 이내로 조절하기 위해서는 관내의 유속이 0.2, 0.4, 0.6, 0.8, $1.0m{\cdot}s^{-1}$일 때 난방배관의 길이는 각각 40, 80, 120, 160, 200m 이내로 제한해야 하는 것으로 분석되었다.

웨이퍼 프로버 척의 저온 온도균일도 향상에 관한 연구 (A Study of Improvement of Low Temperature Uniformity of Wafer Prober Chuck)

  • 주영철;신휘철;강명구
    • 한국산학기술학회논문지
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    • 제10권10호
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    • pp.2572-2576
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    • 2009
  • 반도체 양산공정에 사용되는 웨이퍼 프로버의 척은 고온이건 저온이건 항상 일정한 온도균일도가 요구된다. 저온으로 운전 시에 온도분포를 써모커플을 이용하여 측정한 결과 온도균일도를 향상할 필요가 있음을 발견하였다. FLUENT를 이용한 전산해석을 하여 온도분포를 해석하였으며, 이 결과를 이용하여 냉각수 회로 배치의 변경과 국부적인 회로 폭의 확대 등 개선안을 제시하였다. 제시된 개선안과 현재 척의 온도분포를 비교한 결과 온도균일도가 향상되었음을 확인하였다.

근접장착식 촉매장치의 유동분포 측정 및 해석에 관한 연구 (A Study of Measurement and Analysis of Flow Distribution in a Close-Coupled Catalytic Converter)

  • 조용석;김득상;주영철
    • 대한기계학회논문집B
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    • 제25권4호
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    • pp.533-539
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    • 2001
  • In this study, results from an experimental and numerical study of flow distribution in a close-coupled catalytic converter (CCC) are presented. The experiments were carried out using a glow measurement system. Flow distribution at the exit of the first monolith in the CCC was measured using a pitot tube under steady and transient flow conditions. Numerical analysis was done using a CF D code at the same test conditions, and the results were compared with the experimental results. Experimental results showed that the uniformity index of exhaust gas velocity decreases as Reynolds number increases. Under the steady flow conditions, flow through each exhaust pipe concentrates on a small region of the monolith. Under the transient flow conditions, flow through each exhaust pipe with the engine firing order interacts with each other to spread the flow over the monolith face. The numerical analysis results support the experimental results, and help explain the flow pattern in the entry region of the CCC.

THE EFFECT OF TRACER PARTICLE SIZE ON FEED MIXING QUALITY

  • Heping, Z.;Chuanping, F.
    • Asian-Australasian Journal of Animal Sciences
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    • 제1권4호
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    • pp.189-193
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    • 1988
  • Distribution of tracer particles in carrier conform to Poisson distribution and the effect of Poisson distribution on mixing uniformity can be reduced by increasing the tracer particle number per unit weight. In this paper, above-mentioned theory has been demonstrated by using three kinds of rotor whose pitches are different.

가호기 건조 시스템에서 수치적 유동해석 (Numerical Analysis of the Flow in the Drying Chamber of a Sizing Machine)

  • 이진호;김수연
    • 한국섬유공학회:학술대회논문집
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    • 한국섬유공학회 1996년도 추계 학술발표회
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    • pp.29-34
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    • 1996
  • In the present paper, the flow distribution in the hot air drying chamber of a sizing machine was numerically analyzed with respect to the geometries of the intake duct to obtain the more uniform flow distribution in the chamber. The result shows that the velocity distribution in the inlet of the chamber was significantly dependent on the the geometry of the intake duct. The degree of the non-uniformity in the chamber was reduced as the incident angle of the intake duct became to be smaller.

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PCB 및 패키징 공정에서의 도금 시뮬레이션 기술 적용 (Application of Plating Simulation for PCB and Pakaging Process)

  • 이규환
    • 마이크로전자및패키징학회지
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    • 제19권3호
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    • pp.1-7
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    • 2012
  • Electroplating technology is widely used in semiconductor microelectronic industry. With the development of semiconductor integrated circuit to high density and light-small scale, Extremely high quality and plated uniformity of the deposited metals are needed. Simulation technique can help to obtain better plating results. Although a few plating simulation softwares have been commercialized, plating simulation is not widely prevalent in Korea. In this paper, principle of electroplating and mathematical modeling of plating simulation are discussed. Also introduced are some cases enhancing plating thickness uniformity on leadframe, PCB and wafer by using plating simulation.

PIV를 이용한 회류수조의 유속 분포 교정에 관한 연구 (Calibration of Water Velocity Profile in Circular Water Channel Using Particle Image Velocimetry)

  • 서성부;정광효
    • 한국해양공학회지
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    • 제25권4호
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    • pp.23-27
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    • 2011
  • This experimental study was performed to find rpms of the impeller and the surface flow accelerator to make a uniform velocity vertical distribution in the circular water channel. PIV technique was employed to measure the water velocity profiles into the water depth from the free surface. The number of instantaneous velocity profiles was decomposed into mean and turbulence velocity components, and the distribution of velocity fluctuation and turbulence intensity were computed for each experimental condition. From these results, the velocity uniformity was quantitatively determined to present the flow quality in the measuring section of the circular water channel. It has been shown that the proper operation of the surface flow accelerator would make the uniform velocity profiles and reduce the velocity fluctuation near the free surface.