• 한국포장학회지
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• 제8권1호
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• pp.23-26
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• 2002

This study was carried out to investigate vibration shock and dropping shock of refrigerator during physical distribution. The values of vibration shock were measured to be ${\sim}3G$ for up and down direction, ${\sim}0.8G$ for right and left direction and ${\sim}0.5G$ for back and forth direction on the national road. There was no damage during transport. From the results of dropping test by KS A 1026(General Rules of Performance Testing for Packaged Freights), relative equations were gained as follow : y = 0.12x + 7.63(where y is G-factor and x is Dropping height). The maximum values of dropping shock during materials handling were measured to be 11G. This shock value was corresponding to dropping shocks of dropping height 28.3cm by KS A 1026.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• 식품기술
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• 제24권1호
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• pp.107-110
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• 2011

• 한국포장학회지
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• 제10권1호
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• pp.27-36
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• 2004

Software summarized packaging technology related is needed for low cost and high efficiency in production and packaging design of corrugated board, and in development of these softwares, distribution and packaging environment of one's country must be reflected, well. In domestic occasion, software related to corrugated board packaging dont's exist nearly, and in many industrial fields, the more higher role and importance of packaging in various industrial field is, the more higher necessity of that is. In this study, on the base of preceeding studies (Park, 2001; 2003; 2003), software to optimize board combination that is most importance and sensitivity in composition of cost elements in production and packaging design of corrugated board was developed. This software was composed of input module, output module, database and management module, and calculation module, and efficiency of this software was analyzed on the both sides of sensitivity in design result and effectiveness in a case analyse. In the inward design results having same strength, board combination balance, bursting strength, box weight, and cost were greatly different. Therefore, optimum inward design according to user's design specifications is possible, and in a case analysis for actual products, obtained the more profitable results than before design.

• 마이크로전자및패키징학회지
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• 제4권2호
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• pp.17-24
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• 1997

Spacer가 없는 Field Emission Display 정보표시소자의 진공 패키징시 패널 유리 두 께에 따른 패널 유리가 받는 응력과 패널의 중앙 부위에서의 변위를 계산하였다. 판의 각 모서리가 고정된 상태에서 일정한 압력을 받는 경우의 bending moment로부터 우리가 받는 압력을 계산하였으며 3.7"와 5.7"크기의 두가지 경우를 실험하여 계산값과 파괴양상 및 중앙 에서의 변위를 비교하였다.변위를 비교하였다.

• 한국포장학회지
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• 제25권3호
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• pp.89-94
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• 2019

Among the many packaging materials used in cushion packaging, there is a lack of optimum design for the tray cup pad used in fruit packaging for export and domestic distribution. It causes over-packaging due to excessive material input, and this could be solved by applying various parameters needed to optimize the design of the tray cup pad considering the packaging material and the quantity of fruits in the box. In the case of a tray cup for fruits, the economic efficiency of material and thickness should be considered. Therefore, it is possible to design a tray cup pad depending on the packaging material used by applying appropriate design parameters. The static and dynamic characteristics of the materials used for packaging of pears were analyzed by using the FEM (finite element Method) simulation technique to derive the optimal design parameters. And by applying the appropriate design parameters considering the quantity of fruit and distribution environment, it is possible to design an appropriate fruit tray cup pad. In this study, as a result of simulating the contact stresses between the fruit and the tray cup for the PP, PE, and PS materials used in the fruit tray cup, the material with the lowest contact stress was PP and the value was found to be 398 Pa. The contact displacement between fruit and tray cup using this material was about 0.0463 mm, which was the lowest value compared with other materials. Also the resonance frequency band of tray cup made of PP material was below 36.81 Hz, and the strain energy was below 12.20 J. The resonant frequency band of the pear is more than 80 Hz and it could be applied to all the tray cup materials as compared with the resonance band of 38.81 Hz or less which is the resonance band of all tray cup pads for packaging. Finally, PP is the most suitable material for the tray cup pad.

• 펄프종이기술
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• 제44권2호
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• pp.29-34
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• 2012

For the purpose of developing liner board for water-resistant corrugated board in the cold chain system, several types of base paper for corrugated board were purchased from the market and 6 different boards were produced in the paperboard mill by applying the chemicals on the base paper. Then, water-moisture resistant performance and physical properties of the boards were compared each other. The liner board which is dried at high temperature with pressure by Condebelt papermaking system(CK paper) showed a superior performance in strength over common liner boards. Strength of the board increased by surface chemical treatment up to 60% of compressive strength and 30% of bursting strength. Starch insolubilization with Ammonium-Zirconium Carbonate(AZC) and surface coating with a surface size and a moisture resistant chemical on CK paper showed the best result. Therefore, this method was recommended to produce the outer liner board for water -resistant corrugated board.

• 문화기술의 융합
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• 제6권3호
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• pp.377-380
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• 2020

일인가구의 증가 및 소비행태의 변화, 그리고 마트는 대형화 되고 있는데 반하여 포장 형태는 소포장 용기로 바뀌고 있으며, 수출되는 농산물 특히 과일 및 관련 작물의 수출시 소규모 패키지화되고 있고, 수출시점에 CO₂등의 선도처리를 하고는 있으나 운송 기간내 패키지내부 작물의 선도를 보장하기 어려웠다. 따라서 농산물 유통시 운송과정이나 진열시에 품온이 바뀌어 미생물에 의하여 작물이 변질되는 것을 방지하기 위한 신선도유지제로 소포장 용기로 유통하는 농산물에 적용하기 위한 새로운 신선도 유지 방법의 제공이 필요한 상황으로 윤통과정의 혁신을 가져올 수 있는 방안에 대하여 연구하게 되었다.

• 한국식품과학회지
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• 제47권1호
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• pp.63-69
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• 2015

전자레인지 가열조리용 편의식품류는 레토르트 처리되어 장기간 저장 안정성이 부여되는 장점이 있는 반면, 높은 가열 조건으로 인하여 식품의 품질 저하뿐 아니라 내용물의 흡착에 의한 포장재의 착색이나 오렌지필과 같은 물리적 변화가 발생되기도 한다. 일부 매운 소스 제품들의 전자레인지 가열 조리 시 특정 부위에서 심한 포장재의 열 변형 현상이 확인되었다. 열화상카메라와 광섬유온도계를 이용하여 전자레인지 가열 중 포장재 내부의 온도 분포 및 변화 패턴을 관찰한 결과 내용물의 충진 경계인 액위선과 양 모서리 sealing 부위의 온도가 가장 높이 상승하여 hot spot이 형성되는 것을 확인하였고, 이때 온도는 순간적으로 최대 $190^{\circ}C$까지 상승하였다. 반면 내용물의 중심부에서는 온도 상승이 매우 느리게 이루어져 cold spot이 생성되었으며, 700W에서 2분 조리 후 도달 온도는 약 $55^{\circ}C$였다. 특히, 전자레인지 가열 시 내용물의 균일한 가열패턴을 보여주는 hot spot과 cold spot 사이의 온도 상승률은 최대 7,000배까지 차이를 보였다. 따라서 전자레인지 조리 시 내용물의 불균일한 가열로 특정 부위에 열이 집중되는 hot spot의 생성이 포장재 열 변형의 주요 원인으로 판단되었다. 이러한 가열 불균일성은 포장된 내용물에 함유된 당, 염, 수분과 같은 성분들이 점도에 영향을 주는 것에 기인하는 것으로 추측된다. 이러한 점도 변화는 궁극적으로 내용물의 물리적 또는 이온적 특성의 변화를 야기하고, 결과적으로 전자파가 내용물 내부로 침투하는 깊이가 감소되고, 이에 따라 내용물의 유전 특성과 대류 현상에 영향을 주는 것으로 판단된다. 그러나 전자레인지 조리 시 포장재 열 변형 문제의 완전한 해결을 위해서는 향후 포장된 내용물의 세부 성분 별 유전 특성에 대한 보다 세밀한 분석이 필요하며, 아울러 hot spot의 원인이 되는 식품 성분들의 적절한 함량 조절과 함께 포장재, 포장 형태 및 가열 조건 등에 대한 보다 포괄적이고 안정적인 포장시스템 설계와 개발이 필요할 것으로 판단된다.

• International Journal of Stem Cells
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• 제17권2호
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• pp.113-119
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• 2024

This report presents guidelines for the systematic management of packaging, storage, transportation, and traceability of source cells used for organoid research. Given the important role of source cells in organoid studies, it is important to ensure the preservation of their quality and integrity throughout transportation and distribution processes. The proposed guidelines, therefore, call for a cohesive strategy through these stages to minimize the risks of contamination, deterioration, and loss-threats that significantly compromise the safety, efficacy, and efficiency of source cells. Central to these guidelines is the quality control measures that include roles and responsibilities across the entire supply chain, with recommendations specific to packaging materials, transportation facilities, and storage management. Furthermore, the need for an integrated management system is emphasized, spanning from source cell collection to the final application. This system is crucial for maintaining the traceability and accountability of source cells, facilitating the sharing, distribution, and utilization on a global scale, and supporting to advance organoid research and development.