• 한국세라믹학회지
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• 제42권7호
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• pp.490-496
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• 2005

The electrical properties and stability of the varistors composed of ZnO-Pr$_{6}$O$_{11}$-CoO-Cr$_{2}$O$_{3}$-Dy$_{2}$O$_{3}$ system were investigated with sintering time in the range of 1$\~$3 h at 1350$^{\circ}C$ . As the sintering time was increased, the varistor voltage and leakage current increased, but the nonlinear exponent decreased. The varistors sintered for 1 h exhibited excellent nonlinearity, with a nonlinear exponent of 55.3 and a leakage current of 0.1 $\mu$A, whereas presented relatively low stability. The varistors sintered for 2 h exhibited not only high nonlinear exponent of 46.3, low leakage current of 0.3 $\mu$A, low dielectric dissipation factor of 0.0431, but also the highest stability, in which the variation rates of varistor voltage, nonlinear exponent, leakage current, dielectric constant, and dielectric dissipation factor were -3.0$\%$, -4.1$\%$, +3056.2$\%$, +5.1$\%$, and -12.5$\%$, respectively, after DC accelerated aging stress state of 0.95 V$_{1ma}$/150$^{\circ}C$/24 h. On the whole, the nonlinearity and stability of these varistors are greatly affected by the sintering time.

• 한국초전도ㆍ저온공학회논문지
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• 제3권1호
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• pp.35-39
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• 2001

The optimum cross-sectional area profile of gas-cooled high-temperature superconductor(HTS) current lead is analyzed to have minimum helium boil-off rate. The conventional constant area HTS lead has much higher helium consumption than the optimum HTS lead considered in this study. The optimum HTS lead has variable cross-sectional area to have constant satiety factor. An analytical formula of optimum shape of lead and temperature profile are obtained. For multi-stacking HTS current leads, the optimum tape lengths and minimum heat dissipation rate are also formulated. The developed formulations are applied to the Bi-2223 material, and the differences between constant area, constant safety-factor, and multi-stacking current leads are discussed.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.49-55
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• 2016

Nowadays there are magnetic sensors in a wide variety of equipment such as computers, cars, airplanes, medical and industrial instruments. In many of these applications the magnetic sensors offer safe and non-invasive means of detection and are more reliable than other technologies. The electric current in a conductor generates a magnetic field detected by this type of sensor. This work aims to define a package dedicated to an electrical current sensor using a MTJ (Magnetic Tunnel Junction) as a sensing device. Four different proposals of packaging, three variations of the chip on board (CoB) package type and one variation of the thin small outline package (TSOP) were analyzed by COMSOL modeling software by simulating a brad range of current injection. The results obtained from the thermal and magnetic analysis has proven to be very important for package improvements, specially for heat dissipation performance.

• 한국전기전자재료학회논문지
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• 제13권4호
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• pp.337-342
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• 2000

We fabricated resistive superconducting fault current limiters based on YB $a_{2}$/C $u_{3}$/ $O_{7}$ thin films and investigated their quench propagation characteristics. The YB $a_{2}$/C $u_{3}$/ $O_{7}$ films was coated with a gold layer and patterned into 1 mm wide meander lines by photolithography. The quench was concluded to start locally and propagates until completed. The quench propagation characteristics were explained based on the heat transfer within the film as well as between the film and the surrounding liquid nitrogen. The quench completion time depended strongly on potential fault current amplitude and not significantly on fault angle which indicates that the quench propagation speed is affected more by heat dissipation rate than by fault current increase rate. The quench completion time was 1 msec at the fault current of 65 $A_{peak/{\ak}}$.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 학술회의 논문집 정보 및 제어부문 A
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• pp.271-274
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• 2003

This paper presents a Built-in Current Sensor that detect defects in CMOS integrated circuits using the current testing technique. This scheme employs a cross-coupled connected PMOS transistors, it is used as a current comparator. Our proposed scheme is a negligible impart on the performance of the circuit undo. test (CUT). In addition, in the normal mode of the CUT not dissipation extra power, high speed detection time and applicable deep submicron process. The validity and effectiveness are verified through the HSPICE simulation on circuits with defects. The entire area of the test chip is $116{\times}65{\mu}m^2$. The BICS occupies only $41{\times}17{\mu}m^2$ of area in the test chip. The area overhead of a BICS versus the entire chip is about 9.2%. The chip was fabricated with Hynix $0.35{\mu}m$ 2-poly 4-metal N-well CMOS technology.

• 한국초전도ㆍ저온공학회논문지
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• 제23권2호
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• pp.19-23
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• 2021

We have studied the breaking system that combines a resistive superconducting fault current limiter (SFCL) and a DC circuit breaker for DC fault current. To verify the design of the 15 kV DC SFCL, which was driven from the previous work, a 500 V DC system was built and a scale-down SFCL were manufactured. The manufactured SFCL module was designed as a bifilar coil which is a structure that minimizes inductive reactance. The manufactured SFCL module has been experiment to verify characteristics of the current-limiting performance in the DC 500 V system. Also, the manufactured FCL module was combined with the DC circuit breaker to be experimented to analyze the breaking performance. As a result of the experiment, when SFCL was combined to the DC circuit breaker, the energy dissipation received by the DC circuit breaker was reduced by up to 84% compared to when the DC circuit breaker operates alone. We are preparing methods and experiments for the optimal method for much higher performance as a future work.

• 산업경영시스템학회지
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• 제33권4호
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• pp.79-84
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• 2010

In recent years, conventional streetlight is replaced by LED streetlight to reduce power consumption dramatically and to maximize lighting effects. However the characteristic of power LED itself driven by high current to increase the illumination, we need to develop effective heat release device. This study suggests new concept of heat dissipation device using PCM (Phase Change Material) and shows an experiment results to investigate thermal effects of PCM.

• 전기학회논문지
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• 제58권7호
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• pp.1375-1379
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• 2009

Insulation tests have been performed on two generator stator bars under accelerated aging under a laboratory environment. Electrical stress was applied to stator bar No.1, and electrical and thermal stresses were applied to stator bar No.2. Nondestructive stator insulation tests including the ac current, dissipation factor($tan{\delta}$), and partial discharge tests have been performed on both bars as the bars were aged for 11460 hours. Experimental test results show that ${\Delta}I$, ${\Delta}tan{\delta}$, and partial discharge of No. 1 and No.2 stator bars increased with increased in aging time. It has been concluded from the test that the stator insulation of the two generators are in good condition.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 Techno-Fair 및 추계학술대회 논문집 전기물성,응용부문
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• pp.93-94
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• 2008

Diagnostic tests were performed in three high voltage motors. These tests included insulation resistance, polarization index, ac current, dissipation factor($tan{\delta}$) and partial discharge magnitude. The rewind of motor stator insulation at rated voltage is assessed by the results of these tests. After completing the diagnostic tests, the stator windings of motors were subjected to gradually increasing ac voltage, until the insulation punctured. NO.1 and No.2 motors failed near rated voltage of 14.0 kV, respectively. These motors are lower that expected for good quality coils in 6.6 kV class motors. The breakdown voltage of No.3 motor was 15.0 kV.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.1026-1029
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• 2008

Temperature increase during OLED operation can significantly degrade the device lifetime. By using top-emission OLEDs fabricated on glass and silicon substrates that have different thermal conductivities, we found that efficient heat dissipation and corresponding lifetime improvement can be obtained by making a direct contact between the OLED anode and the high thermally-conductive silicon substrate. We describe substrate-dependent OLED heat dissipation behavior and OLED lifetime improvement by using infrared camera images and constant current stress test methods.