• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.811-813
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• 2005

Purpose-built ink jet printheads are being recognized as useful tools in manufacturing where precision deposition is required. Ink jet technology is a non-contact, non-contaminating digital process compatible with clean rooms. New manufacturing applications are driving printhead designs to smaller drops, increased productivity. This paper describes Dimatix's new tools designed to facilitate development of manufacturing processes for both rigid and flexible substrates and development of new electronic fluids.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.1040-1043
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• 2004

As time goes by, the market demand increases and each LCD panel manufacturing company makes every effort to produce more panels in a limited time. It is necessary to reduce the cost and time of production for the improvement of productivity in manufacturing companies. The increased speed of thin films growth used in the TFT process brings improvement of productivity but it is also accompanied by a drop in display quality due to a characteristic change of the thin film. So in our dissertation, we deal with the increased speed of a-Si layer growth and the proportioned a drop in characteristic quality. We discuss a drop in display quality by a characteristic change of a-Si layer and we propose a counter-plan through panel design improvement. We have already applied our plan to the 15" XGA panel and confirmed the improved result.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.823-827
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• 2005

Barrier ribs in the plasma display panel (PDP) function to maintain the discharge space between the glass plates as well as to prevent optical crosstalk. Patterning of barrier ribs is one of unique processes for making PDP. Barrier ribs could be formed by screen-printing, sand blasting, etching, and photolithographic process. In this work photosensitive barrier rib pastes were prepared by incorporating binder polymer, solvent, functional monomers photoinitiator, and barrier rib powder of which surface was treated with fumed silica particles. Studies on the function of materials for the barrier rib paste were undertaken. After optimization of paste formulation and photolithographic process, it was applied to the photosensitive barrier rib green sheet and was found that photolithographic patterning of barrier ribs could be formed with good resolution up to $110{\mu}m$ height and $60{\mu}m$ width after sintering.

• Journal of the Semiconductor & Display Technology
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• v.15 no.1
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• pp.17-21
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• 2016

EUV (Extreme Ultraviolet) pellicle which protects a mask from contamination became a critical issue for the application of EUV lithography to high-volume manufacturing. However, researches of EUV pellicle are still delayed due to no typical manufacturing methods for large-scale EUV pellicle. In this study, EUV pellicle membrane manufacturing method using not only KOH (potassium hydroxide) wet etching process but also a water bath was suggested for uniform etchant temperature distribution. KOH wet etching rates according to KOH solution concentration and solution temperature were confirmed and proper etch condition was selected. After KOH wet etching condition was set, $5cm{\times}5cm$ SiNx (silicon nitride) pellicle membrane with 80% EUV transmittance was successfully manufactured. Transmittance results showed the feasibility of wet etching method with water bath as a large-scale EUV pellicle manufacturing method.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.3
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• pp.111-117
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• 2014

With the development of technology, the display industry has been focusing on the development of new types of displays, such as bendable and wearable displays. However, the PVA/TAC polarizing film used in the manufacturing of a normal display is associated with low luminance and low efficiency. If the existing polarization film is replaced with a wire grid polarizer, it is possible to reduce the thickness significantly. Moreover enhanced brightness can also be expected. This study confirms the optical properties of the WGP through a simulation.

• Journal of the Semiconductor & Display Technology
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• v.5 no.4 s.17
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• pp.17-22
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• 2006

In the manufacturing processes of semiconductor, test process is important for quality of products. In the manufacturing process of dynamic memory, memory test is more important. So, automatic test equipment(ATE) is used necessarily. But, according to increase of speed of dynamic memory operation, the rapid test equipment is needed. Impedance matching between ATE and dynamic memory is expected to be an important problem for making a rapid test equipment over 1Gbps. According to increase of speed, inner impedance of ATE also works on important parameter for test. This paper is about the method that is for impedance matching of inner impedance and coaxial cable occurring in manufacturing of ATE. We proved effects of inner impedance by electric theory and verified the method of impedance matching using computer simulation.

• Journal of the Semiconductor & Display Technology
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• v.12 no.1
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• pp.47-51
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• 2013

The screen printing is a process that is widely used in manufacturing process of various fields such as flexible devices, portable multimedia devices, OLED, and the solar cell. The screen printing method has been studied as a method for forming the high precision micro-pattern, making the low-cost manufacturing process and reducing cost through improvement of productivity. It is applicable to deposit and forming the pillars which are one of the core element for comprising vacuum glazing. In this paper, by using the paste of the glass frit base, the screen printing was performed. We analyzed the effect for the printing process to deposit pillar paste on the screen printing parameters by the factorial experimental design. The polynomial predicting the volume of the printed supporting pillars was drawn by using screen printing.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.101-105
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• 2011

In case of high-tech process industries such as semiconductor and TFT-LCD manufactures, fault of a virtually finished product that is value-added one, since it has gone throughout the most of processes, may give rise to quality cost nearly amount to its selling price and can be a main cause that decreases the efficiency of manufacturing process. This paper proposes a real-time dispatching algorithm for semiconductor manufacturing process with rework. In order to evaluate the proposed algorithm, this paper examines the performance of the proposed method by comparing it with that of the existing dispatching algorithms, based on various experimental data.

• Journal of the Semiconductor & Display Technology
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• v.19 no.4
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• pp.121-125
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• 2020

With miniaturization of semiconductor, the manufacturing process become more complex, and undetected small changes in the state of the equipment have unexpectedly changed the process results. Fault detection classification (FDC) system that conducts more active data analysis is feasible to achieve more precise manufacturing process control with advanced machine learning method. However, applying machine learning, especially in supervised learning criteria, requires an arduous data labeling process for the construction of machine learning data. In this paper, we propose a semi-supervised learning to minimize the data labeling work for the data preprocessing. We employed equipment status variable identification (SVID) data and optical emission spectroscopy data (OES) in silicon etch with SF6/O2/Ar gas mixture, and the result shows as high as 95.2% of labeling accuracy with the suggested semi-supervised learning algorithm.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.2
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• pp.122-129
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• 2004

There is an increasing need for large flat panel display devices. PDP (Plasma Display Panel) is one of the most promising candidates for this need. Thermal shock failure of PDP glass during manufacturing process is a critical issue in PDP industry since it is closely related to the product yield and the production speed. In this study, thermal shock resistance of PDP glass is measured by water quenching test and an analysis scheme is described for estimating transient temperature and stress distributions during thermal shock. Based on the experimental data and the analysis results, a simple procedure for predicting the thermal shock failure of PDP glass is proposed. The fast cooling process for heated glass plates can accelerate the speed of PDP production, but often leads to thermal shock failure of the glass plates. Therefore, a design guideline for preventing the failure is presented from a viewpoint of high speed PDP manufacturing process. This design guideline can be used for PDP process design and thermal -shock failure prevention.