• 제목/요약/키워드: Display manufacturing process

검색결과 385건 처리시간 0.026초

Glass 패널 진공흡착시스템의 유동해석 연구 (Study on Flow Analysis in Glass Panel Vacuum Lift System)

  • 김동균;윤천석
    • 대한기계학회논문집B
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    • 제33권11호
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    • pp.886-893
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    • 2009
  • To develop glass panel vacuum lift system for the post process in module line of FPD(Flat panel display) such as LCD and PDP, new vacuum adsorption parts of this system are proposed. These parts are composed of variable geometry configurations utilizing ceramic porous medium for variable size of glass panels. In order to design this device, detail understanding of flow phenomena in the flow path of vacuum adsorption system is essential. Thus, CFD analysis and designs are performed for several configurations in terms of pressure drop and balancing force at the adsorption side. From the result, new configuration is recommended for optimum design and manufacturing purpose.

The role of polymers in dispersion stability and film formation of silica/PVA suspension

  • 김선형;성준희;안경현;이승종
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2010년도 춘계학술발표대회
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    • pp.23.2-23.2
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    • 2010
  • Researches on the drying of particle/polymer suspensions receive attentions in technical applications such as manufacturing display and batteries. In this study, the effect of polymers on drying behavior of silica/poly(vinyl alcohol) suspension was investigated in terms of suspension stability and stress development during drying. The effect of polymer adsorption was studied by changing pH. More strongly flocculated suspension with lower pH became more dispersed and close-packed film after drying. Evaluation of potential energy allows us to suggest that the adsorbed polymers which bridge the particles introduce steric repulsion and lead flocculated suspension to dispersed film. When the effect of adsorption kinetics was studied by changing the mixing time, the adsorption amount, characteristic stress and dried film density showed a similar behavior in the form of with a single characteristic time. It implies that the drying process can be determined by simple characteristic equation with a single time constant.

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Vacuum 'brusher' for the alignment treatment of the large area LCD sub strates

  • Yaroshchuk, O.V.;Liu, P.C.;Lee, C.D.;Lee, C.Y.;Kravchuk, R.M.;Dobrovolskyy, A.M.;Protsenko, I.M.;Goncharov, A.A.;Lavrentovich, O.D.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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    • pp.768-773
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    • 2005
  • We present an overview of our new method of liquid crystal (LC) alignment based on the anisotropic etching of the alignment layers with a directed plasma flux. The method is realized by the use of anode layer source of "race track" geometry generating two "sheets" of accelerated plasma. These sheets are directed obliquely to the treated substrates. The static and dynamic irradiation regimes have been explored. The optimized processing conditions and materials are discussed. The technique yields an excellent uniformity of liquid crystal alignment of planar, tilted and vertical types. It is shown that the new method can be easily adapted for the alignment treatment of large area substrates used in the modern LCD manufacturing process.

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Innovations in Materials Deposition for Plastic Electronics

  • Creagh, Linda T.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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    • pp.673-675
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    • 2005
  • Ink jet printheads are now widely used in manufacturing processes that require precise dispensing of materials. Today, Dimatix manufactures a variety of drop-on-demand ink jet printheads for the industrial printing market, but emerging opportunities present fresh challenges to our technology. In response to requirements for digitally printing on flexible substrates and dispensing novel electronic fluids, we are developing next generation jetting technology based on our three-dimensional silicon MEMS technology with a piezo-driven pumping chamber integrated into the chip structure. This presentation will address the functional and physical design features and properties of Dimatix's MEMS process, its characteristics, reliability and usability. Examples of opportunities and applications for digitally printing electronic fluids on flexible substrates with MEMS-based ink jet technology will be presented.

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On the route towards Si-based full color LED microdisplays for NTE applications

  • Smirnov, A.;Labunov, V.;Lazarouk, S.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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    • pp.727-731
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    • 2005
  • Design and manufacturing process of a full color LED microdislay fabricated by standard CMOS technology and containing an array of aluminum / nanostructured porous silicon reverse biased light emitting Schottky diodes will be discussed. Being of a solid state construction, this microdisplays are cost-effective, thin and light in weight due to very simple device architecture. Its benefits include also super high resolution, wide viewing angles, fast response time and wide operating temperature range. The advantages of full integration of an LED-array and driving circuitry onto a Si-chip will be also discussed.

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Color Filter Pattern Generation by Screen Printing

  • Choi, Yong-Jung;Lee, Taik-Min;Nam, Soo-Yong;Kim, Yong-Sung;Na, Dae-Yup;You, Choon-Woo;Shin, Dong-Youn;Kim, Kwang-Young;Jung, Kwang-Il
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.380-383
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    • 2007
  • In this research, we present color filter which is patterned by screen printing method. Analysis of screen printing process, screen printing system, experiment for uniform printing in large area, characteristics of screen printed CF are investigated .In spite of limitation of precision, screen printed color filter is very cost- effective in respect of manufacturing facility and ink usage.

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연X선 Ionizer에 의한 대전물체의 제전특성에 관한 연구 (A Study of De-electrification Characteristics of Charged Body By Soft X-Ray Ionizer)

  • 이동훈
    • 한국안전학회지
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    • 제13권3호
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    • pp.67-73
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    • 1998
  • The technology for neutralizing static electricity by soft X-ray radiation has been newly developed. This technology involves ionization of gas molecules in the vicinity of a charged substrate to generate ions and electrons to reduce electrostatic potential. The ULSI device substrate and liquid crystal display substrate tend to get charged instantly to a high potential level when they are handled in the manufacturing process. Soft X-ray radiation is adequate in air or $O_2$ gas at atmospheric pressure. This newly developed neutralization method is effective to be superior to the conventional technique, i.e., an ionizer by using corona discharge ,in every aspect. The new method features excellent neutralization capability and is able to completely reduce electrostatic potential to 0 V within a short time. Moreover, this is a very clean antistatic technology free from particle generation ,ozone generation, and electromagnetic noise, which are problems in using the corona discharge ionizer.

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반도체 장비용 고속프레스의 동특성 해석에 관한 연구

  • 국정근;조병관;이우영
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2005년도 추계 학술대회
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    • pp.155-159
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    • 2005
  • High speed presses with high resolution in semiconductor lead frame manufacturing process are needed . But high speed operation accompanies mechanical vibration. therefore optimized kinematic structure to minimize vibration is required for a high speed press. And the growing competition in the industry asks a press with low cost, high speed, high resolution, and high pressing force, For this purpose a high speed press was modeled with 3D CAD solid modeling system and dynamic analysis were performed with CAE S/W for multibody dynamic analysis, Through these analyses a motor appropriate to a high speed press was selected and link structure for feeding system of the press was modified to reduce vibration. To perform this analysis working Model which is 2D kinematics and dynamic analysis software was used.

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유기발광(有機發光) 다이오드의 가속(加速) 수명(壽命) 시험(試驗)에 관한 연구(硏究) (Life Estimation of Organic Light Emission Diode by Accelerated Test)

  • 최영태;조재립
    • 한국품질경영학회:학술대회논문집
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    • 한국품질경영학회 2010년도 춘계학술대회
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    • pp.262-268
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    • 2010
  • Organic light emitting diode is developed fast from 1963 after discovering electric light emitting phenomenon. First PMOLED(passive matrix OLED) product is manufactured and AMOLED(active matrix OLED) using TFT(thin film ransistor) is now in the center. PMOLED is mainly mounted at sub display. but AMOLED is mounted at main display. Also AMOLED expand the market to PMP(portable multimedia players), navigation and TV. Even thought OLED's market is opening to many applications, OLED is worried about lifetime until now. That's appeared in market in a very short time and is not known well about result of OLED's lifetime and reliability test. And there is no standard ssessment method and not enough study to standardization the method. A study's purpose is reduce the time for life test by accelerated current and it can do production possible design by accelerated life model in design phase. It's must be add to process variables and design variables(like ratio of light emitting, organic material structure, condition of aging, etc) to make the best use of supplied accelerated lifetime model in this paper. In terms of lifetime it needs each criterion of applications because of image sticking. In conclusion, it's possible to discover new defect because there is not much time to be opened in market and develop a method of manufacturing process & materials, so we need to study on the subject of this paper continuously.

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웨이퍼 접착 텍스쳐링 방식을 이용한 다결정 실리콘 태양전지 제조 (Fabrication of Multi-crystalline Silicon Solar Cell by using Wafer Adhesion Texturing Method)

  • 윤석일;노시철;최정호;정종대;서화일
    • 반도체디스플레이기술학회지
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    • 제15권4호
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    • pp.67-72
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    • 2016
  • In this study, the texturing and the emitter formation processes were carried out with the wafer adhesion method to increase the productivity and reduce the production cost of the multi-crystalline silicon solar cell. After fabricating $156{\times}156mm$ solar cell according to the wafer adhesion method, the operation characteristics were analyzed and compared with those of the solar cell fabricated by the standard process method. In the case of a solar cell formed by the wafer adhesion method, it showed Jsc of $32.87mA/cm^2$, Voc of 0.612V, FF of 78.04% and efficiency of 15.71% respectively. The efficiency of the solar cell formed by the wafer adhesion method was 0.1% higher than that of the solar cell formed by the standard method. In addition, the productivity of the texturing and the emitter formation processes is expected to be approximately doubled. Therefore, it is expected that the manufacturing cost of the multi-crystalline solar cell can be reduced due to the improved productivity compared with the standard process.