• Title/Summary/Keyword: Display manufacturing process

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a-Si Process-based Advanced SPC TFT for AMOLED Application

  • Lee, Seok-Woo;Lee, Sang-Jin;Ahn, Tae-Joon;Park, Soo-Jeong;Kang, Su-Hyuk;Jung, Sang-Hoon;Lee, Hong-Koo;Kim, Sung-Ki;Park, Yong-In;Kim, Chang-Dong;Yang, Myoung-Su;Kang, In-Byeong;Hwang, Yong-Kee
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.961-963
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    • 2009
  • a-Si process-based advanced-SPC (a-SPC) TFT has been developed and verified by manufacturing an AMOLED panel having improved cost competitiveness by using the existing a-Si infrastructure. The a-SPC TFT had superior device reliability and current drivability to a-Si TFT to meet the requirements of AMOLED backplane.

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Development of The 3-channel Vision Aligner for Wafer Bonding Process (웨이퍼 본딩 공정을 위한 3채널 비전 얼라이너 개발)

  • Kim, JongWon;Ko, JinSeok
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.1
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    • pp.29-33
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    • 2017
  • This paper presents a development of vision aligner with three channels for the wafer and plate bonding machine in manufacturing of LED. The developed vision aligner consists of three cameras and performs wafer alignment of rotation and translation, flipped wafer detection, and UV Tape detection on the target wafer and plate. Normally the process step of wafer bonding is not defined by standards in semiconductor's manufacturing which steps are used depends on the wafer types so, a lot of processing steps has many unexpected problems by the workers and environment of manufacturing such as the above mentioned. For the mass production, the machine operation related to production time and worker's safety so the operation process should be operated at one time with considering of unexpected problem. The developed system solved the 4 kinds of unexpected problems and it will apply on the massproduction environment.

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Development of Direct Surface Forming Process

  • Cho, Kwang-Hwan;Yoon, Kyung-Hwan
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.04a
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    • pp.73-77
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    • 2003
  • The backlight unit(BLU) is used as a light source of TFT liquid-crystalline-display (TFT-LCD) module. In this backlight unit, one of important components is the light guide, which is usually made of transparent polymers. Currently the screen-printing method is mainly used for the light guide as a manufacturing process. However, it has limitation to the flexibility of three-dimensional optical design. In the present paper a new alternative manufacturing method for the light guide with low-cost is proposed. This manufacturing method is named as direct surface forming (DSF), which is very similar to the well-known hot embossing except for partial contact between mold and substrate. The results of this new manufacturing method are presented in terms of processing condition, dimensional accuracy, productivity, etc.

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A Study on Application of Normal Oriented Path Generation Algorithm for Curved Surface Coating Process (곡면 코팅 공정을 위한 수직 지향 경로 생성 알고리즘 적용에 대한 연구)

  • Gun Ho Kim;Kihyun Kim;Jaehyun Park
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.4
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    • pp.119-123
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    • 2023
  • This study is normal orientation technology of slit coating equipment to improve the quality of curved displays. Currently, the demand for curved displays is increasing significantly due to advantages such as screen immersion or design in various industries. Accordingly, changes in the display coating process are essential. In the curved display coating process, unlike the existing flat coating process, the nozzle must be rotated along the curvature of the curved surface to spray the coating solution. The coating solution must be applied while maintaining a uniform thickness. If the thickness of the coating liquid applied to the target surface is non-uniform, the quality of the product may be degraded such as image quality deterioration and light spreading. This paper presents technology and experimental results for keeping the nozzle of slit coating equipment perpendicular to the curved surface and is expected to contribute to the quality improvement of curved displays.

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Tactile Display to Render Surface Roughness for Virtual Manufacturing Environment (가상제조환경에서 제품의 표면 거칠기 전달을 위한 촉각 디스플레이)

  • Lee, Dong-Jun;Park, Jae-Hyeong;Lee, Wonkyun;Min, Byung-Kwon
    • Journal of the Korean Society for Precision Engineering
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    • v.33 no.1
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    • pp.17-22
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    • 2016
  • In smart factories, the entire manufacturing process from design to the final product is simulated in a virtual manufacturing environment and optimized before starting production. Suppliers and customers make decisions based on the simulation results. Therefore, effective rendering of the information of the virtual products to suppliers and customers is essential for this manufacturing paradigm. In this study, a method of rendering the surface roughness of the virtual products using a tactile display is presented. A tactile display device comprising a $3{\times}3$ array of individually controlled piezoelectric stack actuators is constructed. The surface topology of the virtual products is rendered directly by controlling the piezoelectric stack actuators. A series of experiments is performed to evaluate the performance of the tactile display device. An electrical discharge machined surface is rendered using the proposed method.

Effect of Spin Coating Speed on Characteristics of Polyimide Alignment Layer for Liquid Crystal Display (스핀 코팅 공정에 따른 액정디스플레이용 폴리이미드 배향막 특성 분석)

  • Kim, Jin-Ah;Choi, Se-Hoon;Park, Hong-Gyu
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.35 no.1
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    • pp.58-65
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    • 2022
  • The field of liquid crystal display (LCD) is constantly in the spotlight and the process of depositing an alignment layer in the LCD manufacturing process is very important to obtain excellent performance such as low-power driving and high-speed response to improve LCD performance. Therefore, research on liquid crystal (LC) alignment is being actively conducted. When manufacturing LCD, it is necessary to consider the effect of the alignment layer thickness as one of the factors affecting various LCD performances. In addition, previous studies confirmed the LC alignment characteristics correlate with the rotation speed in the spin coating process. Therefore, the electro-optical properties of the LCD were investigated by manufacturing a polyimide alignment layer by varying the rotation speed in the spin coating process in this study. It was confirmed that the thickness of the polyimide alignment layer was controlled according to the spin coating conditions. The average transmittances of anti-parallel LC cells at the spin coating speed of 2,500 rpm and 3,000 rpm are about 60%, which indicates that the LC cell has relatively higher performance. At the spin coating speed of 3,000 rpm, the voltage-transmittance curve of twisted nematic (TN) LC cell was below 1.5 V, which means that the TN LC cell operated at a low power. In addition, high-speed operating characteristics were confirmed with a response time of less than 30 ms. From these derived data, we confirmed that the ideal spin coating speed is 3,000 rpm. And these results provide an optimized polyimide alignment layer process when considering enhanced future LCD manufacturing.

A Study on Improving the Accuracy of Wafer Align Mark Center Detection Using Variable Thresholds (가변 Threshold를 이용한 Wafer Align Mark 중점 검출 정밀도 향상 연구)

  • Hyeon Gyu Kim;Hak Jun Lee;Jaehyun Park
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.4
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    • pp.108-112
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    • 2023
  • Precision manufacturing technology is rapidly developing due to the extreme miniaturization of semiconductor processes to comply with Moore's Law. Accurate and precise alignment, which is one of the key elements of the semiconductor pre-process and post-process, is very important in the semiconductor process. The center detection of wafer align marks plays a key role in improving yield by reducing defects and research on accurate detection methods for this is necessary. Methods for accurate alignment using traditional image sensors can cause problems due to changes in image brightness and noise. To solve this problem, engineers must go directly into the line and perform maintenance work. This paper emphasizes that the development of AI technology can provide innovative solutions in the semiconductor process as high-resolution image and image processing technology also develops. This study proposes a new wafer center detection method through variable thresholding. And this study introduces a method for detecting the center that is less sensitive to the brightness of LEDs by utilizing a high-performance object detection model such as YOLOv8 without relying on existing algorithms. Through this, we aim to enable precise wafer focus detection using artificial intelligence.

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Application of Inkjet Technology in Flat Panel Display

  • Ryu, Beyong-Hwan;Choi, Young-Min
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07b
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    • pp.913-918
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    • 2005
  • It is expected that the inkjet technology offers prospect for reliable and low cost manufacturing of FPD (Flat Panel Display). This inkjet technology also offers a more simplified manufacturing process for various part of the FPD than conventional process. For example, recently the novel manufacturing processes of color filter (C/F) in LCD, or RGB patterning in OLED by inkjet printing method have been developed. This elaborates will be considered as the precious point of manufacturing process for the mass production of enlarged-display panel with a low price. On this point of view, we would like to review the status of inkjet technology in FPD, with some results on forming micro line by inkjet patterning of suspension type silver nano ink as below. We have studied the inkjet patterning of synthesized aqueous silver nano-sol on interface-controlled ITO glass substrate. Furthermore, we designed the conductive ink for direct inkjet patterning on bare ITO glass substrate. The first, the highly concentrated polymeric dispersant-assisted silver nano sol was prepared. The high concentration of batch-synthesized silver nano sol was possible to 40 wt%. At the same time the particle size of silver nanoparticles was below $10{\sim}20nm$. The second, the synthesized silver nano sol was inkjet - patterned on ITO glass substrate. The connectivity and width of fine line depended largely on the wettability of silver nano sol on ITO glass substrate, which was controlled by surfactant. The relationship was understood by wetting angle. The line of silver electrode as fine as $50{\sim}100\;{\mu}m$ was successfully formed on ITO glass substrate. The last, the direct inkjet-patternable silver nano sol on bare ITO glass substrate was designed also.

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Reducing AMOLED Manufacturing Costs

  • O'Regan, Marie
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.27-29
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    • 2008
  • Announcements by many companies have shown that market interest and technical potential exist for AMOLEDs. DuPont Displays is developing solution processing technology designed to address the high cost of manufacturing AMOLEDs via vapor deposition methods. By printing OLED displays, we can reduce costs and can subsequently scale OLED manufacturing to a competitive motherglass size.

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