• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.47-51
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• 2011

We investigated the substrate surface polishing by the spherical rigid abrasive under the compression using classical molecular dynamics modeling. We performed three-dimensional molecular dynamic simulations using the Morse potential functions for the various slide-to-roll ratios, from 0 to 1, and then, the compressive forces acting on the spherical rigid abrasive were calculated as functions of the time and the slide-to-roll ratio. The friction coefficients obtained from the classical molecular dynamics simulations were compared to those obtained from the experiments; and found that the molecular dynamic simulation results with the slide-to-roll ratio of 0 value were in good agreement with the experimental results.

• Journal of the Semiconductor & Display Technology
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• v.19 no.3
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• pp.73-76
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• 2020

The physics-based compact gate leakage current noise models in nanoscale MOSFETs are developed in such a way that the models incorporate important physical effects and are suitable for circuit simulators, including QM (quantum-mechanical) effects. An emphasis on the trap-related parameters of noise models is laid to make the models adaptable to the variations in different process technologies and to make its parameters easily extractable from measured data. With the help of an accurate and generally applicable compact noise models, the compact noise models are successfully implemented into BSIM (Berkeley Short-channel IGFET Model) format. It is shown that the noise models have good agreement with measurements over the frequency, gate-source and drain-source bias ranges.

• Journal of the Semiconductor & Display Technology
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• v.15 no.2
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• pp.1-5
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• 2016

3D printer is the equipment of the system for sequentially layer laminated in the materials. Now 3D printer used in various fields such as, semiconductor, electricity automobile, medical and various types of output method and material. In this paper, we studied about the improvement on warpage due to shrinkage of product from 3D printer of FDM(Fused Deposition Modeling) type, we proposed measures systematically to solve warpage problem using of 6SC(6 Step Creativity) method of practical TRIZ. After experimented with product prototypes experiment, we verified effect about solution.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.33-38
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• 2012

The wafer positioning robot in the semiconductor industry is required to operate at high speed for the improvement of productivity. The residual vibration caused by the high speed of the wafer positioning robot, however, makes the life of the robot shorter and the cycle time longer. In this study, the input shaping and the path of the system are designed for the reduction of the residual vibration and the improvement of the cycle time. The followings are the process for the reduction and the improvement; 1) System modeling of the wafer positioning robot, 2) Verification of dynamic characteristics of the wafer positioning robot, 3) Input shaping plan using impulse response reiteration, 4) Simulation test using SIMULINK program, 5) Analysis of result.

• Journal of the Semiconductor & Display Technology
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• v.14 no.4
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• pp.8-12
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• 2015

As NMP (N-Methyl-2pyrrolidone) is becoming important in many fields, the demand for it is also rising rapidly. With its chemical property of high boiling point, low vapor pressure and high water solubility, it is easy to recover it after processing. Therefore, it is increasingly needed to develop a system that effectively recovers NMP solvent. The study produced a system modeling using AMESim software before developing high purity solvent recovery (HPSR) system to recover NMP solvent. Then, it verified reliability by comparing the simulation model with the test result.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.131-135
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• 2023

Neural network-based time series models called time series neural networks (TSNNs) are trained by the error backpropagation algorithm and used to predict process shifts of parameters such as gas flow, RF power, and chamber pressure in reactive ion etching (RIE). The training data consists of process conditions, as well as principal components (PCs) of optical emission spectroscopy (OES) data collected in-situ. Data are generated during the etching of benzocyclobutene (BCB) in a SF₆/O₂ plasma. Combinations of baseline and faulty responses for each process parameter are simulated, and a moving average of TSNN predictions successfully identifies process shifts in the recipe parameters for various degrees of faults.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.67-72
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• 2023

In this paper, a dye-sensitized solar cell (DSSC), one of the representative third-generation solar cells with eco-friendly materials and processes compared to other solar cells, was modeled using MATLAB/Simulink. The simulation was conducted by designating values of series resistance, parallel resistance, light absorption coefficient, and thin film electrode thickness, which are directly related to the efficiency of dye-sensitized solar cells, as arbitrary experimental values. In order to analyze the performance of dye-sensitized solar cells, the optimal value among each parameter experimental value related to efficiency was found using formulas for fill factor (FF) and conversion efficiency.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1676-1681
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• 2006

We report on Organic Vapor Phase Deposition $(OVPD^{(R)})$ an innovative deposition technology for organic light emitting device (OLED) and organic semiconductor manufacturing. The combination of $OVPD^{(R)}$ with Close Coupled Showerhead (CCS) technology results in manufacturing equipment with vast potential for cost effective manufacturing of OLED displays commercially competitive to LCD. The actual $OVPD^{(R)}$ equipment concept and design is discussed: Computational Fluid Dynamic (CFD) modeling is compared with experimental results proving the excellent controllability of the deposition process. Further other production relevant deposition properties are being reviewed e.g. high deposition rates and high organic material utilization efficiency of the $OVPD^{(R)}$ - Technology. Data from devices made by $OVPD^{(R)}$ show comparable/ superior performance to those fabricated with conventional vacuum thermal evaporation (VTE) techniques. An outlook on further potentials of $OVPD^{(R)}$ with respect to enabling advanced organic device structures is given.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.581-584
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• 2003

Most modeling about dynamic behavior of Antiferroelectric Liquid Crystal (AFLC) is limited to the hysteric characteristics of AFLC cells or thresholdless switching of frustrated AFLC cells. In this paper, domain growth of AFLC cells is modeled with extended bilayer model. When driving pulses that consist of a selection voltage, a bias voltage, and a reset voltage are applied to the AFLC cell, its dynamic behavior is simulated.

• Journal of the Semiconductor & Display Technology
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• v.8 no.1
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• pp.43-48
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• 2009

We have examined the problem of the number of quad-tree blocks that an n-dimensional rectangle will be decomposed into on the average. the contribution of this paper are both practical and theoretical. In this paper, we develops the overlapping multi-scale models and the region quad-tree models which is useful in computer graphics animation, image processing, pattern recognition and also for modeling three dimensional objects. These models, which represent something of a conceptual departure from other models developed for multi-scale framework were developed with the specific interest of producing smooth estimates.