• Title/Summary/Keyword: Dislocation cell structure

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Dislocation dynamics simulation on stability of high dense dislocation structure interacting with coarsening defects

  • Yamada, M.;Hasebe, T.;Tomita, Y.;Onizawa, T.
    • Interaction and multiscale mechanics
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    • v.1 no.4
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    • pp.437-448
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    • 2008
  • This paper examined the stability of high-dense dislocation substructures (HDDSs) associated with martensite laths in High Cr steels supposed to be used for FBR, based on a series of dislocation dynamics (DD) simulations. The DD simulations considered interactions of dislocations with impurity atoms and precipitates which substantially stabilize the structure. For simulating the dissociation processes, a point defect model is developed and implemented into a discrete DD code. Wall structure composed of high dense dislocations with and without small precipitates were artificially constructed in a simulation cell, and the stability/instability conditions of the walls were systematically investigated in the light of experimentally observed coarsening behavior of the precipitates, i.e., stress dependency of the coarsening rate and the effect of external stress. The effect of stress-dependent coarsening of the precipitates together with application of external stress on the subsequent behavior of initially stabilized dislocation structures was examined.

Evaluation of Microscopic Degradation of Copper and Copper Alloy by Electrical Resistivity Measurement (전기비저항 측정에 의한 구리와 구리합금의 미시적 열화평가)

  • Kim, Chung-Seok;Nahm, Seung-Hoon;Hyun, Chang-Young
    • Journal of the Korean Society for Nondestructive Testing
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    • v.30 no.5
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    • pp.444-450
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    • 2010
  • In the present study, the microscopic degradation of copper and copper alloy subjected to cyclic deformation has been evaluated by the electrical resistivity measurement using the DC four terminal potential method. The copper (Cu) and copper alloy (Cu-35Zn), whose stacking fault energy is much different each other, were cyclically deformed to investigate the response of the electrical resistivity to different dislocation substructures. Dislocation cell substructure was developed in the Cu, while the planar array of dislocation structure was developed in the Cu-35Zn alloy increasing dislocation density with fatigue cycles. The electrical resistivity increased rapidly in the initial stage of fatigue deformation in both materials. Moreover, after the fatigue test it increased by about 7 % for the Cu and 6.5 % for the Cu-35Zn alloy, respectively. From these consistent results, it may be concluded that the dislocation cell structure responds to the electrical resistivity more sensitively than the planar array dislocation structure evolved during cyclic fatigue.

Microstructure Evolution of 15Cr ODS Steel by a Simple Torsion Test (단순 전단변형에 의한 15Cr 산화물 분산강화 강의 미세조직 변화)

  • Jin, Hyun Ju;Kang, Suk Hoon;Kim, Tae Kyu
    • Journal of Powder Materials
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    • v.21 no.4
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    • pp.271-276
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    • 2014
  • 15Cr-1Mo base oxide dispersion strengthened (ODS) steel which is considered to be as a promising candidate for high- temperature components in nuclear fusion and fission systems because of its excellent high temperature strength, corrosion and radiation resistance was fabricated by using mechanical alloying, hot isostatic pressing and hot rolling. Torsion tests were performed at room temperature, leading to two different shear strain routes in the forward and reverse directions. In this study, microstructure evolution of the ODS steel during simple shearing was investigated. Fine grained microstructure and a cell structure of dislocation with low angle boundaries were characterized with shear strain in the shear deformed region by electron backscattered diffraction (EBSD). Grain refinement with shear strain resulted in an increase in hardness. After the forward-reverse torsion, the hardness value was measured to be higher than that of the forward torsion only with an identical shear strain amount, suggesting that new dislocation cell structures inside the grain were generated, thus resulting in a larger strengthening of the steel.

Nondestructive Techniques for Characterization of Microstructural Evolution during Low Cycle Fatigue of Cu and Cu-Zn Alloy (Cu와 Cu-Zn 합금의 저주기피로 동안 발달한 미세조직 평가를 위한 비파괴기술)

  • Kim, Chung-Seok;Jhang, Kyung-Young;Hyun, Chang-Young
    • Journal of the Korean Society for Nondestructive Testing
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    • v.31 no.1
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    • pp.32-39
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    • 2011
  • The object of this study is to evaluate and discriminate nondestructively the dislocation substructures of Cu and Cu-Zn alloy subjected to the low-cycle-fatigue. The ultrasonic wave velocity, electrical resistivity and positron annhilation lifetime(PAL) were measured to the nondestructive testing. Cyclic fatigue test of Cu and Cu-Zn alloy with much different stacking fault energies was conducted and the correlations between dislocation behavior and nondestructive parameters were studied. Dislocation cell substructure was developed in Cu, while planar array of dislocation structure was developed in Cu-35Zn alloy only increasing dislocation density with fatigue cycles. Decrease in ultrasonic wave velocity, increase in electrical resistivity and PAL were shown because of the development of lattice defects, dislocations and vacancies, by cyclic fatigue at room temperature. In contrast to Cu-Zn alloy of the planar-array dislocation substructure showing continuous changes in the nondestructive parameters, it does not make any noticeable changes in the nondestructive parameters after the evolution of dislocation cell substructure in Cu.

Characteristics of Barkhausen Noise Properties and Hysteresis Loop on Tensile Stressed Rolled Steels

  • Kikuchi, Hiroaki;Ara, Katsuyuki;Kamada, Yasuhiro;Kobayashi, Satoru
    • Journal of Magnetics
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    • v.16 no.4
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    • pp.427-430
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    • 2011
  • The rolled steels for welded structure applied tensile stress have been examined by means of magnetic Barkhausen noise (MBN) method and of a physical parameter obtained from a hysteresis loop. The behaviors of MBN parameters and coercive force with tensile stress were discussed in relation to microstructure changes. There is no change in MBN parameters and coercive force below yield strength. The coercive force rises rapidly with tensile stress above yield strength. On the other hand, the rms voltage and the peak in averaged rms voltage take a maximum around yield strength and then decreases. The magnetomotive force at peak in the averaged rms voltage shows a minimum around yield strength. These phenomena are attributed to the combined effects of cell texture and dislocation density. In addition, the behaviors of MBN parameters around yield strength may be reflected by the localized changes in strain field due to the formation of dislocation tangles.

Hepatic Cell Membrane Changes of Rats in the Early Postmortem Period

  • Yoon, Hyung-Won;Yoon, Chong-Guk;Cho, Hyun-Gug
    • Biomedical Science Letters
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    • v.8 no.2
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    • pp.89-93
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    • 2002
  • To investigate the postmortem changes in hepatic cell membrane, the rats were sacrificed with cervical dislocation and kept in an incubator at $25^{\circ}C$, 70% of humidity for 12 hours. The biochemical experiments in postmortem were done at 2, 4, 8 and 12 hours. The degree of rigor mortis and algor mortis were increased with the time during 12 hours. The contents of hepatic malondialdehyde were rapidly increased ai 2 hours, and gradually decreased afterward. In histological findings, after 8 hours, the clotted blood was seen in central vein and sinusoids, and especially portal veins were dilated a1though the structure of hepatic lobules was preserved well. Furthermore, both in the histochemical and enzymatic examinations, membrane bounding alkaline phosphatase activities were gradually decreased with the time. In conclusion, the activity of membrane bounding alkaline phosphatase was linearly decreased with time in the early postmortem period and so it might be referred to the possibility fur the estimation of death time in the early postmortem period.

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The Relationship Between Hydrogen Trapping Behavior and SSCC Suceptibility of API X60/65 Grade Steels

  • Lee, Jae Myung;Kim, Jin Suk;Kim, Kyoo Young
    • Corrosion Science and Technology
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    • v.2 no.3
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    • pp.109-116
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    • 2003
  • It is well known that SSCC (sulfide stress corrosion cracking) is caused by drastic ingression of hydrogen during the service and accumulation of hydrogen near the potential crack initiation site in the material. It is important to characterize the hydrogen trapping behavior to evaluate the service performance of the high strength pipeline steels. In this study. the relationship between the hydrogen trapping behavior and SSCC susceptibility is evaluated in terms of alloy composition, microstructure and carbide behavior. The hydrogen trapping behavior was measured by electrochemical hydrogen permeation test cell (Devanathan cell). The SSCC susceptibility is evaluated by constant extension rate test and constant strain lest method. The hydrogen trapping behavior is affected greatly by microstructure and nature of carbide particles. The fine TiC, and NbC in the matrix of ferritic structure acts as strong irreversible trap sites whereas the bainitic structure acts as reversible trap site. The SSCC susceptibility is closely related to not only the hydrogen trapping behavior but also the loading condition. As the activity of reversible trap site increases, SSCC susceptibility decreases under static loading condition below yield strength, whereas SSCC susceptibility increases under dynamic loading condition or above yield strength. As the activity of irreversible trap site increases. SSCC susceptibility increases regardless of loading condition. It is cased by the mixed effect of dislocation on hydrogen diffusion and trapping behavior.

Microstructural evolution of rheocast Al-6.2wt.%Si alloy with isothermal stirring (Al-6.2wt.%Si 합금의 등온교반시간에 따른 미세조직변화)

  • Lee, Jung-Ill;Park, Ji-Ho;Kim, Gyeung-Ho;Lee, Ho-In
    • Journal of Korea Foundry Society
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    • v.15 no.5
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    • pp.514-522
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    • 1995
  • The microstructural evolution with isothermal stirring during semi-solid state processing of hypoeutectic Al-6.2wt%Si alloy was studied. Substructure of the individual primary solid particle in the slurry was investigated through transmission electron microscopy(TEM). Formation of subgrain boundaries on the rheocast Al-6.2wt%Si alloy is observed and the misorientation between the grains is shown typically under 2 degrees by analyzing selected area diffraction (SAD) and convergent beam electron diffraction (CBED) patterns. The existence of high angle grain boundaries are also observed in the alloy. Based upon these observations, mechanisms for the primary particles fragmentation are considered. With isothermal stirring, the dislocation density increases, and the evolution of dislocation cell structure takes place, which is interpreted as a process of achieving uniform deformation by dynamic recovery under applied shear stress.

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Microstructural Evolution with Annealing of Ultralow Carbon IF Steel Severely Deformed by Six-Layer Stack ARB Process (6층겹침ARB공정에 의해 강소성가공된 극저탄소IF강의 어닐링에 따른 미세조직 변화)

  • Lee, Seong-Hee
    • Korean Journal of Materials Research
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    • v.22 no.8
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    • pp.403-408
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    • 2012
  • A sample of ultra low carbon IF steel was processed by six-layer stack accumulative roll-bonding (ARB) and annealed. The ARB was conducted at ambient temperature after deforming the as-received material to a thickness of 0.5 mm by 50% cold rolling. The ARB was performed for a six-layer stacked, i.e. a 3 mm thick sheet, up to 3 cycles (an equivalent strain of ~7.0). In each ARB cycle, the stacked sheets were, first, deformed to 1.5 mm thickness by 50% rolling and then reduced to 0.5 mm thickness, as the starting thickness, by multi-pass rolling without lubrication. The specimen after 3 cycles was then annealed for 0.5 h at various temperatures ranging from 673 to 973 K. The microstructural evolution with the annealing temperature for the 3-cycle ARB processed IF steel was investigated in detail by transmission electron microscopy observation. The ARB processed IF steel exhibited mainly a dislocation cell lamella structure with relatively high dislocation density in which the subgrains were partially observed. The selected area diffraction (SAD) patterns suggested that the misorientation between neighboring cells or subgrains was very small. The thickness of the grains increased in a gradual way up to 873 K, but above 898 K it increased drastically. As a result, the grains came to have an equiaxed morphology at 898 K, in which the width and the thickness of the grains were almost identical. The grain growth occurred actively at temperatures above 923 K.

Effect of KCN Treatment on Cu-Se Secondary Phase of One-step Sputter-deposited CIGS Thin Films Using Quaternary Target

  • Jung, Sung Hee;Choi, Ji Hyun;Chung, Chee Won
    • Current Photovoltaic Research
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    • v.2 no.3
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    • pp.88-94
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    • 2014
  • The structural, optical and electrical properties of sputter-deposited CIGS films were directly influenced by the sputtering process parameters such as substrate temperature, working pressure, RF power and distance between target and substrate. CIGS thin films deposited by using a quaternary target revealed to be Se deficient due to Se low vapor pressure. This Se deficiency affected the overall stoichiometry of the films, causing the films to be Cu-rich. Current tends to pass through the Cu-Se channels which act as the shunting path increasing the film conductivity. The crystal structure of CIGS thin films depends on the substrate orientation due to the influence of surface morphology, grain size and stress of Mo substrate. The excess of Cu was removed from the CIGS films by KCN treatment, achieving a suitable Cu concentration (referred as Cu-poor) for the fabrication of solar cell. Due to high Cu concentrations on the CIGS film surface induced by Cu-Se phases after CIGS film deposition, KCN treatment proved to be necessary for the fabrication of high efficiency solar cells. Also during KCN treatment, dislocation density and lattice parameter decreased as excess Cu was removed, resulting in increase of bandgap and the decrease of conductivity of CIGS films. It was revealed that Cu-Se secondary phase could be removed by KCN wet etching of CIGS films, allowing the fabrication of high efficiency absorber layer.