• Journal of Welding and Joining
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• v.21 no.2
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• pp.82-88
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• 2003

The bonding phenomenon and mechanism in the transient liquid phase bonding(TLP Bonding) of directionally solidified Ni base superalloy, GTD-111 was investigated. At the bonding temperature of 1403K, liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B and Si into the base metal and solids in the bonded interlayer grew epitaxially from mating base metal inward the insert metal. The number of grain boundaries formed at the bonded interlayer was corresponded with those of base metal. The liquation of grain boundary and dendrite boundary occurred at 1433K. At the bonding temperature of 1453K which is higher than liquation temperature of grain boundary, liquids of the Insert metal were connected with liquated grain boundaries and compositions in each region mixed mutually. In Joints held for various time at 1453t phases formed at liquated grain boundary far from the interface were similar to those of bonded interlayer. With prolonged holding time, liquid phases decreased gradually and liquids of continuous band shape divided many island shape. But liquid phases did not disappeared after holding for 7.2ks at 1453k. Isothermal solidification process at the bonding temperature which is higher than the liquation temperature of the grain boundary was controlled by diffusion of Ti to be result in liquation than B or Si. in insert metal. (Received January 15, 2003)

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.798-802
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• 2002

Metallurgical studies on the bonded interlayer of directionally solidified Ni-base superalloy GTD111 joints were carried out during transient liquid phase bonding. The formation mechanism of solid during solidification process was also investigated. Microstructures at the bonded interlayer of joints were characterized with bonding temperature. In the bonding process held at 1403K, liquid insert metal was eliminated by well known mechanism of isothermal solidification process and formation of the solid from the liquid at the bonded interlayer were achieved by epitaxial growth. In addition, grain boundary formed at bonded interlayer is consistent with those of base metal. However, in the bonding process held at 1453K, extensive formation of the liquid phase was found to have taken place along dendrite boundaries and grain boundaries adjacent to bonded interlayer. Liquid phases were also observed at grain boundaries far from the bonding interface. This phenomenon results in liquation of grain boundaries. With prolonged holding, liquid phases decreased gradually and changed to isolated granules, but did not disappeared after holding for 7.2ks at 1473K. This isothermal solidification occurs by diffusion of Ti to be result in liquation. In addition, grain boundaries formed at bonded interlayer were corresponded with those of base metal. In the GTD-ll1 alloy, bonding mechanism differs with bonding temperature.

• Journal of Welding and Joining
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• v.21 no.3
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• pp.78-84
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• 2003

The changes of microstructure and hardness of TLP bonds of directionally solidified Ni base superalloy, GTD-111, with variation of homogenizing and aging treatment were investigated. The specimens were bonded at 1403K for 7.2ks using different insert metals such as MBF-50, MBF-80 and MBF-90 and they were homogenized at 1393K with various holding time. At center of bonded interlayer homogenized for hold time 30h, the contents of aluminum and titanium were approximately 90% and 95% of base metal, respectively. In this study, aging was performed at three different kinds : one step aging ; 1113K $\times$ 16h, two step aging ; 1113K $\times$ 10h ⇒ 1103K $\times$ 10h, three step aging ; 1113K $\times$ 10h ⇒ 1103K $\times$ 8h ⇒ 922K $\times$ 24h. ${\gamma}$' volume fraction and hardness of joints were high in the sequence of one step, two step and three step aging, whereas ${\gamma}$' volume fraction and hardness of joints obtained by three step aging treatment were higher than those of raw material. Tensile properties of joints bonded with MBF-80 and MBF-90, homogenized at 1393K for 30h and then three step aged became excellent than those of raw material, however, joint bonded with MBF-50 was poor.

• Proceedings of the KWS Conference
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• 2002.05a
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• pp.96-98
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• 2002

• Journal of Welding and Joining
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• v.21 no.2
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• pp.89-96
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• 2003

The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GTD-111 was investigated. Bonds were fabricated using a series of holding times(0-7.2ks) at three different temperatures(1403, 1418 and 1453K) under a vacuum of 13.3mPa. In raw material, ${\gamma}$- ${\gamma}$' eutectic phases, platelet η phases, MC carbide and PFZ were seen in interdendritic regions or near grain boundary and size of primary ${\gamma}$' precipitates near interdendritic regions were bigger than core region. The primary ${\gamma}$' precipitates in dendrite core were dissolved early in bonding process, but ${\gamma}$' precipitates near interdendritic regions were dissolved partially and shape changed. The dissolution rate increased with increasing temperature. Phases in interdendritic regions or near pain boundary continually changed with time at the bonding temperature. In the bonding temperature of 1403K, eutectic phases had not significantly changed, but η phases had transformed from platelet shape to needle morphology and PFZ region had widened with time. The interdendritic region and near pain boundary were liquated partially at 1423k and fully at 1453k by reaction of η phases and PFZ. In the bonding temperature of 1453K, interdendritic region and near pain boundary were liquated and then new phases which mixed with η phases, PFZ and MC carbide crystallized during cooling. Crystallized η phases transformed from rod shape to platelet shape with increasing holding time.

• Journal of Korea Foundry Society
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• v.27 no.2
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• pp.77-82
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• 2007

The effects of thermal gradient and solidification rate on the dendrite arm spacing and carbide morphology were investigated in directionally solidified Ni-base superalloy, CM 247LC. Thermal gradient was controlled by changing the position of the cold chamber and the furnace set temperature. The interface morphology changed from the planar to dendritic as increasing solidification rate. It was found that the dendrite spacing decreased as increasing the thermal gradient as well as the solidification rate. Also, as increasing solidification rate, carbide morphology changed from blocky shape to script and spotty shapes.

• Journal of Welding and Joining
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• v.25 no.5
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• pp.45-50
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• 2007

The Ni-base superalloy GTD111 DS is used in the first stage blade of high power land-based gas turbines. Advanced repair technologies of the blade have been introduced to the gas turbine industry over recent years. The effect of the filler metal powder on Transient Liquid Phase bonding phenomenon and tensile mechanical properties was investigated on the GTD111 DS superalloy. At the filler metal powder N series, the base metal powders fully melted at the initial time and a large amount of the base metal near the bonded interlayer was dissolved by liquid inter metal. Liquid filler metal powder was eliminated by isothermal solidification which was controlled by the diffusion of B into the base metal. The solids in the bonded interlayer grew from the base metal near the bonded interlayer inward the insert metal during the isothermal solidification. The bond strength of N series filler metal powder was over 1000 MPa. and ${\gamma}'$ phase size of N series TLP bonded region was similar with base metal by influence of Ti, Al elements. At the insert metal powder M series, the Si element fluidity of the filler metal was good but microstructure irregularity on bonded region because of excessive Si element. Nuclear of solids formed not only from the base metal near the bonded interlayer but also from the remained filler metal powder in the bonded interlayer. When the isothermal solidification was finished, the content of the elements in the boned interlayer was approximately equal to that of the base metal. But boride and silicide formed in the base metal near the bonded interlayer. And these boride decreased with the increasing of holding time. The bond strength of M series filler metal powder was about 400 MPa.

• Korean Journal of Materials Research
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• v.8 no.9
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• pp.831-836
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• 1998

The B1914 Ni-base superalloy was manufactured according to crystal structures of poly-, directionally solidified- and single crystals. We observe deformation as type of different crystal structure from room to high temperature. Specimens are controled by cooling rate and thermal gradient and then heat treatment in vacuum and then cooling with Ar gas. Different crystal structure has different stress-strain characteristic. At $600^{\circ}C$, yield strength and ultimate strength is increased single-, directionally solidified- and poly crystals in order.

• Korean Journal of Materials Research
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• v.12 no.12
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• pp.897-903
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• 2002

Morphological evolution and growth mechanism at the solid/liquid interface during solidification were investigated in the Ni-base superalloy GTD111M by directional soldification and quenching(DSQ) technique. The experiments were conducted by changing solidification rate(V) and thermal gradient(G) which are major solidification process variables. High thermal gradient condition could be obtained by increasing the furnace temperature and closely attaching the heating and cooling zones in the Bridgeman type furnace. The dendritic/equiaxed transition was found in the G/V value lower than $0.05$\times$10{^3}^{\circ}C$s/$\textrm{mm}^2$, and the planar interface of the MC-${\gamma}$ eutectic was found under $17 $\times$ 10{^3}^{\circ}C$ s/$\textrm{mm}^2$. It was confirmed that the dendrite spacing depended on the cooling rate(GV), and the primary spacing was affected by the thermal gradient more than solidification rate. The dendrite lengths were decreased as increasing the thermal graditne, and the dendrite tip temperature was close to the liquidus temperature at $50 \mu\textrm{m}$/s.

• Journal of Korea Foundry Society
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• v.33 no.5
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• pp.193-203
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• 2013

The Ni-base superalloy CM247LC was directionally solidified (DS) using the Bridgman-type furnace to understand the effect of the chill plate on the microstructural evolution, such as dendrite arm spacing, microporosity, and MC-type carbide. The DS process was also modeled by the PROCAST to predict the solidification rate, thermal gradient, and resultant cooling rate in the entire length of the DS specimen. Due to the quenching effects of chill plate, four distinct areas were found to form in the specimen, in which the solidification rate was changed, during DS at a given withdrawal rate of 0.083 mm/s. Among the microstructural features investigated, the dendrite arm spacings and average size of the MC-type carbide near the chill plate were found to be influenced by the quenching effect of the chill plate. However, no significant influence was found on the size and volume fraction of microporosity, and the volume fraction of the MC-type carbide. The relationship between the microstructural features and the solidification variables was also analyzed and discussed on the basis of a combination of experimental and modeling results.