• 제목/요약/키워드: Direct printing

검색결과 203건 처리시간 0.024초

Interconnecting Nanomaterials for Flexible Substrate and Direct Writing Process

  • 좌용호
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2012년도 춘계학술발표대회
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    • pp.58.1-58.1
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    • 2012
  • Direct write technologies provide flexible and economic means to manufacture low-cost large-area electronics. In this regard inkjet printing has frequently been used for the fabrication of electronic devices. Full advantage of this method, which is capable of reliable direct patterning with line and space dimensions in the 10 to 100 um regime, is only made with all-solution based processing. Among these printable electronic materials, silver and copper nanoparticles have been used as interconnecting materials. Specially, solutions of organic-encapsulated silver and copper nanoparticles may be printed and subsequently annealed to form low-resistance conductor patterns. In this talk, we describe novel processes for forming silver nanoplates and copper ion complex which have unique properties, and discuss the optimization of the printing/annealing processes to demonstrate plastic-compatible low-resistance conductors. By optimizing both the interconnecting materials and the surface treatments of substrate, it is possible to produce particles that anneal at low-temperatures (< $200^{\circ}C$) to form continuous films having low resistivity and appropriate work function for formation of rectifying contacts.

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Lateral p-n junction Diode with organic single crystal by direct printing

  • Park, Yoon kyoung;Sung, Myung Mo
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.144.1-144.1
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    • 2016
  • We fabricate organic single crystal nanowire heterojunction p-n diode poly(3-hexylthiophene)(P3HT) and from Phenyl-C61-butyric acid methyl ester(PCBM) using by liquid-bridge mediated nanotransfer molding(LB-nTM) method. LB-nTM has been reported an one step direct printing method for making well-aligned nanowire arrays. Moreover, multi-patterning nanostructures can be fabricated with the consecutive printing process. As a result, it is possible to make simple and basic concept of heterojunction devices such as lateral organic p-n nanojunction diode. P3HT/PCBM nanowires heterojunction diode has rectifying behavior with on/off ratios of ~20.

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Electric Circuit Fabrication Technology using Conductive Ink and Direct Printing

  • 정재우;김용식;윤관수
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2009년도 춘계학술발표대회
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    • pp.12.1-12.1
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    • 2009
  • For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

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Single-Crystal Organic Semiconductor Nanowires as Building Blocks for Nanojunction Devices

  • 이기석;이린;성명모
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.261.1-261.1
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    • 2013
  • Well-aligned nanowire arrays can be used as building blocks for nanoscale device. Recently, we reported that well-aligned single-crystal organic nanowires has been created by using a direct printing method which is named liquid-bridge mediated nanotransfer molding (LB-nTM). Moreover, multi-layering nanostructures can be fabricated by repeating this printing process. As a result, it is possible to make simple and basic concept of heterojunction devices such as crossed nanowire devices. We fabricated crossed single-crystal organic nanowires nanojunction devices from 6,13-bis (triisopropylsilylethynyl) pentacene (TIPS-PEN) and fullerene (C60) single-crystal nanowires using by direct printing method in solution process. Crossed TIPSPEN/ C60 single-crystal nanowires diode has rectifying behavior with on/off ratios of ~13. In addition, the device shows photodiode characteristics as well as rectification. Our study represent methodology of heterojunction devices using single-crystal nanowires, thereby provide a new direction of future nanoelectronics.

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기판으로부터의 영향을 제거한 전기수력학 젯 프린팅 및 그 특성 조절 (Electrohydrodynamic Jet Printing Capable of Removing Substrate Effects and Modulating Printing Characteristics)

  • 이준성;김영재;강병근;김상윤;박재홍;황정호;김용준
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1747-1751
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    • 2008
  • Electrohydrodynamic jet printing (EHDP) technique is widely used for the direct writing. However, in the existing EHDP method, the printing characteristics are affected by the printing substrate used, and the line width of the printed is determined by the geometry of the nozzle. We propose an EHDP method which is capable of (1) removing the effect from the substrate, and (2) controlling the line width through the ON/OFF control of the each nozzle in the nozzle array. Printing characteristics of our EHDP system were examined and successful ON/OFF control of the nozzle array were demonstrated. By using the proposed EHDP, it is expected that stable meniscus regardless of the substrate and different line widths even using the same nozzle can be achieved.

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Direct Transfer Printing of Nanomaterials for Future Flexible Electronics

  • 이태윤
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 춘계학술발표대회
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    • pp.3.1-3.1
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    • 2011
  • Over the past decade, the major efforts for lowering the cost of electronics has been devoted to increasing the packaging efficiency of the integrated circuits (ICs), which is defined by the ratio of all devices on system-level board compared to the area of the board, and to working on a larger but cheaper substrates. Especially, in flexible electronics, the latter has been the favorable way along with using novel nanomaterials that have excellent mechanical flexibility and electrical properties as active channel materials and conductive films. Here, the tool for achieving large area patterning is by printing methods. Although diverse printing methods have been investigated to produce highly-aligned structures of the nanomaterials with desired patterns, many require laborious processes that need to be further optimized for practical applications, showing a clear limit to the design of the nanomaterial patterns in a large scale assembly. Here, we demonstrate the alignment of highly ordered and dense silicon (Si) NW arrays to anisotropically etched micro-engraved structures using a simple evaporation process. During evaporation, entropic attraction combined with the internal flow of the NW solution induced the alignment of NWs at the corners of pre-defined structures. The assembly characteristics of the NWs were highly dependent on the polarity of the NW solutions. After complete evaporation, the aligned NW arrays were subsequently transferred onto a flexible substrate with 95% selectivity using a direct gravure printing technique. As proof-of-concept, flexible back-gated NW field effect transistors (FETs) were fabricated. The fabricated FETs had an effective hole mobility of 0.17 $cm2/V{\cdot}s$ and an on/off ratio of ${\sim}1.4{\times}104$. These results demonstrate that our NW gravure printing technique is a simple and effective method that can be used to fabricate high-performance flexible electronics based on inorganic materials.

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FDM 3D Printing 기술을 응용한 직접식 세라믹 쾌속툴링 (Ceramic Direct Rapid Tooling with FDM 3D Printing Technology)

  • 신근식;권현규;강용구;오원택
    • 한국기계가공학회지
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    • 제18권7호
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    • pp.83-89
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    • 2019
  • In the conventional casting and forging method, there is a disadvantage that a mold is an essential addition, and a production cost is increased when a small quantity is produced. In order to overcome this disadvantage, a metal 3D printing production method capable of directly forming a shape without a mold frame is mainly used. In particular, overseas research has been conducted on various materials, one of which is a metal printer. Similarly, domestic companies are also concentrating on the metal printer market. However, In this case of the conventional metal 3D printing method, it is difficult to meet the needs of the industry because of the high cost of materials, equipment and maintenance for product strength and production. To compensate for these weaknesses, printers have been developed that can be manufactured using sand mold, but they are not accessible to the printer company and are expensive to machine. Therefore, it is necessary to supply three-dimensional casting printers capable of metal molding by producing molds instead of conventional metal 3D printing methods. In this study, we intend to reduce the unit price by replacing the printing method used in the sand casting printer with the FDM method. In addition, Ag paste is used to design the output conditions and enable ceramic printing.

그라비아 인쇄물의 망점 형성을 위한 포토레지스터 코팅층의 레이저 직접 페터닝 (Laser Direct Patterning of Photoresist Layer for Halftone Dots of Gravure Printing Roll)

  • 서정;이제훈;한유희
    • 한국레이저가공학회지
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    • 제3권2호
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    • pp.35-43
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    • 2000
  • Laser direct patterning of the coated photoresit (PMER-NSG31B) layer was studied to make halftone dots on gravure printing roll. The selective laser hardening of photoresist by Ar-ion laser(wavelength : 333.6nm∼363.8nm) was controlled by the A/O modulator. The coating thickness in the range of 5㎛∼11㎛ could be obtained by using the up-down directional moving device along the vertically located roll. The width, thickness and hardness of the hardened lines formed under laser power of 200∼260㎽ and irradiation time of 4.4∼6.6$\mu$ sec/point were investigated after developing. The hardened width increased according to the increase of coating thickness. Though the hardened thickness was changed due to the effect of the developing solution, the hardened layer showed good resistance to the scratching of 2H pencil. Also, the hardened minimum line widths of 10㎛ could be obtained. The change of line width was also found after etching, and the minimum line widths of 6㎛ could be obtained. The hardened lines showed the good resistance to the etching solution. Finally, the experimental data could be applied to make gravure halftone dots using the developed imaging process, successfully.

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3 차원 프린팅 기술을 이용한 신개념 경수로 핵연료 기술 개발에 관한 연구 (Development of Innovative Light Water Reactor Nuclear Fuel Using 3D Printing Technology)

  • 김효찬;김현길;양용식
    • 한국정밀공학회지
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    • 제33권4호
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    • pp.279-286
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    • 2016
  • To enhance the safety of nuclear reactors after the Fukushima accident, researchers are developing various types of accident tolerant fuel (ATF) to increase the coping time and reduce the generation of hydrogen by oxidation. Coated cladding, an ATF concept, can be a promising technology in view of its commercialization. We applied 3D printing technology to the fabrication of coated cladding as well as of coated pellets. Direct metal tooling (DMT) in 3D printing technologies can create a coated layer on the tubular cladding surface, which maintains stability during corrosion, creep, and wear in the reactor. A 3D laser coating apparatus was built, and parameter studies were carried out. To coat pellets with erbium using this apparatus, we undertook preliminary experiments involving metal pellets. The adhesion test showed that the coated layer can be maintained at near fracture strength.

직접 스크린 프린팅법으로 제조된 고분자 전해질 연료전지의 고성능 전극 (High Performance Electrode of Polymer Electrolyte Membrane Fuel Cells Prepared by Direct Screen Printing Process)

  • 임재욱;최대규;류호진
    • 마이크로전자및패키징학회지
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    • 제11권1호
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    • pp.65-69
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    • 2004
  • 스크린 프린팅법은 고분자 전해질 연료전지의 전극 촉매층 제조의 편리함과 적용성의 면에서 가장 일반적인 방법 중에 하나이다. 본 논문은 기존의 방법과 비교하여 매우 낮은 백금 함침량을 가지기 때문에 경쟁적이고, 부가적인 공정 없이 swelling 문제를 간단하게 억제시켜 개선된 스크린 프린팅 법을 제안하였다. 특히, 가스켓 일체형 MEA는 고분자 전해질 연료전지의 작동 중에 가스 침투의 영향을 방지하여 고전류 영역에서 기존의 방법으로 제조된 MEA보다 높은 성능을 가지게 제작하였다. 이와 같은 방법들은 보다 간단하고 빠른 제조의 기회를 준다.

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