• Title/Summary/Keyword: Diplexers

Search Result 6, Processing Time 0.016 seconds

Design of X/Ku band Waveguide Diplexers with H-plane T-junction (자계면 T-접합 구조를 갖는 X/Ku 밴드 도파관 다이플렉서의 설계)

  • Eum, Jeong-Hee;Choi, Hak-Keun;Song, Choong-Ho
    • The Journal of the Institute of Internet, Broadcasting and Communication
    • /
    • v.13 no.2
    • /
    • pp.33-39
    • /
    • 2013
  • In this paper, X/Ku band waveguide diplexers with H-plane T-junction for satellite communication systems is proposed and its characteristics is cinfirmed. Two frequency bands such as X(7.25 ~ 8.4 GHz) and Ku(12.25 ~ 14.5 GHz) can be separated by the proposed waveguide diplexers. A diplexers is normally including low pass filter, high pass filter and junction waveguide. To simplify the structure of the proposed diplexers, the proposed waveguide diplexers is using impedance matching technique on H-plane of the high pass filter without low pass filter. To use vertical and horizontal polarization, the proposed diplexers with orthomode transducer(OMT) characteristics is also designed. Therefore, it is confirmed that the proposed waveguide diplexers can be used as dual-band and dual-polarization diplexers for satellite communication feed systems.

Technologies for RF System in Package (SIP)

  • Mathews, Doug
    • Proceedings of the International Microelectronics And Packaging Society Conference
    • /
    • 2003.09a
    • /
    • pp.19-39
    • /
    • 2003
  • Embedded Laminate Embedded RF Functional Blocks.Base Library of Laminate Embedded Filters and Baluns developed for 2.4GHz Applications -S-Parameters are provided at connection points -Utilizes a low cost 2 core construction.Statistical Variation Study in Report Phase.Measurements over variants show solid performance.Filters and Baluns are available for customer use.Laminate Embedded RF Functions - Various Filters, BALUNs, couplers, etc. for Bluetooth, 802.11, and Cellular.LTCC Embedded RF Functions - Various Filters, BALLNs, Diplexers, Antenna Switches, couplers, etc. for Bluetooth, 802.11, and Cellular.Eulbedded Passives - Various Inductor topologies Performance different than ideal or discrete inductor Must look at inductor performance in overall RF function - Working on embedded ceramic capacitors in laminate . Embedded Shields - Program in place to identify and define key design rules

  • PDF

Design of Active Antenna Diplexers Using UWB Planar Monopole Antennas (초광대역 평면형 모노폴 안테나를 이용한 능동 안테나 다이플렉서의 설계)

  • Kim, Joon-Il;Lee, Won-Taek;Chang, Jin-Woo;Jee, Yong
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.18 no.9
    • /
    • pp.1098-1106
    • /
    • 2007
  • This paper presents active antenna diplexers implemented into an ultra-wideband CPW(Coplanar Waveguide) fed monopole antennas. The proposed active antenna diplexer is designed to direct interconnect the output port of a wideband antenna to the input port of two active(HEMT) devices, where the impedance matching conditions of the proposed active integrated antenna are optimized by adjusting CPW(Coplanar Waveguide) feed line to be the length of 1/20 $\lambda_0$(@5.8 GHz) in planar type wideband antenna. The measured bandwidth of the active integrated antenna shows the range from 2.0 GHz to 3.1 GHz and from 5.25 GHz to 5.9 GHz. The measured peak gains are 17.0 dB at 2.4 GHz and 15.0 dB at 5.5 GHz.

Design and Fabrication of Diplexer for Dual-band GSM/DCS Application using High-Q Multilayer Inductors (고품질 적층형 인덕터를 이용한 이중 대역 GSM/DCS 대역 분리용 다이플렉서의 설계 및 제작)

  • 심성훈;강종윤;최지원;윤영중;윤석진;김현재
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.15 no.2
    • /
    • pp.165-171
    • /
    • 2004
  • In this paper, the modeling and design of high-Q multilayer passives have been investigated, and multilayer diplexer for GSM/DCS applications has been designed and fabricated using the passives. Modeling of a multilayer inductor was performed by the subsystems of distributed components, and using the modeling the optimal structures of the high-Q multilayer inductor could be designed by analyzing parasitics and couplings which affect their frequency characteristics. Multilayer diplexers for GSM/DCS applications have been designed and fabricated using LTCC technology. LPF for GSM band had the passband insertion loss of less than 0.55 dB, the return loss of more than 12 dB, and the isolation level of more than 26 dB. HPF for DCS band had the passband insertion loss of less than 0.82 dB, the return loss of more than 11 dB, and the isolation level of more than 38 dB.

Design and Fabrication of Multilayer Diplexer for Dual Band GSM/DCS Applications using Lumped Elements (집중 소자를 이용한 이중 대역 GSM/DCS용 적층형 다이플렉서의 설계 및 제작)

  • 심성훈;강종윤;최지원;윤영중;김현재;윤석진
    • Journal of the Korean Ceramic Society
    • /
    • v.40 no.11
    • /
    • pp.1090-1095
    • /
    • 2003
  • In this paper, the modeling and design of high-Q multilayer passives and multilayer diplexer for GSM/DCS applications designed and fabricated using these passives have been investigated.. To miniaturize the system, configurations of inductor and capacitor have involved a square spiral structure and a vertically-interdigitated capacitor similar to 3D interdigital structure, respectively. Multilayer diplexers for GSM/DCS applications were designed and fabricated to apply high-Q multilayer passives to practical systems, which were designed by the proposed structural and equivalent circuit model. LPF for GSM band had the passband insertion loss of less than 0.55 dB, the return loss of more than 12 dB, and the isolation level of more than 26 dB by locating attenuation pole at 1800 MHz. HPF for DCS band had the passband insertion loss of less than 0.82 dB, the return loss of more than 11 dB, and the isolation level of more than 38 dB by locating attenuation pole at 930 MHz.

The Fabrication and Characterization of Diplexer Substrate with buried 1005 Passive Component Chip in PCB (PCB내 1005 수동소자 내장을 이용한 Diplexer 구현 및 특성 평가)

  • Park, Se-Hoon;Youn, Je-Hyun;Yoo, Chan-Sei;Kim, Pil-Sang;Kang, Nam-Kee;Park, Jong-Chul;Lee, Woo-Sung
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.14 no.2 s.43
    • /
    • pp.41-47
    • /
    • 2007
  • Today lots of investigations on Embedded Passive Technology using materials and chip components have been carried out. We fabricated diplexers with 1005 sized-passives, which were made by burying chips in PCB substrate and surface mounting chip on PCB. 6 passive chips (inductors and capacitors) were used for the frequency divisions of $880\;MHz{\sim}960\;MHz(GSM)$ and $1.71\;GHz{\sim}1.88\;GHz(DCS)$. Two types of diplxer were characterized with Network analyzer. The chip buried diplexer showed extra 5db loss and a little deviation of 0.6GHz at aimed frequency areas, whereas the chip mounted diplexer showed man. 0.86dB loss within GSM field and max. 0.68dB within DCS field respectively. But few degradations were observed after $260^{\circ}C$ for 80min baking and $280^{\circ}C$ for 10sec solder floating.

  • PDF