• Journal of the Korean Society for Precision Engineering
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• v.27 no.1
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• pp.76-83
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• 2010

There have been many studies regarding development of autonomous excavation system which is helpful in construction sites where repetitive jobs are necessary. Unfortunately, bucket trajectory planning was excluded from the previous studies. Since, the best use of excavator is to dig efficiently; purpose of this research was set to determine an optimized bucket trajectory in order to get best digging performance. Among infinite ways of digging any given path, criterion for either optimal or efficient bucket moves is required to be established. One method is to adopt work know-how from experienced excavator operator; However the work pattern varies from every worker to worker and it is hard to be analyzed. Thus, other than the work pattern taken from experienced operator, we developed an efficiency model to solve this problem. This paper presents a method to derive a bucket trajectory from optimization theory with empirical CLUB soil model. Path is greatly influenced by physical constraints such as geometry, excavator dimension and excavator workspace. By minimizing a energy function under these constraints, an optimal bucket trajectory could be obtained.

• Journal of the Korean Institute of Intelligent Systems
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• v.17 no.6
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• pp.807-812
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• 2007

Recently, Extreme learning machine(ELM), a novel learning algorithm which is much faster than conventional gradient-based learning algorithm, was proposed for single-hidden-layer feedforward neural networks. The initial input weights and hidden biases of ELM are usually randomly chosen, and the output weights are analytically determined by using Moore-Penrose(MP) generalized inverse. But it has the difficulties to choose initial input weights and hidden biases. In this paper, an advanced method using the bacterial foraging algorithm to adjust the input weights and hidden biases is proposed. Experiment at results show that this method can achieve better performance for problems having higher dimension than others.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.631-636
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• 2002

The purpose of this study was to present the method to choose the optimization machining condition for the wire electric machine. This was completed by examining the ever- changing quality of the material and by improving the function of the wire electric discharge machine. Precision metal mold products and the unmanned wire electric discharge machining system were used and then applied in industrial fields. This experiment uses the wire electric discharge machine with brass wire electrode of 0.25mm. To measure the precision of the machining surface, average values are obtained from 3 samples of measures of center-line average roughness by using a third dimension gauge and a stylus surface roughness gauge. In this experiment, we changed no-node voltage to 7 and 9, pulse-on-time to $6\mu\textrm{s}$, $8\mu\textrm{s}$ and $10\mu\textrm{s}$, pulse-off-time to $8\mu\textrm{s}$, $10\mu\textrm{s}$ and $13\mu\textrm{s}$, and experimented on wire tension at room temperature by 1000gf, 1200gf, and 1400gf, respectively

• Journal of the Korean Society of Safety
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• v.17 no.1
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• pp.11-17
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• 2002

The purpose of this study was to present the method to choose the optimization machining condition for the wire electric machine. This was completed by examining the ever-changing quality of the material and by improving the function of the wire electric discharge machine. Precision metal mold products and the unmanned wire electric discharge machining system were used and then applied in industrial fields. This experiment uses the wire electric discharge machine with brass wire electrode of 0.25mm. To measure the precision of the machining surface, average values are obtained from 3 samples of measures of center-line average roughness by using a third dimension gauge and a stylus surface roughness gauge. In this experiment, we changed no-node voltage to 7 and 9, pulse-on-time to $6{\mu}s,\;8{\mu}s$ and $10{\mu}s$, pulse-off-time to $8{\mu}s,\;10{\mu}s$ and $13{\mu}s$, and experimented on wire tension at room temperature by 1000gf, 1200gf, and 1400gf, respectively.

• Journal of the Korean Institute of Navigation
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• v.16 no.2
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• pp.1-19
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• 1992

A Study for the relation between design parameters in conceptual stage and freight cost in operation of ocean-going bulk carrier was presented by economic criterial. Ship design procedure was followed to traditional method and programmed. The measure of merit is the Required Freight Rate(RFR). Parametric method used insteady of optimization technique due to easy to illustrate the results. Calculation results to the relation ship dimension, speed and operating cost in this paper show the influence of oil price is very important. Particularly, when oil price estimated as go up, owner choose a ship which lengh is long , breadth/draft is near 2.0 and speed is low. This program is useful for shipyard, consultant officer and owner all together.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• Journal of the Korean Graphic Arts Communication Society
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• v.26 no.1
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• pp.51-64
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• 2008

In this paper, an experiment was done where the input(scanner, digital still camera) and monitor(CRT, LCD) device used the linear multiple regression and the GOG (Gain-Offset-Gamma) characterization model to perform a color transformation. Also to color conversion method of the digital printer it used the LUT(Look Up Table), 3dimension linear interpolation and a tetrahedron interpolation method. The results are as follows. From color reappearance of digital printing case of monitor, the XYZ which it converts in linear multiple regression of input device it multiplied the inverse matrix, and then it applies the inverse GOG model and after color converting the patch of the result most which showed color difference below 5 at monitor RGB value. Also, The XYZ which is transmitted from the case input device which is a printer it makes at LAB value to convert an extreme, when the LAB value which is converted calculating the CMY with the LUT and tetrahedral interpolations the color conversion which considers the black quantity was more accurate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.731-734
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. Polishing pads play a key role in CMP, which has been recognized as a critical step to improve the topography of wafers for semiconductor fabrication. It is investigated the performance of $SiO_2-CMP$ process using commercial silica slurry as a pad conditioning temperature increased after CMP process. This study also showed the change of SEM images in the pore geometry on the CMP pad surface after use with a different pad conditioning temperature.

• Journal of Advanced Marine Engineering and Technology
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• v.34 no.2
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• pp.289-295
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• 2010

Injection molding process is one of the most important methods to produce plastic parts with high efficiency and low cost. Today, injection molded parts have been increased dramatically the demand for high strength and quality applications. In this study, In-line skates are made of Al alloy and plastic materials to replace the frame for the optimization process is all about. I interpreted through mold design, Injection molding process that minimizes the runner and the gate dimension will determine the size and shape. Runner and gate dimensions of change based on availability of the product, I'll discuss the injection molding. This report investigates that the optimum injection molding condition for minimum of shrinkage. The FEM Simulation CAE tool, Moldflow, is used for the analysis of injection molding process.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.8
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• pp.13-19
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• 2010

A design method of railway wheel profile with objective function of equivalent conicity considering wheel dimension constraint, two points contact problem between wheel and rail was proposed. New design method shows good results. New wheel profile generated from optimization process shows better dynamic performance compared with initial profile as the purpose of wheel profile design. And to verify the design method with testing the stability of new wheel profile, we conducted a critical speed test for new wheel profile using scale model applied scaling method of railway vehicle dynamics. The result of critical speed test show good agreement with that of numerical analysis. From the above results, it is seen that the design method with objective function of equivalent conicity is feasible and it could be applied to design new wheel profile efficiently.