• 제목/요약/키워드: Diffusion property

검색결과 353건 처리시간 0.024초

Two Dimensional Chloride Ion Diffusion in Reinforced Concrete Structures for Railway

  • Kang, Bo-Soon;Shim, Hyung-Seop
    • International Journal of Railway
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    • 제4권4호
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    • pp.86-92
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    • 2011
  • Chloride ion diffusion at the corner of rectangular-shaped concrete structures is presented. At the corner of rectangular-shaped concrete, chloride ion diffusion is in two-dimensional process. Chloride ions accumulate from two orthogonal directions, so that corrosion-free life of concrete structures is significantly reduced. A numerical procedure based on finite element method is used to solve the two-dimensional diffusion process. Orthotropic property of diffusion coefficient of concrete is considered and chloride ion profile obtained from numerical analysis is used to produce transformed diffusion coefficient. Comparisons of experimental data are also carried out to show the reliability of proposed numerical analysis. As a result of two-dimensional chloride diffusion, corrosion-free life of concrete structure for railway is estimated using probability of corrosion initiation. In addition, monographs that produces transformed diffusion coefficient and corrosion-free life of concrete structure are made for maintenance purpose.

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TiN의 충진처리가 확산방지막 특성에 미치는 영향(II) : Cu/TiN/Si 구조 (Effect of Stuffing of TiN on the Diffusion Barrier Property (II) : Cu/TiN/Si Structure)

  • 박기철;김기범
    • 한국재료학회지
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    • 제5권2호
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    • pp.169-177
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    • 1995
  • Cu와 Si사이의 확산방지막으로 1000$\AA$ 두께의 TiN의 특성에 대하여 면저항 측정, 식각패임자국 관찰, X선 회절, AES, TEM 등을 이용하여 조사하였다. TiN 확산방지막은 $550^{\circ}C$, 1시간의 열처리 후에 Cu의 안쪽 확산으로 인해 Si(111)면을 따라 결정결함(전위)을 형성하고, 전위 주위에 Cu 실리사이드로 보이는 석출물들을 형성함으로써 파괴되었다. Al의 경우와는 달리 Si 패임자국이 형성되지 안흔 것으로부터 TiN확산방지막의 파괴는 Cu의 안쪽 확산에 의해서만 일어나는 것을 알 수 있었다. 또한, Al의 경우에는 우수한 확산방지막 특성을 보여주었던 충진처리된 TiN가 Cu의 경우에는 거의 효과가 없는 것을 알 수 있었다. 이것은 Al의 경우에는 TiN의 결정립계에 존재하는 $TiO_{2}$가 Al과 반응하여 $Al_{2}O_{3}$를 형성함으로써 Al의 확산을 방해하는 화학적 효과가 매우 크지만, Cu의 경우에는 CuO 또는 $Cu_{2}O$와 같은 Cu 산화물은$TiO_{2}$에 비해서 열역학적으로 불안정하기 때문에 이러한 화학적 효과를 기대할 수 없으며, 따라서 충진처리 효과가 거의 없는 것으로 이해된다.

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수소 확산화염의 구조에 미치는 Lewis 수의 영향 (Effects of Lewis number on hydrogen diffusion flame structure)

  • 김후중;김용모;안국영
    • 대한기계학회논문집B
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    • 제21권9호
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    • pp.1126-1138
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    • 1997
  • An axisymmetric laminar jet diffusion flame has been numerically modelled. The present study employs the refined physical submodels to account for the detailed chemical kinetics and the variable transport properties. It is found that preferential diffusion resulting from variable transport properties significantly influences the hydrogen diffusion flame structure in terms of the spatial distribution for temperature, species concentration, thermal and mass diffusivity, Lewis number, and NO concentration. The preferential diffusion effects on the diffusion flame in the high-pressure environment are also discussed in detail.

고체산화물 연료전지를 위한 물성치 모델 및 단전지 해석 (Physical Property Models and Single Cells Analysis for Solid Oxide Fuel Cell)

  • 박준근;김선영;배중면
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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    • pp.379-381
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    • 2009
  • The simulation model for metal-supported Solid Oxide Fuel Cell(SOFC) is developed in this study. Open circuit voltage is calculated using Nernst equation and Gibbs free energy is required by thermodynamic. The exchange current densities are compared with experimental results since exchange current density is most effective factor for the activation loss. Liu's study is used for the exchange current density of cathode, BSCF, and Koide's result is applied for the exchange current density of anode, Ni/YSZ. For the ohmic loss, ionic conductivity of YSZ is described from Kilner's mode and the data are compared with Wanzenberg's experimental data. Diffusivity is an important factor for the mass transfer through the porous medium. Both binary diffusion and Knudsen diffusion are considered as the diffusion mechanism. For validation, simulation results at this work are compared with our experimental results.

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GLOBAL ASYMPTOTIC STABILITY FOR A DIFFUSION LOTKA-VOLTERRA COMPETITION SYSTEM WITH TIME DELAYS

  • Zhang, Jia-Fang;Zhang, Ping-An
    • 대한수학회보
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    • 제49권6호
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    • pp.1255-1262
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    • 2012
  • A type of delayed Lotka-Volterra competition reaction-diffusion system is considered. By constructing a new Lyapunov function, we prove that the unique positive steady-state solution is globally asymptotically stable when interspecies competition is weaker than intraspecies competition. Moreover, we show that the stability property does not depend on the diffusion coefficients and time delays.

EXISTENCE OF POSITIVE SOLUTIONS OF PREDATOR-PREY SYSTEMS WITH DEGENERATE DIFFUSION RATES

  • Ryu, Kimun
    • 충청수학회지
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    • 제33권1호
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    • pp.19-32
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    • 2020
  • We discuss the coexistence of positive solutions to certain strongly-coupled predator-prey elliptic systems under the homogeneous Dirichlet boundary conditions. The sufficient condition for the existence of positive solutions is expressed in terms of the spectral property of differential operators of nonlinear Schrödinger type which reflects the influence of the domain and nonlinearity in the system. Furthermore, applying the obtained results, we investigate the sufficient conditions for the existence of positive solutions of a predator-prey system with degenerate diffusion rates.

Review on Water Vapor Diffusion through Wood Adhesive Layer

  • Omar Saber ZINAD;Csilla CSIHA
    • Journal of the Korean Wood Science and Technology
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    • 제52권4호
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    • pp.301-318
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    • 2024
  • Contrary to other materials like metals, glass, etc., wood continuously interacts with the environment, increasing and decreasing its moisture content according to the humidity of the air and changing its dimensions by swelling or shrinking. Water diffusion through laminated solid wood is crucial in wood bonding processes. The adhesive layer might block the diffusion if the water vapor diffusion is perpendicular to the bond line. As a result of this blockage, different proportions of deformation appear on the two sides of the bond line, which causes stresses in the bonded assembly. The question arises of how long the bonded structure will keep its integrity due to moisture diffusion blockage, inevitable tensions appearing in the glue line, and how these stresses could be avoided. With cross laminated timber (CLT) solid wood panel production, this question gains new importance. Despite the relevance, only a limited number of publications are available. Comprehensive research would also be necessary considering both the molecular structure and diffusion properties of the adhesive adjusted to the wood species (covering possible substituting wood species, too). Overall, this review serves as a resource for enhancing our understanding of water vapor diffusion through wood adhesive layers and provides insights that have implications for reducing stresses in bonded wood assemblies and the performance of the bonded group over time. Furthermore, identifying knowledge gaps is necessary to establish the basis for investigating the diffusion property of CLT panels.

혼합기체 sputtering 법으로 증착된 Cu 확산방지막으로의 Ti-Si-N 박막의 특성 연구 (A Study of Reactively Sputtered Ti-Si-N Diffusion Barrier for Cu Metallization)

  • 박상기;이재갑
    • 한국재료학회지
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    • 제9권5호
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    • pp.503-508
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    • 1999
  • We have investigated the physical and diffusion barrier property of Ti-Si-N film for Cu metallization. The ternary compound was deposited by using reactive rf magnetron sputtering of a TiSi$_2$target in an Ar/$N_2$gas mixture. Resistivities of the films were in range of 358$\mu$$\Omega$-cm, to 307941$\mu$$\Omega$-cm, and tended to increase with increasing the $N_2$/Ar flow rate ratio. The crystallization of the Ti-Si-N compound started to occur at 100$0^{\circ}C$ with the phases of TiN and Si$_3$N$_4$identified by using XRD(X-ray Diffractometer). The degree of the crystallization was influenced by the $N_2$/Ar flow ratio. The diffusion barrier property of Ti-Si-N film for Cu metallization was determined by AES, XRD and etch pit by secco etching, revealing the failure temperature of 90$0^{\circ}C$ in 43~45at% of nitrogen content. In addition, the very thin compound (10nm) with 43~45at% nitrogen content remained stable up to $700^{\circ}C$. Furthermore, thermal treatment in vacuum at $600^{\circ}C$ improved the barrier property of the Ti-Si-N film deposited at the $N_2$(Ar+$N_2$) ratio of 0.05. The addition of Ti interlayer between Ti-Si-N films caused the drastic decrease of the resistivity with slight degradation of diffusion barrier properties of the compound.

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Ti glue layer, Boron dopant, N2plasma 처리들이 Cu와 low-k 접착력에 미치는 효과 (Adhesion Property of Cu on Low-k : Ti Glue Layer, Boron Dopant, N2plasma effects)

  • 이섭;이재갑
    • 한국재료학회지
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    • 제13권5호
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    • pp.338-342
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    • 2003
  • Adhesion between Cu and low-k films has been investigated. Low-k films deposited using a mixture of hexamethyldisilane(HMDS) and Para-xylene had a dielectric constant as low as 2.7, showing the thermally stable properties up to $400^{\circ}C$. In this study, Ti glue layer, boron dopant, and $N_2$plasma treatment were used to improve adhesion property of between Cu and low-k films. Ti glue layer slightly improved adhesion property. After $N_2$plasma treatment, the adhesion property was significantly improved due to the increased roughness and the formation of new binding states between Ti and plasma-treated PPpX : HMDS. However, $300^{\circ}C$ annealing of $N_2$plasma treated sample caused the diffusion of Cu into the PPpX : HMDS, degrading the low-k properties. In the case of Cu(B)/Ti/PPpX : HMDS, the adhesion was remarkably increased. This enhanced adhesion was attributed to formation of Ti-boride at the Cu-Ti interface. It is because the formed Ti-boride prevented the diffusion of Cu into the PPpX : HMDS and the Cu-Ti reaction at the Ti interface.

THE SPACE-TIME FRACTIONAL DIFFUSION EQUATION WITH CAPUTO DERIVATIVES

  • HUANG F.;LIU F.
    • Journal of applied mathematics & informatics
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    • 제19권1_2호
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    • pp.179-190
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    • 2005
  • We deal with the Cauchy problem for the space-time fractional diffusion equation, which is obtained from standard diffusion equation by replacing the second-order space derivative with a Caputo (or Riemann-Liouville) derivative of order ${\beta}{\in}$ (0, 2] and the first-order time derivative with Caputo derivative of order ${\beta}{\in}$ (0, 1]. The fundamental solution (Green function) for the Cauchy problem is investigated with respect to its scaling and similarity properties, starting from its Fourier-Laplace representation. We derive explicit expression of the Green function. The Green function also can be interpreted as a spatial probability density function evolving in time. We further explain the similarity property by discussing the scale-invariance of the space-time fractional diffusion equation.