• Journal of Welding and Joining
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• v.34 no.6
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• pp.42-46
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• 2016

Hydrogen assisted cracking (HAC) is one of the most complicated problem in welding. Huge amount of studies have been done for decades. Based on them, various standards have been established to avoid HAC. But it is still a chronic problem in industrial field. It is well known that the main causes of the hydrogen crack are residual stress, crack susceptible micro structures and a certain critical level of hydrogen concentration. Even though the exact generating mechanism is unclear till today, it has been reported that the hydrogen level in the weld metal should be managed less than a certain amount to prevent it. Matsuda studied that the residual hydrogen level in the weld metal can be varied even if the initial hydrogen content is same. It is also insisted in this report that the residual hydrogen concentration is in stronger correlation with hydrogen crack than the initial hydrogen content. But, in practical point of view, the residual hydrogen is still hard to consider because measuring hydrogen level is time and cost consuming process. In this regard, numerical analysis is the only solution for considering the residual hydrogen content. Meanwhile, Takahashi showed the possibility of predicting the residual hydrogen by a rigorous FE analysis. But, few commercial software suitable for solving the weld metal hydrogen has been reported yet. In this study, two dimensional thermal - hydrogen coupled analysis was developed by using the commercial FE software MARC. Since the governing equation of the hydrogen diffusion is similar to the heat transfer, it is shown that the heat transfer FE analysis in association with hydrogen diffusion property can be used for hydrogen diffusion analysis. A series of simulation was performed to verify the accuracy of the model. For BOP (Bead-On-Plate) and the multi-pass butt welding simulations, remaining hydrogen contents in the weld metal is well matched with measurements which are referred from Kim and Masamitsu.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.30 no.3
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• pp.110-116
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• 2020

Grains in the BaTiO₃, which is used for a dielectric layer in MLCC(Multi-Layer Ceramic Capacitor) are necessary to form core/shell structure for a stable TCC(Temperature Coefficient of Capacitance) behavior. The shell property has been deduced from the whole TCC behavior of core/shell structure due to its tiny size, ~ few ㎛. This study demonstrates the individual TCC behavior of the shell phase measured by micro-contact measurement in a temperature range between 35 and 135℃. Pt electrode pairs deposited on an enlarged core/shell structure in a diffusion couple sample made the measurement possible. As a result, the DPT (Diffusion Phase Transition) behavior of the shell phase was revealed as a different TCC behavior from that of the core: a broad peak with T_m at 65℃. This would be also useful experimental data for a modelling that depicts dielectric-temperature behavior of core/shell structure.

• Korean Journal of Metals and Materials
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• v.49 no.12
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• pp.937-944
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• 2011

Studies have been carried out in order to reduce fuel-cladding chemical interaction (FCCI) behavior of metallic fuel in sodium-cooled fast reactors (SFR) using an electroplating technique. A $20{\mu}m$ thick Cr layer has been plated by the electrochemical method in the Sargent bath over the HT9 (12Cr-1Mo) clad material and diffusion couple tests of the U-10Zr metallic fuel as well as the rare earth alloy (70Ce-29La) have been conducted. The results show that the Cr plating can prevent FCCI behavior along the fuel-clad interface. However, cracks developed through the thickness during plating, which resulted in the migration of some fuel constituents. Variation of bath temperature, application of pulse current, and post heat treatment have been conducted to control such cracks. We found out that some conditions like the pulse current and the post heat treatment enhanced the layer property by reducing the internal cracks and improving the diffusion couple test.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.100-103
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• 2001

In this study, the adhesion and thermal property of the electroless-deposited Cu thin film were investigated. The multilayered structure of Cu/TaN/Si was fabricated by electroless-depositing the Cu thin layer on the TaN diffusion barrier which was deposited by MOCVD on the Si substrate. The thermal stability was investigated by measuring the resistivity as post-annealing temperature far the multilayered Cu/TaN/Si specimen which was annealed at Ar gas. The adhesion property of Cu 171ms was evaluated by the scratch test. The adhesion of the electroless-deposited Cu film was compared with other deposition methods of thermal evaporation and sputtering. The scratch test showed that the adhesion of electroless plated Cu film on TaN was better than those of sputtered Cu film and evaporated Cu film.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.11
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• pp.961-968
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• 2009

In this work, transparent conductive oxide(TCO) films such as $In_2O_3-SnO_2$(ITO) and $In_2O_3-ZnO$(IZO) were prepared on polyethylene naphthalene(PEN) and glass substrates by using rf-magnetron sputtering system. The TCO films deposited on PEN substrate show very poor conductivity as compared to that of the TCO films deposited on glass substrates. From the results of the residual gas analysis(RGA) test, this poor stability of plastic substrate is presumed to be caused by the deteriorated adhesion between the TCO films and the plastic substrate due to outgassing from the plastic substrate during deposition of TCO films. From our experiment, it is found that the vaporization of some defects in the plastic substrates deteriorate the adhesion of the TCO films to the plastic substrate, because the most plastic substrates containing the water vapor and/or other adsorbed particles such as organic solvents. Mixing of these gases vaporized in the sputtering process will also affect the electrical property of the deposited TCO films. Inorganic thin composite $(SiO_2)_{40}(ZnO)_{60}$ film as a gas barrier layer is coated on the PEN substrate to protecting the diffusion of vapors from the substrate, so that the TCO films with an improved quality can be obtained.

• Korean Journal of Optics and Photonics
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• v.15 no.1
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• pp.6-11
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• 2004

The playback wavelength shift and the optical property stabilization of the reflection type photopolymer OmniDex film are studied as a function of pressure. As the center wavelength is changed from 632 nm to 482 nm, the bandwidth is 27％ broadened and the diffraction efficiency deviation maintained lower than 10％. These results show that the proposed color tuning method minimizes the change of optical properties more than 50％ compared with the diffusion-based method as the center wavelength changed from 511 nm to 630 nm. The press-based color tuning method shows that it could be used to make holographic optical elements that operate at wavelengths where lasers are not readily available for reflection type holographic recording.

• Proceedings of the KIEE Conference
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• 1999.11d
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• pp.909-911
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• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed circuit boards (PCB) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor metals, such as Al and Cu, and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure, wear resistance, corrosion protection and thermal stability. In this study fundamental aspects of electroless nickel deposition were studied with effect of complexeing agents of different kinds. Then, the property of electroless deposit are controlled by the composition of the deposition solution, the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• Journal of environmental and Sanitary engineering
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• v.13 no.3
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• pp.19-29
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• 1998

The calcination reactivity of limestone and physical property changes of calcined lime were investigated with a temperature($720~1000^{\circ}C$ under atmospheric gas($N_2$, $CO_2$) conditions. The mechanisms of mass transport in a lime matrix were represented by the evaporation and condensation (${\gamma}=1.7$) at $1000^{\circ}C$ and the volume diffusion (${\gamma}=2.7$) at $800^{\circ}C$, which was obtained by the specific surface area of calcined lime with sintering conditions. Also, the effect of physical property on the reactivity of sulfation reaction was determined by the changes of pore size with $lime-SO_2$ reaction in this work. The initial sulfation rate of calcined lime increased with increasing temperature, whereas the capture capacity of $SO_2$ exhibited a maximum value at $900^{\circ}C$. The pore volume of sulfated lime was decreased with increasing sulfation time, but the major pores shifted to the distribution of larger size at a temperature of $850{\;}~{\;}1000^{\circ}C$. The mean pore size of sulfated lime based on pore volume decreased gradually at $1000^{\circ}C$; however, it increased with sulfation time up to 40 min and rapidly decreased thereafter.

• Corrosion Science and Technology
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• v.7 no.3
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• pp.145-151
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• 2008

Material degradation such as high temperature oxidation of metallic material is a severe problem in energy generation systems or manufacturing industries. The metallic materials are oxidized to form oxide films in high temperature environments. The oxide films act as diffusion barriers of oxygen and metal ions and thereafter decrease oxidation rates of metals. The metal oxidation is, however, accelerated by mechanical fracture and spalling of the oxide films caused by thermal stresses by repetition of temperature change, vibration and by the impact of solid particles. It is therefore very important to investigate mechanical properties and adhesion of oxide films in high temperature environments, as well as the properties in a room temperature environment. The oxidation tests were conducted for Ni and Ni-Co alloy under high temperature corrosive environments. The hardness distributions against the indentation depth from the top surface were examined at room temperature. Dynamic indentation tests were performed on Ni oxide films formed on Ni surfaces at room and high temperature to observe fractures or cracks generated around impact craters. As a result, it was found that the mechanical property as hardness of the oxide films were different between Ni and Ni-Co alloy, and between room and high temperatures, and that the adhesion of Ni oxide films was relatively stronger than that of Co oxide films.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.6
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• pp.293-299
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• 2004

In this paper, thermal and mechanical properties of electric epoxy with water aging were discussed. We made elastic epoxy specimen adding a ratio of 0〔phr〕20〔phr〕, 35〔phr〕 and 53〔phr〕 with modifier to existing epoxy. We studied mechanical property of elastic resin after absorption in water from 0 to 484 hours. As a result, diffusion factor of elastic epoxy showed 20-21${\times}$10$^{-4}$ $\textrm{mm}^2$/s and general epoxy showed 9.5${\times}$10$^{-4}$ $\textrm{mm}^2$/s. Elastic property increased linearly according to addiction and decreased according to water absorption. Tensile strength was reduced according to addition. It was affected by water absorption of micro-void of elastic epoxy. Hardness inclined to decrease after increasing according to absorbed time. In water-absorption state, it was experimented a change of heat flow by temperature of elastic epoxy and change of thermal expansion coefficient. DSC (Differential Scanning Calorimetry) and TMA (Thermomechanical Analysis) equipments were used to measure Tg. A temperature ringe of DSC was from -0($^{\circ}C$) to 200($^{\circ}C$). One of TMA was from -0($^{\circ}C$) to 350($^{\circ}C$). In addition, we investigated structural analysis of water absorbed specimen using SEM (Scanning Electron Microscope).