• Journal of Welding and Joining
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• v.20 no.1
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• pp.97-102
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• 2002

The growth kinetics of intermetallic compound layers formed between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad by solid stateisothermal aging were examined. The interfacial reaction between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad was investigated at 70, 120, 150, $170^{\circ}C$ for various times. The intermetallic compound layer was composed of two phase: $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the solder and $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the copper and on solder/Ni pad the intermetallic compound layer was $Ni_3Sn_4$. Because the values of time exponent(n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energy for layer growth of total Cu-Sn($Cu_6Sn_5 + Cu_6Sn$), $Cu_6Sn_5$, $Cu_3Sn$ and $Ni_3Sn_4$ intermetallic compound were 64.82kJ/mol, 48.53kJ/mol, 89.06kJ/mol and 71.08kJ/mol, respectively.

• Metals and materials international
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• v.24 no.6
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• pp.1232-1240
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• 2018

Corrosion properties of dissimilar friction stir welded 6061 aluminum and HT590 steel were investigated to understand effects of galvanic corrosion. As cathode when coupled, HT590 was cathodically protected. However, the passivation of AA6061 made the aluminum alloy cathode temporarily, which leaded to corrosion of HT590. From the EIS analysis showing Warburg diffusion plot in Nyquist plots, it can be inferred that the stable passivation layer was formed on AA6061. However, the weld as well as HT590 did not show Warburg diffusion plot in Nyquist plots, suggesting that there was no barrier for corrosion or even if it exists, the barrier had no function for preventing and/or retarding charge transport through the passivation layer. The open circuit potential measurements showed that the potential of the weld was similar to that of HT590, which lied in the pitting region for AA6061, making the aluminum alloy part of the weld keep corrosion state. That resulted in the cracked oxide film on AA6061 of the weld, which could not play a role of corrosion barrier.

• Journal of Welding and Joining
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• v.2 no.1
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• pp.4-17
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• 1984

Overlaid weld metals of austenitic stainless steel in a pressure vessel of power reactor are usually post-weld heated for a long period of time after welding. The PWHT is considered as a kind of sensitizing and it is important to check the soundness of the weld metal after PWHT, especially about the precipitation of carbides. The purpose of this report is to obtain information on the relation between the change of microstructure and Post-Weld Heat Treatment in the overlaid weld metals. Metallurgical aspects of the problem on austenitic stainless steel heated at $625^{\circ}C$, $670^{\circ}C$, $720^{\circ}C$ and $760^{\circ}C$ for 3, 10, 30, 100 and 300 hours have been investigated by means of optical-micrography, micro-hardness measurement, scanning electron microscope and electron-probe micro analysis. From the results obtained, the following conclusions are drawn; 1) The PWHT above $625^{\circ}C$ for a long time causes a diffusion of carbon atoms from low alloy steel into stainless steel, and consequently carbon is highly concentrated at the boundary layer of stainless steel. 2) C in ferritic steel migrated to austenitic steel and carbides precipitated in austenitic steel along fusion line. At higher temperatures, the ferrite grains coarsened in the decarburized zone. 3) In the change of microstructure of stainless steel overlaid weld metal, the width of carbides precipitated zone and decarburized zone increased with increase of PWHT temperature and time. 4) At about $625^{\circ}C$ to $760^{\circ}C$, chromium carbides, mainly $M_{23} C_6$, precipitate very closely in the carburized layer with remarkable hardening. 5) Precipitation of delta ferrite from molten weld metal depends on solidification phenomenon. There was a small of ferrite near the bond in which the local solidification time was short, comparing with after parts of weld metal. Shape and amount of ferrite were not changed by Post-Weld Heat Treatment after solidification.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.59-59
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• 2009

The influences of B and Si in the filler metals on microstructure and isothermal solidification during transient liquid-phase (TLP) bonding of a nitrogen-containing duplex stainless steel with MBF-30 (Ni-4.5wt.%Si-3.2wt.%B) and MBF-35 (Ni-7.3wt.%Si-2.2wt.%B), were studied at the temperature range of $1030-1090^{\circ}C$ with various times from 60 s to 3600 s under a vacuum of approximately $10^{-5}$ Torr. In case of the former, BN, $Ni_3B$ and $Ni_3Si$ precipitates were formed in the bonding region. BN and $Ni_3Si$ secondary phases were present in the joint for the latter case. The formation of $Ni_3B$ within the joint centerline is dependent on B content. The morphology of $Ni_3Si$ is dominated by Si concentration. A difference between the times for complete isothermal solidification obtained by the experiments and the conventional TLP bonding diffusion model was observed when using MBF-35. According to the simulated results, the isothermal solidification completion time for MBF-35 case was smaller than that in MBF-30. However, this experimental value obtained using MBF-35 was notably larger than that obtained using MBF-30. Isothermal solidification of liquid MBF-30 is controlled by the first isothermal solidification regime dependent on B diffusion model, whereas that of liquid MBF-35 experiences two isothermal solidification regimes and is mainly controlled by the second isothermal solidification dependent on Si diffusion model. In addition, only if Si content exceeds a critical value, the slower 2nd solidification regime will commence.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.555-560
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• 2002

Brazing of Al to Cu using AI-Si-Mg-Bi brazing alloy has been carried out in the vacuum furnace. In the bonded interlayer, there were two kinds of intermetallic compounds. One of these intermetallic compounds was e phase and the other was b phase. The growth of b phase was controlled by diffusion Al into Cu. Deformation behavior of Al-Cu brazing joint was brittle without deformation of the base metal. Shear strength of the joint was only about 20MPa. The shear specimen broken in the intermetallic compound, which was mainly e phase. Shear strength did not depend on the bonding temperature.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.211-216
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• 2002

To investigate transition region in welded overlay relating to disbonding crack, the effect of vanadium addition on disbonding of Cr-Mo steels overlay welded with austenitic stainless steel was studied. V modified Cr-Mo steels have a higher resistance to disbonding than V free Cr-Mo steel. One reason is due to the fact that fine vanadium carbide precipated in base metal traps hydrogen and thus decreases the susceptibility to the disbonding. The second is related to the higher stability of the vanadium and stable carbides formed during PWHT, in which the carbon diffusion to the interface is lower than for V free Cr-Mo steel. Decreasing the carbon content at the interface of the weld overlay shows good resistance to the disbonding. Hence, it is important to control the carbon content at the interface of the weld overlay.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.219-221
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• 2005

Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.

• Korean Journal of Materials Research
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• v.1 no.1
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• pp.29-36
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• 1991

Pressurized Water Reactor (PWR) pressure vessels are made of forged low alloy steel plates internally clad with an austenitic stainless steel by welding to improve anti-corrosion properties. They display a characteristic behavior of dissimilar metal weld interface during post weld heat treatment (PWHT) and service at high temperature and pressure. In this Study, Metallugical structure of weld interface of SA 508 Class 3 forged steel clad with 309L, Austenitic stainless steel after PWHT was investigated. To estimate the width of the carburized/decarburized bands quantitatively, a model for carbon diffusion was proposed and a theoretical equation was derived.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.34-36
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• 2005

Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with $25{\mu}m$ copper wire on Au/Ni/Cu metallization of a PCB substrate was performed at ambient temperature. The central composite design of experiment (DOE) approach was applied to optimize the copper wire wedge bonding process parameters. After that, pull test of the wedge bond was performed to study the bond strength and to find the optimum bonding parameters. SEM was used to observe the cross section of the wedge bond. The pull test results show good performance of the wedge bond. Additionally, DOE results gave the optimized parameter for both the first bond and the second bond. Cross section analysis shows a continuous interconnection between the copper wire and Au/Ni/Cu metallization. The diffusion of Cu into the Au layer was also observed.

• Journal of the Korean institute of surface engineering
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• v.43 no.2
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• pp.91-96
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• 2010

SCM440 steels were nitrided using pulsed dc plasma combined with inductively coupled plasma (ICP) generated by 13.56 MHz rf power in order to enhance case hardening depth. The case hardening depth was increased with rf power. The effective case-depth with ICP at 900 watt was as 1.6 times as that nitrided without ICP. The hardening depth was also increased up to 1.45 times. The compound layers formed on top surface were dense and thin when pulsed dc plasma was combined with ICP.