• Title/Summary/Keyword: Dies and molds

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Development of automatic assembly module for yoke parts in auto-focusing actuator (Auto-Focusing 미세부품 Yoke 조립 자동화 모듈 개발)

  • Ha, Seok-Jae;Park, Jeong-Yeon;Park, Kyu-Sub;Yoon, Gil-Sang
    • Design & Manufacturing
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    • v.13 no.1
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    • pp.55-60
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    • 2019
  • Smart-phone in the recently released high-end applied to the camera module is equipped with the most features auto focusing camera module. Also, auto focusing camera module is divided into voice coil motor, encoder, and piezo according to type of motion mechanism. Auto focusing camera module is composed of voice coil motor (VCM) as an actuator and leaf spring as a guide and suspension. VCM actuator is made of magnet, yoke as a metal, and coil as a copper wire. Recently, the assembly as yoke and magnet is made by human resources. These process has a long process time and it is difficult to secure quality. Also, These process is not economical in cost, and productivity is reduced. Therefore, an automatic assembly as yoke and magnet is needed in the present process. In this paper, we have developed an automatic assembly device that can automatically assemble yoke and magnet, and performed verifying performance. Therefore, by using the developed automatic assembly device, it is possible to increase the productivity and reduce the production cost.

A Study on the Effects of Concave Shaping in Improving Contract Pressure for Planar Array Connector Terminal Pins (평면배열 커넥터 터미널 핀에 오목형상 부여가 접압력 향상에 미치는 영향에 관한 연구)

  • Jeon, Yong-Jun;Shin, Kwang-Ho;Heo, Young-Moo
    • Design & Manufacturing
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    • v.10 no.1
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    • pp.36-40
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    • 2016
  • Connectors transmit electric signals to different parts in compact mobile display products. As products that apply this have become lightweight and smaller in size, there are growing demands for smaller and more integrated connectors, which are internal parts of the products. As a measure to address these demands, there is the planar array connector that minimizes the part by arranging the single-direction BTB connectors to two directions. As connectors become smaller in size and more highly integrated, maintaining intensity to prevent defects during impact and maintaining adhesive force to smoothly transmit electric signals are growing in importance. Thus, in order to identify the impact of concave shaping on improving adhesive power in connector terminal pins as a method to increase the connecting power of planar array connector terminal pins, this study predicted and examined the concave shaping method, number of concave shapes, and the adhesive power according to the size of the concave shape through CAE. For concave shaping, the model that added concave shaping towards the lower part of the connector terminal pin and added spokes for the area pressed down by the concave shaping was 0.74 N, showing increased adhesive force compared to existing models. Furthermore, when applying two concave shaping, rather than just one, there was a tendency for adhesive force to increase. In the case of adhesive power trends according to the size of the concave shaping, adhesive power increased and the width of the concave shape decreased, and the biggest adhesive force trends were shown when the concave shaping depth was 0.01mm.

A study on light weighted injection molding technology and warpage reduction for lightweight automotive head lamp parts (자동차 헤드램프 부품의 경량화 사출 성형기술 및 변형 저감에 관한 연구)

  • Jeong, Eui-Chul;Son, Jung-Eon;Min, Sung-Ki;Kim, Jong-Heon;Lee, Sung-Hee
    • Design & Manufacturing
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    • v.13 no.2
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    • pp.1-5
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    • 2019
  • In this study, micro cellular injection molding of automobile head lamp housing with uneven thickness structure was performed to obtain improvement on deformation and light-weight of the part. The thickness of the presented model was uniformly modified to control the deformation of the molded part. In order to maximize the lightweight ratio, the model having an average thickness of 2.0 mm were thinly molded to an average thickness of 1.6 mm. GFM(Gas Free Molding) and CBM(Core Back Molding) technology were applied to improve the problems of the conventional foam molding method. Equal Heat & Cool system was also applied by 3D cooling core and individual flow control system. Warpage of the molded parts with even cooling was minimized. To improve the mechanical properties of foamed products, complex resin containing nano-filler was used and variation of mechanical properties was evaluated. It was shown that the weight reduction ratio of products with light-weighted injection molding was 8.9 % and the deformation of the products was improved from the maximum of 3.6 mm to 2.0 mm by applying Equal Heat & Cool mold cooling system. Also the mechanical strength reduction of foamed product was less than 12% at maximum.

A Study on the Bend Deformation Cause Analysis of CAE Applied Wire to Board Connectors (압접 커넥터 CAE 적용 휨 변형 원인 분석에 관한 연구)

  • Jeon, Yong-Jun;Shin, Kwang-Ho;Heo, Young-Moo
    • Design & Manufacturing
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    • v.10 no.1
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    • pp.19-25
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    • 2016
  • Connectors are very important components that transmit electric signals to different parts. It must maintain intensity of the connector to prevent defects from impact and maintain contact to transmit electric signals. Most of the external parts of the connector, which act as the main framework, are formed by injection molding. However, bend deformation occurs for injection molded products due to the residual stress left inside the product after product molding. When the bend deformation is large, it does not come into complete contact when being assembled with other parts, which leads to connector contact intensity not being properly maintained. In result, the main role of the connector, which is to transmit electric signals, cannot be performed. In order to address this problem, this study conducted bend deformation cause analysis through bend deformation analysis to predict and prevent bend deformation of housings and wafers, which are injection molded products of pressure welded connectors that are normally applied in compact mobile and display products. Bend deformation analysis was carried out by checking the charging time, pressure distribution and temperature distribution through wire to board connector wafer and housing injection molding analysis. Based on the results of the bend deformation analysis results, the cause of the bend deformation was analyzed through deformation resulting from disproportional cooling, deformation resulting from disproportional contraction, and deformation resulting from ingredient orientation. In result, it was judged that the effects for bend deformation were biggest due to disproportional contraction for both the pressure welded connector wafer and housing.

A study on excavator front support parts to minimize springback defects (굴삭기 Front Support 부품 뒤틀림 결함 최소화 방안 도출)

  • Jeon, Yong-Jun;Heo, Young-Moo;Lee, Ha-Sung;Kim, Dong-Earn
    • Design & Manufacturing
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    • v.12 no.2
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    • pp.40-45
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    • 2018
  • Recently, in construction equipment machinery production, development has focused on environmentally-friendly functions to improve existing production capacity. For excavators as well, emphasis has been placed on response to environmental regulations, miniaturization, and noise reduction, while technology is being developed considering cost reduction and safety.Accordingly, the front support, an inner reinforcement part of the excavator, as well as high-strength steel plates to improve safety and reduce weight, are being applied.However, in the case of high-strength materials, Springback occurs in the final formed part due to high residual stress during product forming. Derivation of a forming or product shaping process to reduce springback is needed. Accordingly, regarding the front support, an inner reinforcement part of the excavator, this study derived a method to improve springback and secure shape stiffness through analysis of the springback occurrence rate and springback causes through a forming analysis.As for the results of analyzing the springback occurrence rate of existing products through forming analysis, springback of -22.6 mm < z < 27.35 mm occurred on the z-axis, and it was confirmed that springback occurred due to the stiffness reinforcing bead of the upper and middle parts of the product.To control product residual stress and springback, we confirmed a tendency of springback reduction through local pre-cutting and stiffness reinforcement bead relocation.In the local pre-cutting model, springback was slightly reduced by 5.3% compared with the existing model, an insignificant reduction effect. In the stiffness reinforcement bead relocation model, when an X-shaped stiffness reinforcement bead was added to each corner portion of the product, springback was reduced by at least 80%.The X-shaped bead addition model was selected as the springback reduction model, and the level of stiffness compared to the existing model was confirmed through a structural analysis.The X-shaped bead additional model showed a stress springback of 90% and springback reduction of 7.4% compared with the existing model, indicating that springback and stiffness will be reinforced.

A study on the brittle characteristics of fused silica header driven by piezoelectric actuator for laser assisted TC bonding (레이저 열-압착 본딩을 위한 압전 액추에이터로 구동되는 용융실리카 헤더의 취성특성에 관한 연구)

  • Lee, Dong-Won;Ha, Seok-Jae;Park, Jeong-Yeon;Yoon, Gil-Sang
    • Design & Manufacturing
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    • v.13 no.4
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    • pp.10-16
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    • 2019
  • Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

A study on reduction of springback defects in excavator tank cover part (굴삭기 Tank Cover 부품 뒤틀림 불량 저감에 대한 연구)

  • Jeon, Yong-Jun;Lee, Ha-Sung;Kim, Dong-Earn;Heo, Young-Moo
    • Design & Manufacturing
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    • v.12 no.1
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    • pp.52-57
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    • 2018
  • With the recent strengthening of environmental regulations and the need for cost reduction, excavators, a type of construction equipment, are being miniaturized while components are being developed in consideration of stability. In the case of excavator press parts, mainly high-strength steel sheets are being used to enhance stability and reduce weight. However, in the case of high-strength materials, there is a need to research product forming methods to reduce Springback in defects arising in parts assembly due to Springback that result from the internal residual stress that occurs in press forming being released after product forming. Accordingly, regarding the tank cover, an excavator press-forming part, this study selected a method to reduce distortion through analysis of the Springback occurrence rate and Springback causes through a forming analysis. A forming analysis was conducted for the Springback of the tank cover. Deformations of 13.714 mm in the upper part and 6.244 mm in the inner part of the product occurred, while wrinkles occurred on the sides of the product due to uneven thickness. A forming analysis was conducted for the major shapes of the product to investigate the causes of Springback. Distortion deformation due to the bead in the center of the product was confirmed to be a large factor. A Springback reduction method of correcting uneven thickness in the product sides, a Springback reduction method of removing the bead, and a correction method of restriking after the final forming were used in a forming analysis to determine the degree of Springback reduction. For the forming method to correct uneven thickness in the sides, deformation was reduced by 12% in the upper side compared to the existing model, but deformation in the inner side increased by 1%. For the restriking forming method, deformation decreased by 25% in the upper side and 13% in the inner side. For the bead removal method, deformation decreased by 28% in the upper side and 13% in the inner side, the largest Springback correction results. This indicates that the bead has a large affect on Springback.

Rapid Tooling by Using Metal Powder Reinforced Resin (금속분말 강화수지를 이용한 쾌속금형 제작)

  • Kim, Beom-Su;Jeong, Hae-Do;Bae, Won-Byeong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.1 s.173
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    • pp.1-6
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    • 2000
  • As dies and molds have become more and more complicated in the recent years, the demand for lower cost and shorter production time is also growing stronger. Rapid prototyping and Tooling technologies are expected to be used for more rapid and lower cost tool fabrication. However the rapid tooling methods have not yet reached the level of application to the manufacturing of metallic dies and molds which require high dimensional accuracy. As the rapid tooling technology, there are the slurry casting, the powder casting, the direct laser sintering, and so on. Generally, in the slurry casting, the alumina powder and the water soluble phenol were mainly used. However, the mechanical properties of the phenol were not good enough to apply to molds directly. In this study, pure epoxy and two types of aluminium powder reinforced resin are applied to the slurry casting. The mechanical and thermal properties are better than phenol because the epoxy is the thermosetting resin. And mechanical characteristics such as shrinkage rate, hardness, surface roughness are measured for the sake of comparison. Metal powder reinforced resin molds are better than the resin tool form the viewpoint of shrinkage rate and hardness. Finally, it has been shown that the application possibility of this process is high, because the manufacturing time and cost savings are significant.

Analysis in Microstructures and Co Volume of WC Powder According to the Lifespan of WC-Co Molds for Cold Forging (냉간단조용 WC-Co 금형의 수명에 미치는 WC 분말의 미세구조 및 Co 부피 분율의 분석)

  • Jeongseok Oh;Jini Park;Sang-yeob Lee;Choong-Heui Chung;Jeong-muk Choi;Joon sik Park
    • Journal of the Korean Society for Heat Treatment
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    • v.36 no.5
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    • pp.270-276
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    • 2023
  • In this study, we analyzed two types of cold forging dies commonly used for manufacturing general nuts and screws to investigate the differences in WC powder according to the lifespan. For both Type I and Type II dies, it was observed that as the lifespan of the molds increases, the area fraction of Co becomes larger and the size of the powder becomes smaller. Moreover, there is a trend where the strength also increases as the lifespan gets longer. Actually, the hardness value of the sample with the longest lifespan is ~ 131 HV higher than the specimen of the shortest lifespan, It is noted that the reduction in toughness of the WC-Co mold is caused by insufficient Co and the decrease in contact surface area of WC-Co results in a reduced bonding surface area. The lifespan of cold-working WC molds increases when the W content and the volume fraction of WC are high, and the size of the WC powder is small. The results can significantly enhance producing high-quality molds with an extended lifespan using WC powder for cold forging.