• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.1
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• pp.45-51
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• 2009

The propagation characteristics in parallel plate waveguide with dielectric layer having periodic metal strip pattern are investigated. PIN diode ON/OFF states are regarded as the short and open circuit, respectively, in the simulation using CST's MWS. The $11.25^{\circ}$, $22.5^{\circ}$, and $45^{\circ}$ layers which can be used for X-band 4-bit Radant lens phase shifter, are designed. The simulated results for each dielectric layer are $11.28^{\circ}$, $23.2^{\circ}$, and $46.22^{\circ}$, respectively. Also, the equivalent circuit of each layer at the operating band is realized and simulated using Agilent's ADS. The ADS simulated results are compared with the MWS simulated ones. Measured differential phase shills at the center frequency are $9.6^{\circ}$, $22.4^{\circ}$, and $43^{\circ}$, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.52-59
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• 2023

The effects of dielectric curing temperature and temperature/humidity treatment conditions on the interfacial adhesion energies between Ti diffusion barrier/polybenzoxazole (PBO) dielectric layers were systematically investigated for Cu redistribution layer applications of fan-out wafer level package. The initial interfacial adhesion energies were 16.63, 25.95, 16.58 J/m² for PBO curing temperatures at 175, 200, and 225 ℃, respectively. X-ray photoelectron spectroscopy analysis showed that there exists a good correlation between the interfacial adhesion energy and the C-O peak area fractions at PBO delaminated surfaces. And the interfacial adhesion energies of samples cured at 200 ℃ decreased to 3.99 J/m² after 500 h at 85 ℃/85 % relative humidity, possibly due to the weak boundary layer formation inside PBO near Ti/PBO interface.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1129-1132
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• 1995

In the preparation of the layered $BaTiO_3$ thin films with high performance, the new stacking method using the continuous cooling of the substrate was introduced. Amorphous/polycrystalline $BaTiO_3$ layered structure was confirmed by SEM and index of refraction. The layered $BaTiO_3$ thin films formed by the new stacking method showed such a high dielectric constant that the layered structure could not be explained by a stacking structure of the two defined layers but could only be explained by multi-layered structure, i.e. amorphous/micro crystalline/polycrystalline structure. The layered $BaTiO_3$ thin film with a thickness of 240 nm showed higher capacitance per unit area and breakdown strength than the double layered $BaTiO_3$ thin film prepared by the conventional stacking method. And well defined ferroelectric hysteresis leer was observed in the layered $BaTiO_3$ thin film with a thickness of 200 nm.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.441-442
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• 2002

Chemical mechanical polishing (CMP) is a manufacturing process that uses controlled wear to planarize dielectric and metallic layers on silicon wafers. CMP experiments revealed that a sub-ambient film pressure developed at the wafer/pad interface. Additionally, dishing occurs in CMP processes when the copper-in-trench lines are removed at a rate higher than the barrier layer. In order to study dishing across a stationary wafer during polishing, dishing maps were created. Since dishing is a function of the total contact pressure resulting from the applied load and the fluid pressure, the hydrodynamic pressure model was refined and used in an existing model to study copper dishing. Density maps, highlighting varying levels of dishing across the wafer face at different radial positions, were developed. This work will present the results.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.2
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• pp.202-208
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• 2003

In this paper, we proposed a microstrip patch array antenna for DBS reception which had high gain and high tilted angle through mutual coupling driver patch to parasitic patch in H-plane edge and broadside direction in different layers. It was designed and fabricated in 16$\times$8 array by using low cost polyester based copper-clad laminate and foam instead of high cost dielectric substrate. It had gain of 22.9 dBi, beamwidth of 4.6$^{\circ}$, and tilted angle from broadside direction of 43.9$^{\circ}$.

• Laser Solutions
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• v.13 no.4
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• pp.7-13
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• 2010

Today, the most common process for generating Through Silicon Vias (TSVs) for 3D ICs is Deep Reactive Ion Etching (DRIE), which allows for high aspect ratio blind holes with low surface roughness. However, the DRIE process requires a vacuum environment and the use of expensive masks. The advantage of using lasers for TSV drilling is the higher flexibility they allow during manufacturing, because neither vacuum nor lithography or masks arc required and because lasers can be applied even to metal and to dielectric layers other than silicon. However, conventional nanosecond lasers have the disadvantage of causing heat affection around the target area. By contrast, the use of a picosecond laser enables the precise generation of TSVs with less heat affected zone. In this study, we conducted a comparison of thermalization effects around laser-drilled holes when using a picosecond laser set for a high pulse energy range and a low pulse energy range. Notably, the low pulse energy picosecond laser process reduced the experimentally recast layer, surface debris and melts around the hole better than the high pulse energy process.

• The Korean Journal of Ceramics
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• v.4 no.2
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• pp.83-89
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• 1998

The structure refinements and the electrical and magnetoelectric measurements were performed for BIT.1BF and BIT.2BT. The tetragonal distortion of the ab plane became lessened with the addition of $4BiFeO_3 into Bi_4Ti_3O_{12}$ significantly. However, the tilting of the outer-oxygen octahedra of the perovskite unit and the elongatin of the $(Bi_2O_2)^{2+}$ layers became more pronounced. For the both phases, the bariations of dielectric properties and electrical conductivities at high temperatures showed that the ferroelectic I-rerroelectric II phase transition existed before reaching the Curie temperature. The electrical conductivity became higher with the increase of $Fe^{3+}$ ions, implying that the electron transfer increased correspondingly. The magnetoelectric effect was observed linear up to ~8 kOe, which was stronger in BIT.1BF than BIT.2BF. This behavior indicates that the distortion of the ab plane may affect the induced polarization as well as magnetic moment.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.6
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• pp.458-463
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• 2010

MLCC (multi-layer ceramic capacitor) is usually fabricated by lamination of predetermined number of single layers. Often, the state of MLCC before sintering is called the green state, whose strength comes from the adhesion between the dielectric material and the polymer binder. Therefore the lamination of a single layer before sintering can be easily deformed by environment due to the relatively lower strength. After the compression process, which helps single sheets cohereto with adjacent sheets, the MLCC green bar is preheated to resolve the probable internal stress. Unfortunately, unexpected deformation after preheating resulted in problems during cutting of the MLCC green bar. In this study, one of 2 primary hypotheses which were proposed to resolve the unexpected deformation after preheating was examined by quantitative experiment with GC/MS (gas chromatograpy/mass spectrometer). The proportion of deformation caused by DOP evaporation, which was primarily evaporated componet during preheating, to the total deformation of the MLCC green bar was found to be 53%.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.10
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• pp.1317-1321
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• 2018

PVDF as a semicrystal polymer, having a structure with C-F dipole moments, has been widely investigated because of its excellent chemical stability, mechanical strength, and ferroelectricity. In this study, ferroelectic ${\beta}$ type - PVDF layer was prepared by using an electrostatic spray deposition method and the effects of the addition of Ni-nitrate in precursor solution on the properties of PVDF layer were evaluated. Crystallinity and chemical structure of the PVDF layer were analyzed by a X-ray diffraction and Fourier Transform Infrared Spectrophotometer. Surface structure and fractured cross section of the layer were examined by a field emission-scanning electron microscope. LCR meter was used to obtain the dielectric properties of the layer. As the addition of an inorganic metal salt in PVDF sol, ${\beta}$ type - PVDF crystals were appeared in the hydrated metal salts doped-layer since the strong hydrogen bondings $(O-H{\cdots}F-C)_n$ due to high polarity of OH- were formed.

• Journal of the Korea Institute of Military Science and Technology
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• v.18 no.2
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• pp.139-145
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• 2015

In this paper, the flexible piezoelectric nanocomposite generator(NCG) device based on $BaTiO_3$ nanostructures was fabricated via simple and low-cost spin coating method. The $BaTiO_3$ nanostructures synthesized by self-assembly reaction showed dendrite morphologies. To produce the piezoelectric nanocomposite(p-NC layer) which acts as an electric energy source in NCG device, the piezoelectric nanopowders($BaTiO_3$) were dispersed in polydimethylsiloxane(PDMS). Sequently, the p-NC layer was inserted in two dielectric layer of PDMS; these layers enabled the NCG device flexibility as well as durability prohibiting detachment(exfoliation) for significantly mechanical bending motions. The fabricated NCG device shows average maximum open circuit voltage of 6.2 V and average maximum current signals of 300 nA at 20 wt% composition of $BaTiO_3$ nanostructures in p-NC layer. Finally, the flexible energy harvester generates stable output signals at any rate of frequency which were used to operate LCD device without any external energy supply.