• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.4
• /
• pp.41-48
• /
• 1999

Silica is the most popular materials as a filler of EMC for microelectronic packaging. However, because of its low thermal conductivity, the use of silica is restricted to parts requiring high thermal dissipation. The superior fluidity of EMC can be achieved with a combination of filler size distribution. In this study, physical properties of EMC filled with the crystalline silica(13$\mu\textrm{m}$) which have high fluidity and low cost and the AlN(2 $\mu\textrm{m}$) which have high thermal conductivity and low coefficient of thermal expansion were evaluated by changing the AlN/silica ratios. As a result of the evaluation of physical properties of EMC, the optimum mixing ratio of AlN/crystalline silica was 0.3/0.7. In this condition, binary mixture(AlN/crystalline silica) filled EMC showed superior properties, i.e., in the thermal conductivity, CTE, dielectric constant, flexural strength, and thermal shock resistance without reduction of fluidity.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.33 no.6
• /
• pp.490-494
• /
• 2020

Sulphur hexafluoride (SF₆) is mostly used as a current-insulating medium in gas-insulated switchgears (GIS), owing to its excellent dielectric strength and arc-extinguishing performance. The global warming potential (GWP) of SF₆, however, is 23,900 times that of CO₂, and its life time in the atmosphere is 3,200 years. For these reasons, new eco-friendly gases to replace SF₆ are required. In this study, the partial discharge (PD) characteristics of green gas for grid (g³) and dry air (N₂/O₂) were analyzed to compare with those of SF₆. A PD electrode system was designed to simulate the protrusion defect in GISs and fabricated for experimentation. To compare the PD characteristics of each gas, the discharge inception voltage (DIV), discharge extinction voltage (DEV), discharge magnitude, discharge pulse number, and phase pattern were analyzed. Results from this study are expected to provide fundamental materials for the design of eco-friendly GISs.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.08a
• /
• pp.285-285
• /
• 2013

Recently, hexagonal boron nitride (h-BN), which is III-V compound of boron and nitride by strong covalent sp2 bonds has gained great interests as a 2 dimensional insulating material since it has honeycomb structure with like graphene with very small lattice mismatch (1.7%). Unlike graphene that is semi-metallic, h-BN has large band gap up to 6 eV while providing outstanding properties such as high thermal conductivity, mechanical strength, and good chemical stability. Because of these excellent properties, hBN can potentially be used for variety of applications such as dielectric layer, deep UV optoelectronic device, and protective transparent substrate. Low pressure and atmospheric pressure chemical vapor deposition (LPCVD and APCVD) methods have been investigated to synthesize h-BN by using ammonia borane as a precursor. Ammonia borane decomposes to polyiminoborane (BHNH), hydrogen, and borazine. The produced borazine gas is a key material that is a used for the synthesis of h-BN, therefore controlling the condition of decomposed products from ammonia borane is very important. In this paper, we optimize the decomposition of ammonia borane by investigating temperature, amount of precursor, and other parameters to fabricate high quality monolayer h-BN. Synthesized h-BN is characterized by Raman spectroscopy and its absorbance is measured with UV spectrophotometer. Topological variations of the samples are analyzed by atomic force microscopy. Scanning electron microscopy and Scanning transmission Electron microscopy are used for imaging and analysis of structures and surface morphologies.

• Korean Journal of Food Science and Technology
• /
• v.18 no.3
• /
• pp.226-233
• /
• 1986

Myofibrillar proteins were prepared from red muscle and white muscle, and their thermostabilities were compared. Rate constants of inactivation of myofibrillar proteins were increased as the ionic strength of reaction mixture increased and also dielectric constant of reaction mixture decreased. Thermodynamic data forinactivation of myofibrillar proteins, such as $D-value,\;{\Delta}H^{\ddag},\;{\Delta}G{\ddag}\;and\;{\Delta}S^{\ddag$, revealed that thermostabilities of myofibrillar proteins from white muscle were higher than those from red muscle, and that myofibrillar proteins from chicken muscle were more heatlabile than from bovine muscle.

• Journal of Advanced Navigation Technology
• /
• v.26 no.6
• /
• pp.464-473
• /
• 2022

In this paper, about a lightweight design that satisfies the performance of UHF-GPS Antenna used in autonomous underwater vehicle is proposed. Structural analysis, watertight external pressure test and non-destructive testing used in the design process are decided in consideration of structural safety for operating external forces in the underwater environment. First, the material of radome is selected for the performance of the UHF-GPS Antenna for communication with the carrier on the underwater operation in consideration of the 20 bar pressure generated. And the material of radome as PA-GF is selected by conducting electromagnetic field analysis and structural analysis and by considering high strength, rigidity and high dielectric constant. Electromagnetic field analysis and structural analysis by the thickness of radome are additionally performed in order to satisfy the required weight of UHF-GPS antenna. After selecting the final model, its structural safety is verified through watertight external pressure test and non-destructive testing.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.37 no.3
• /
• pp.286-291
• /
• 2024

Research on aged insulation of cables by stress is constantly being considered for reliable and stable power transmission of offshore wind farms. This study aimed to evaluate the insulation characteristic of aged XLPE (cross-linked polyethylene) insulation for application of offshore wind farms. In this study, The XLPE insulation of cable was set as various mechanical strains. The XLPE insulation is exposed to the mechanical stress below yield strain of 5%, 10%, and 20%. Aged samples were tested by using the method of AC BDV (alternative current breakdown voltage), tensile strength, elongation, and SEM (scanning electron microscope) to obtain insulation characteristics. The experimental results show that the dielectric breakdown of the sample with a strain 20% was 50% lower than the unaged sample; thereby, demonstrating that the mechanical strain that occurred in the submarine cables can weaken the insulation characteristics. Therefore, mechanical strain should be monitored when laying and operating submarine cables for offshore wind farms.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.32 no.4
• /
• pp.393-400
• /
• 2012

In recent years, nano-structured thin film systems are often applied in industries such as MEMS/NEMS device, optical coating, semiconductor or like this. Thin films are used for many and varied purpose to provide resistance to abrasion, erosion, corrosion, or high temperature oxidation and also to provide special magnetic or dielectric properties. Quite a number of articles to evaluate the characterization of thin film structure such as film density, film grain size, film elastic properties, and film/substrate interface condition were reported. Among them, the evaluation of film adhesive to substrate has been of great interest. In this study, we fabricated the polymeric thin film system with different adhesive conditions to evaluate the adhesive condition of the thin film. The nano-structured thin film system was fabricated by spin coating method. And then V(z) curve technique was applied to evaluate adhesive condition of the interface by measuring the surface acoustic wave(SAW) velocity by scanning acoustic microscope(SAM). Furthermore, a nano-scratch technique was applied to the systems to obtain correlations between the velocity of the SAW propagating within the system including the interface and the shear adhesive force. The results show a good correlation between the SAW velocities measured by acoustic spectroscope and the critical load measured by the nano-scratch test. Consequently, V(z) curve method showed potentials for characterizing the adhesive conditions at the interface by acoustic microscope.

• Journal of the Microelectronics and Packaging Society
• /
• v.27 no.4
• /
• pp.97-105
• /
• 2020

Recently, as the data speed and operating frequencies of Ethernet keeps increasing, electro magnetic interference (EMI) also becomes increasing. The generation of such EMI will cause malfunction of near electronic devices. In this study, EMI filters were applied to reduce the EMI generated by DC-DC SMPS (switching mode power supply), which is the main cause of EMI generation of Ethernet switch. As the EMI filter, MLCCs with excellent withstanding voltage characteristics were used, which had advantages in miniaturization and mass production. Two types of EMI MLCC filters were used, which are X-capacitor and X, Y-capacitor. X-capacitor was composed of 2 MLCCs with 10 nF and 100 nF capacity and 1 Mylar capacitor. Y-capacitor was consisted of 6 MLCCs with a capacity of 27 nF. When only X-capacitor was applied as EMI filter, the conductive EMI field strength exceeded the allowable limit in frequency range of 150 kHz ~ 30 MHz. The radiative EMI also showed high EMI strength and very small allowable margin at the specific frequencies. When the X and Y-capacitors were applied, the conductive EMI was greatly reduced, and the radiation EMI was also found to have sufficient margin. In addition, X, Y-capacitors showed very high insulation resistance and withstanding resistance performances. In conclusion, EMI X, Y-capacitors using MLCCs reduced the EMI noise effectively and showed excellent electrical reliability.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.24 no.3
• /
• pp.219-232
• /
• 2013

This paper presents a microstrip antenna which recovers its resonant frequency and impedance shifted automatically by the approach of other objects such as hands. This can be used for telemetry sensor applications in the ultrahigh frequency(UHF) industrial, scientific, and medical(ISM) band. It is the key element that an frequency-reconfigurable antenna could be electrically controlled. This antenna is miniaturized by loading the folded plates at both radiating edges, and varactor diodes are installed between the radiating edges and the ground plane to control the resonant frequency by adjusting the DC bias asymmetrically. Using this voltage-controlled antenna and the micro controller peripheral circuits of reading the returned level, the antenna is designed and fabricated which recovers its resonant frequency and impedance automatically. Designed frequency auto recovering antenna is conformed to be recovered within a few seconds when the resonant frequency and impedance are shifted by the approach of other objects such as hand, metal plate, dielectric and so on.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.3
• /
• pp.53-58
• /
• 2008

In this study, we fabricated embedded IC (Double Pole Double throw switch chip) polymer substrate and evaluate it for 2.4 GHz WiFi application. The switch chips were laminated using FR4 and ABF(Ajinomoto build up film) as dielectric layer. The embedded DPDT chip substrate were interconnected by laser via and Cu pattern plating process. DSC(Differenntial Scanning Calorimetry) analysis and SEM image was employed to calculate the amount of curing and examine surface roughness for optimization of chip embedding process. ABF showed maximum peel strength with Cu layer when the procuring was $80\sim90%$ completed and DPDT chip was laminated in a polymer substrate without void. An embedded chip substrate and wire-bonded chip on substrate were designed and fabricated. The characteristics of two modules were measured by s-parameters (S11; return loss and S21; insertion loss). Insertion loss is less than 0.55 dB in two presented embedded chip board and wire-bonded chip board. Return loss of an embedded chip board is better than 25 dB up to 6 GHz frequency range, whereas return loss of wire-bonding chip board is worse than 20 dB above 2.4 GHz frequency.