• 마이크로전자및패키징학회지
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• 제26권4호
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• pp.163-169
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• 2019

전자제품에서 사용되던 Sn-Pb계 솔더합금은 RoHS, WEEE, REACH 등의 환경규제에 의해 무연솔더합금(Pb free solder alloy)으로 빠르게 대체되고 있다. 그 중에서도 Sn58%Bi(in wt.%) 합금은 융점이 낮고 Sn-Pb계 합금에 비해 기계적특성이 우수하여, 전자제품 솔더합금으로 사용하기 위한 연구가 진행되고 있다. 그러나 Sn58%Bi 솔더합금은 구성 원소인 Bi의 취성으로 인해 기계적인 신뢰성이 저하되는 문제를 개선할 필요가 있다. 따라서 본 연구에서는 다양한 함량의 Sn-MWCNT (multiwalled carbon nanotube) 입자를 첨가한 Sn58%Bi 복합솔더를 제조한 후, OSP처리된 FR-4 기판 및 FR-4 컴포넌트를 리플로우(reflow) 횟수를 1회부터 7회까지 진행하였다. 접합시편의 접합강도 및 파괴에너지는 전단시험(die shear test)을 통해 측정하였고, 주사전자현미경(scanning electron microscope, SEM)으로 미세조직 및 파괴모드를 분석하였다. Sn-MWCNT 첨가에 의해 Sn58%Bi 복합솔더 접합부에서 조직 미세화가 관찰되었고, 함량이 0.1 wt.%일때 접합강도와 파괴에너지는 각각 20.4%, 15.4% 만큼 증가하였다. 또한 파단면에서 연성파괴(ductile failure) 영역이 관찰되었으며, F-x(force-displacement to failure) 그래프를 통해 Sn-MWCNT의 첨가가 복합솔더의 연성(ductility)을 증가시킨 것을 확인할 수 있었다.

• 한국산학기술학회논문지
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• 제14권8호
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• pp.3650-3655
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• 2013

파인블랭킹 금형을 제작하는 주목적은 전단면의 크기를 최대가 되도록 하기 위함이다. 본 연구에서는 전단면의 크기에 가장 크게 영향을 미치는 클리어런스는 재료 두께의 1%로 고정시키고 전단라인에서 Vee-Ring 중심까지의 거리 변화, V-Ring 각도의 변화, 전단 속도를 변화시키면서 전단 면적의 크기 변화를 연구 고찰하였다. 각 실험으로부터 시편을 채취하여 전단면의 크기를 분석한 결과 V-링의 거리는 2mm, 각도는 외측$45^{\circ}$/내측$30^{\circ}$일 때, 전단 속도는 6.4m/min일 때 전단면의 크기가 가장 크게 됨을 알 수 있었다.

• 산업기술연구
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• 제24권A호
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• pp.29-35
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• 2004

Fine blanking can be considered as a manufacturing process capable of producing sheet metal parts with completely smooth edges that may be hardly obtained by conventional shear-cutting procedures. This fact, together with the considerable economic advantages offered by this process, has been responsible for the rapid acceptance of fine blanking throughout the manufacturing industry all over the world, and the discovery of many new applications. This study was performed to investigate the effect of clearance and V-ring shape on the quality of sheared surface in a fine blanking process. The critical value needed to apply the normalized Cockcroft-Latham fracture criterion to the simulation of fine blanking is obtained by correlating the result of finite element analysis and that of experiment for the uniaxial tensile test. From finite element analysis of an axisymmetric fine blanking process, it has been found that punch load, die-roll depth, burnish zone size and shape of sheared surface are considerably influenced by clearance and V-ring shape.

• Nuclear Engineering and Technology
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• 제52권8호
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• pp.1714-1723
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• 2020

This study aims at characterizing the rheological properties of uranium oxide powders for nuclear fuel pellets manufacturing. The flowability of these powders must be compatible with a reproducible filling of press molds. The particle size distribution is known to have an impact on the rheological properties and fine particles (<100 ㎛) are suspected to have a detrimental effect. In this study, the impact of the particle size distribution on the rheological properties of UO₂ powders was quantified, focusing on the influence of fine particles. Two complementary approaches were used. The first approach involved characterizing the powder in a static state: density, compressibility and shear test measurements were used to understand the behavior of the powder when it is transitioned from a static to a dynamic state (i.e., incipient flow conditions). The second approach involved characterizing the behavior of the powder in a dynamic state. Two zones, corresponding to two characteristic behaviors, were demonstrated for both types of measurements. The obtained results showed the amount of fines should be kept below 10 % wt to ensure a robust mold filling operation (i.e., constant mass and production rate).

• 접착 및 계면
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• 제6권4호
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• pp.12-17
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• 2005

Natural fiber/phenolic biocomposites with chopped henequen fibers treated at various levels of electron beam irradiation (EBI) were made by means of a matched-die compression molding method. The interfacial property was explored in terms of interfacial shear strength measured by a single fiber microbonding test. The thermal properties were studied in terms of storage modulus, tan ${\delta}$, thermal expansion and thermal stability measured by dynamic mechanical analysis, thermomechanical analysis and thermogravimetric analysis, respectively. The result showed that the interfacial and thermal properties depend on the treatment level of EBI done to the henequen fiber surfaces. The present result also demonstrates that 10 kGy EBI is most preferable to physically modify the henequen fiber surfaces and then to improve the interfacial property of the biocomposite, supporting earlier results studied with henequen/poly (butylene succinate) and henequen/unsaturated polyester biocomposites.

• 한국재료학회지
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• 제22권9호
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2003년도 추계학술발표대회 논문집
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• pp.46-49
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• 2003

Cu have been widely used as signal transmission materials for electrical electronic components owing to its high electrical conductivity. However, it's size have been limited to small ones due to its poor mechanical properties, Until now, strengthening of the copper at toy was obtained either by the solid solution and precipitation hardening by adding alloy elements or the work hardening by deformation process. Adding the at toy elements lead to reduction of electrical conductivity. In this aspect, if carbon nanofiber is used as reinforcement which have outstanding mechanical strength and electric conductivity, it is possible to develope Cu matrix nanocomposite having almost no loss of electric conductivity. It is expected to be innovative in electric conduct ing material market. The unidirectional alignment of carbon nanofiber is the most challenging task developing the copper matrix composites of high strength and electric conductivity In this study, the unidirectional alignment of carbon nanofibers which is used reinforced material are controlled by drawing process in order to manufacture the intermediary materials for the carbon nanofiber reinforced Cu matrix nanocomposite and align mechanism as well as optimized drawing process parameters are verified via experiments and numerical analysis. The materials used in this study were pure copper and the nanofibers of 150nm in diameter and of $10~20\mu\textrm{m}$ In length. The materials have been tested and the tensile strength was 75MPa with the elongation of 44% for the copper it is assumed that carbon nanofiber behave like porous elasto-plastic materials. Compaction test was conducted to obtain constitutive properties of carbon nanofiber. Optimal parameter for drawing process was obtained by experiments and numerical analysis considering the various drawing angles, reduction areas, friction coefficient, etc Lower reduction areas provides the less rupture of cu tube is not iced during the drawing process. Optimal die angle was between 5 degree and 12 degree. Relative density of carbon nanofiber embedded in the copper tube is higher as drawing diameter decrease and compressive residual stress is occurred in the copper tube. Carbon nanofibers are moved to the reverse drawing direct ion via shear force caused by deformation of the copper tube and alined to the drawing direction.

• The Journal of Advanced Prosthodontics
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• 제7권2호
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• pp.146-150
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• 2015

PURPOSE. This in vitro study aimed to compare the failure load and failure characteristics of two different zirconia framework designs of premolar crowns when subjected to static loading. MATERIALS AND METHODS. Two types of zirconia frameworks, conventional 0.5 mm even thickness framework design (EV) and 0.8 mm cutback of full contour crown anatomy design (CB), were made for 10 samples each. The veneer porcelain was added on under polycarbonate shell crown made by vacuum of full contour crown to obtain the same total thickness of the experiment crowns. The crowns were cemented onto the Cobalt-Chromium die. The dies were tilted 45 degrees from the vertical plane to obtain the shear force to the cusp when loading. All crowns were loaded at the lingual incline of the buccal cusp until fracture using a universal testing machine with cross-head speed 0.5 mm/min. The load to fracture values (N) was recorded and statistically analyzed by independent sample t-test. RESULTS. The mean and standard deviations of the failure load were $1,170.1{\pm}90.9$ N for EV design and $1,450.4{\pm}175.7$ N for CB design. A significant difference in the compressive failure load was found (P<.05). For the failure characteristic, the EV design was found only cohesive failures within veneering porcelain, while the CB design found more failures through the zirconia framework (8 from 10 samples). CONCLUSION. There was a significant difference in the failure load between two designs, and the design of the framework influences failure characteristic of zirconia crown.

• 한국전기전자재료학회논문지
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• 제25권10호
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• pp.844-848
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• 2012

Encapsulant curing in terms of convection oven leads to thermal induced stress due to nonuniform thermal conductivity in LED package. We have adopted infrared (IR) light for silicone curing in order to release the stress. The light uniformity irradiated on an encapsulant surface is confirmed to be uniform by optical simulation. Shear strength of die paste using IR compared to convection oven is increased 19.2% at the same curing time, which indicates curing time can be shortened. The indentation depth difference between center and edge of silicone encapsulant in terms of convection oven and IR are 14.8% and 3.4%, respectively. Curing by IR also shows 2.3% better radiant flux persistency rate of LED at $85^{\circ}C$ after 1,000 h reliability test compared to convection curing.

• 마이크로전자및패키징학회지
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• 제14권4호
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• pp.79-85
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• 2007

본 연구의 목적은 OSP, 전해 Au과 무전해 Ni/Au로써 표면처리를 달리한 연성회로기판 상에 Au 스터드 플립칩 범프의 초음파 접합 가능성을 연구하는 것이었다. Au 스터드 범프는 표면처리 방법에 상관없이 성공적으로 연성회로기판의 패드 상에 초음파 접합되었다 접합 강도는 접합 시간에 민감하게 영향을 받았다. 접합 시간이 길어짐에 따라 접합 강도는 증가하였으나, 2초 이상의 접합 시간에서는 이웃 범프끼리 단락되는 bridge 현상이 발생하였다. 최적 접합조건은 OSP 처리된 가판상에 0.5초간 초음파 접합하는 것이었다.