• 마이크로전자및패키징학회지
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• 제18권3호
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• pp.45-52
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• 2011

Flip Chip Ball Grid Array (FCBGA) 패키지의 솔더조인트 신뢰성을 평가하기 위한 방법으로는 다이 충격법, 다이 전단법, 3점 굽힘법, 열충격법 등이 활용된다. 본 연구에서는 솔더 접합부의 주요 고장메카니즘인 취성파괴를 확인하기 위한 방법으로 리플로우 상태, $85^{\circ}C$/85%RH 처리, $150^{\circ}C$/10hr 에이징의 처리한 후, 4가지 평가법으로 평가를 진행하여 파단모드를 분석하였다. 본 연구결과에서는 다이 충격법과 다이 전단법의 Good joint rate (GJR, %)는 리플로우 상태와 $85^{\circ}C$/85%RH처리에서 각각 89~91%와 100% 였으며, $150^{\circ}C$/10hr 에이징에서는 66%와 90%를 나타내었다. 3점 굽힘법과 열충격법의 GJR(%)는 3종류 샘플에서 모두 100%를 나타내어 변별력이 없었다. C4 솔더접합부의 신뢰성 평가법에 따른 GJR(%)의 변별력을 확인할 수 있는 방법은 die shock 과 die shear test였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.303-304
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• 2005

In this paper, we report a fluxless eutectic die bonding process which uses 80Au-20Sn eutectic alloy. The chip LEDs are picked and placed on silicon substrate wafers. The bonding process temperatures and force are $305\sim345^{\circ}C$ and 10$\sim$100gf, respectively. The bonding process was performed on graphite heater with nitrogen atmosphere. The quality of bonding are evaluated by shear test and thermal resistance. Results of fluxless eutectic die bonding show that shear strength is Max. 3.85kgf at 345$^{\circ}C$ /100gf and thermal resistance of junction to die bonding is Min. 3.09K/W at 325$^{\circ}C$/100gf.

• 마이크로전자및패키징학회지
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• 제12권4호통권37호
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.797-801
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• 2003

The mechanical properties such as shear strength and the hardness of milli-size products that manufactured for various process parameters by forward extrusion using square dies are investigated. Shear strength test is implemented for the observation of relation between vickers hardness and shear strength in the interface of head and shaft part of a stepped pin. When the extrusion ratios of pure aluminum and pure copper billets increase, the hardness on both the surface and the center line of a pin also increase, especially the hardness on the surface is shown to be a little higher than on the center. The existence of knock-out pad in extrusion die caused hardness increase in the interface of a extruded pin. As compared shear strength with hardness of a pin, the approximated linear relations are suggested in this study.

• 대한기계학회논문집A
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• 제26권7호
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• pp.1340-1347
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• 2002

Finite element simulations are being widely used to increase the efficiency and effectiveness of design of bulk metal forming processes. In such simulations, proper consideration of friction condition is crucial in obtaining reliable results. For this purpose, tip test based on backward extrusion was proposed recently. In this lest, a cylindrical billet is positioned in a shallow groove of a counter punch for centering purpose and formation of a radial tip is induced on the extruded end of the workpiece. In this study, the effect of centering groove on tip test was investigated. The quantitative ratio of the shear friction factors between the punch and die was numerically determined depending on the shape of centering groove. Also, surface expansion and pressure distribution along the punch and die were considered in order to better understand the reason that friction condition at the punch compared to the one of die was more severe.

• 소성∙가공
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• 제32권2호
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• pp.61-66
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• 2023

The quality of the sheared surface affects the stretch flangeability of steel sheet. The quality of sheared surface is influenced by several process factors such as die clearance, shape of cutting edge, use of counter punch, and shear. In this paper, the influence of these shearing process factors on the stretch flangeability of the HSS (DP980) was analyzed through a shearing and a stretch flangeability test. When the die clearance was 10%, the effect of these shearing process factors on the stretch flangeability was the greatest, and the use of an acute angle blade was found to be more advantageous in the stretch flangeability than a right angle blade. It was found that the stretch flangeability was improved when active bending was applied during shearing.

• Journal of Welding and Joining
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• 제31권3호
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• Journal of Welding and Joining
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• 제20권4호
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• pp.498-504
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• 2002

Fluxless flip chip bonding process using plasma treatment instead of flux was investigated. The effect of plasma process parameters on tin-oxide etching characteristics were estimated with Auger depth profile analysis. The die shear test was performed to evaluate the adhesion strength of the flip chip bonded after plasma treatment. The thickness of oxide layer on tin surface was reduced after Ar+H2 plasma treatment. The addition of H2 improved the oxide etching characteristics by plasma. The die shear strength of the plasma-treated Sn-Pb solder flip chip was higher than that of non-treated one but lower than that of fluxed one. The difference of the strength between plasma-treated specimen and non-treated one increased with increase in bonding temperature. The plasma-treated flip chip fractured at solder/TSM interface at low bonding temperature while the fracture occurred at solder/UBM interface at higher bonding temperature.

• 대한금속재료학회지
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• 제47권4호
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• pp.261-266
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• 2009

The mechanical and electrical properties of ball grid array (BGA) solder joints were measured, consisting of Sn-3.5Ag, with organic solderability preservative (OSP)-finished Cu pads and Electroless Nickel/Immersion Gold (ENIG) surface finishes. The mechanical properties were measured by die shear test. When ENIG PCB was upper joint and OSP PCB was lower joint, the highest shear force showed at the third reflow. When OSP PCB was upper joint and ENIG PCB was lower joint, the highest shear force showed at the forth reflow. For both joints, after the die shear results reached the highest shear force, shear force decreased as a function of increasing reflow number. Electrical property of the solder joint decreased with the function of increasing reflow number. The scanning electron microscope results show that the IMC thickness at the bonding interface gets thicker while the number of reflow increases.

• Preventive Nutrition and Food Science
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• 제5권1호
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• pp.25-31
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• 2000

Extrusion conditions for production of rice extrudate were studied. The optimal production conditions of rice extrudate were determined by the relationship between dependent variables such as expansion ratio, shear strength and color change and independent variables such as moisture content of raw material, screw speed, and die tem-perature of extruder. The textural quality of rice exturdate was significantly affected by the moisture content of raw material (x1), screw speed (x2), and die temperature (x3) of extruder. The expansion ratio of rice extrudate showed the highest value at the moisture content of 18% of raw material, and the lowest at 24%, and whose regression equation was Y=34.8967 - 3.219X1 - (0.623$\times$10-2)X2 + 0.136X3 + (0.648$\times$10-1)X12 + (0.138$\times$10-3)X1X2 + (0.456$\times$10-4)X22 + (0.719$\times$10-3)X1X3 -(0.515$\times$10-3)X2X3- (0.552$\times$10-3)X32. The most desirable texture of rice extrudate determined by shear test and sensory evaluation was obtained at the following conditions : mois-ture content of 18% of raw material, screw speed of 210 rpm and die temperature of 11$0^{\circ}C$. The rice extrudate prepared under the above conditions showed the lowest shear force of 954g at which the highest sensory score was obtained.