• Title/Summary/Keyword: Die pad

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A Study on the Influence of the Integrated Structure and Independent of the Die Pad on the Products thickness in the Drawing Process (드로잉 가공에서 다이패드의 독립형과 일체형 구조가 제품 두께에 미치는 영향에 관한 연구)

  • Lee, Chun-Kyu;Nam, Seung-Done
    • Journal of the Korea Safety Management & Science
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    • v.17 no.2
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    • pp.235-240
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    • 2015
  • Using a progressive die of the multi-stage drawing product, It was experiments for the Influence of the Products Roundness on the die pad process Safety die model, obstacle countermeasure research safety die design When the die pad is independent structure, Sidewall thickness of the inside 2stage, 3stage, 4stage of the product is thicker, the thickness of the inside 1stage and the bottom is thinner. it was become unstable beacuse the inside 1stage related to the Products Roundness is thinner. When the die pad is Integrated structure, Sidewall thickness of the inside 1stage, 2stage of the product is thicker, and Sidewall 3stage and 4stage was a thin. it was become unstable beacuse the inside 3stage related to the Products Roundness is thinner. Therefore, The appropriate combination of and integrated independent is required for each process.

A study on the deformation of thickness by drawing process of upper housing products (Upper housing 제품의 드로잉공정에 의한 두께 변형 고찰)

  • Lee, Beom-Soon;Kim, Ok-Hwan
    • Design & Manufacturing
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    • v.13 no.1
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    • pp.31-35
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    • 2019
  • For manufacturing upper housing product of mechanical control valve, the progressive drawing process was conducted experimental. Then, the center of the product was cut to measure the thickness of the product. As a result, the following conclusions were obtained. By means of a stand-alone pad provided with sufficient pressure, it is possible to prevent the occurrence of wrinkles in the die pad product of the drawing process. As a result of the experiment, it was considered that the flange bottom of the product and the lower edge of the product are made thick in thickness, the top edge and the top surface are thin. It is considered that this is due to the size and roughness of the entrance edge radius of the die in the drawing process, and the inflow of the material by the die pad.

Studies on the Forming Process for the Bipolar Plate of Fuel Cells

  • Jin, Chul-Kyu;Lee, Jun-Kyoung
    • Journal of the Korean Society of Industry Convergence
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    • v.21 no.4
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    • pp.175-181
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    • 2018
  • Stamping process and rubber pad forming process were performed to manufacture the bipolar plate for fuel cells. For that, a vacuum die casting process and a semi-solid forming process wherein liquid-state materials were used were adopted. After preparing the blank with the stainless steel thin plate having a thickness of 0.1 mm, the bipolar plate channel was formed with the stamping process and rubber pad forming process. The depth of the bipolar plate channel prepared by the stamping method was 0.45 mm and the depth of the bipolar plate channel prepared by the rubber pad forming process was 0.41 mm. Meanwhile, with the vacuum die casting and semi solid forming, the bipolar plate having a channel depth of 0.3 mm, same as the size of the die, could be formed.

A Study on the Life Prediction and Quality Improvement of Joint in IC Package (플라스틱 IC 패키지 접합부의 수명예측 및 품질향상에 관한 연구)

  • 신영의;김종민
    • Journal of Welding and Joining
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    • v.17 no.1
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    • pp.124-132
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    • 1999
  • Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

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Heating and Cooling Channel Design of Cross-Shaped Die for Warm Forming of Magnesium Alloy Sheet (Mg 온간성형을 위한 십자형상 금형의 가열/냉각 채널 설계)

  • Choi, S.C.;Ko, D.S.;Kim, H.Y.;Kim, H.J.;Hong, S.M.;Ryu, S.Y.;Shin, Y.S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2008.05a
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    • pp.370-373
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    • 2008
  • It is known that the temperatures of die, punch, holder and punch pad need to be kept different to get better formability in Mg sheet forming processes. Heating and cooling channels are usually equipped in each tool to assign different temperature. This study focused on the optimal design of the heating and cooling channels for a cross-shaped deep drawing die set. While the die and blankholder were heated to and kept at $250^{\circ}C$ by using heat cartridges, the punch and punch pad were kept at much lower temperature than that of the die and blankholder by water circulating through cooling channels. All the approaches were done by numerical analyses, aiming to maximize the cup height and to minimize the punch corner radius without any failure.

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Numerical Analysis on the Die Pad/Epoxy Molding Compound(EMC) Interface Delamination in Plastic Packages under Thermal and Vapor Pressure Loadings

  • Jin Yu
    • Journal of the Microelectronics and Packaging Society
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    • v.5 no.2
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    • pp.37-48
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    • 1998
  • The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

Consideration of thickness change during progressive drawing process of automotive coupler parts(AL5052-H32) (자동차 커플러 부품(Al5052-H32)의 프로그래시브 드로잉 공정 시 두께 변화 고찰)

  • Park, Sang-Byung;Yun, Jae-Woong
    • Design & Manufacturing
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    • v.14 no.3
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    • pp.37-43
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    • 2020
  • Progressive drawing processing is one of the manufacturing processes used to mass-produce a variety of products on the industrial site. In this study, the goal is to achieve a uniform product thickness of at least 1.3mm by reducing the wall thickness of the coupler parts used in automotive air conditioning systems to within 15% using A5052-H32 materials. The progressive die was designed using Blank's law of volume invariance. Due to the characteristics of the drawing process, the material thickness in the punch R part decreases and the thickness in the die R part increases. When designing the progressive die of the coupler part, an ironing method, a push back method, and a stand-alone die pad method were applied to each process to design a mold in consideration of the drawing rate and to artificially adjust the thickness change. The suitability of the method used in die design was investigated by measuring the thickness change of forming parts for each process. In the final part, it was confirmed that the thickness measurement values of the five regions of a radial line were implemented as 1.34-1.36 mm.

Experimental Study on Process Design of Rubber Pad Bending (고무 패드 벤딩 공정설계에 관한 실험적 연구)

  • Kwon, Hyuck-Cheol;Im, Yong-Taek;Ji, Dong-Cheol;Rhee, Meung-Ho
    • Proceedings of the KSME Conference
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    • 2000.11a
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    • pp.407-412
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    • 2000
  • In this study, a research for process design in bending of structural frame of AA6061-T6 with rubber pad was conducted. In this process, the conventional lower die made of metal is replaced with a polyurethane pad, resulting in high flexibility during bending. Vulcanized polyurethane rubber with shore A hardness of 60 was used for the pad. Experiments on a newly developed bending machine were carried out by controlling the stroke of the roller and horizontal movement of roller pad lower die. From this, the relation between roller path and geometry of the materials bent was obtained for the process design of producing roof rail part of a passenger car and the experimental result was compared with the target profile. For more accurate process design, it is required to control the roller path interactively. Based on the experience in developing the prototype bending machine, it is construed that a fully automated bending system with rubber pad to produce various light-weight components for automotive body frames can be successfully developed.

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Influence of Die Design Variables on the Sheared Surface in Shearing Process of Sandwich Sheet Metal (샌드위치 강판의 전단가공에 있어서 전단면에 미치는 금형 설계 변수의 영향)

  • Kim J. Y.;Chung W. J.;Kim J. H.
    • Transactions of Materials Processing
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    • v.14 no.1 s.73
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    • pp.37-42
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    • 2005
  • In order to invstigate the influence of die design variables on the quality of the sheared surface in cutting of sandwich sheet metals, the cut-off operation is carried out, which is the typical shearing process in sheet metal forming technology. For experiments we made the cut-off die which can be easily adjusted for die design variables such as blankholding force, pad force and clearance. The sandwich sheet metals considered are clad304(STS304-Al1050-STS304) and anti-vibration sheet metal. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results it is shown that the shearing mechanisms are different according the material of which sandwitch sheet metal is composed. The influence of die design variable is explored and we found optimal conditions for both sandwich sheet metals. It is expected that this investigation can be utilized to get the better sheared surface.

Fabrication of a high performance microvalve using a multilayer piezoelectric actuator and its characteristics (적층형 압전 엑츄에이터를 이용한 고성능 마이크로 밸브의 제작과 그 특성)

  • Seo, Jung-Ho;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.390-391
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    • 2006
  • This paper describes the design, fabrication and characteristics of a micromachined piezoelectric valve utilizing a multilayer ceramic actuator (MCA). The micromachined MCA valve, which uses a buckling effect, consists of three separate structures: the MCA, the valve actuator die and the seat die. The valve seat die with 6 trenches was made, and the actuator die, which is driven by the MCA under optimized conditions, was also fabricated. After Si wafer direct bonding between the seat die and the actuator die, the MCA was also anodically bonded to the seat/actuator die structure. A polydimethylsiloxane (PDMS) sealing pad was fabricated to minimize the leak rate. Finally, the PDMS sealing pad was also bonded to the seat die and the stainless steel package. The MCA valve shows a flow rate of 9.13 sccm at an applied DC voltage of 100 V with a 50% duty cycle and a maximum non-linearity of 2.24% FS. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, as a medical bio-system and in the automobile industry.

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