• Journal of Korea Foundry Society
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• v.24 no.6
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• pp.347-355
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• 2004

In the die casting process, the flow of liquid metal has significant influence on the quality of casting products and die life. For the optimal process design of automobile gear housing, various analyses were performed in this study by using computer simulation code, MAGMAsoft. The simulation has been focused on the molten metal behaviors during the mold filling and solidification stages for the sound casting products. Also the internal defects were predicted by application of air pressure and feeding criteria.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.694-697
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• 2005

The design of experiments are used for optimal design of formed tools to machine automobile bearing rubber seal die, which is classified into the high precision rubber mold. The clearance angle, rake angle and the length cutting edge are considered as the factors. The cutting force is selected to be a characteristic value and compared with the mean tool wear and life by repeated experiments. The design of the experiment is based on the repeated one-way factorial design, which finds the significance of the factors and the best level to predict the tool life by using ANOVA and regression.

• Proceedings of the KAIS Fall Conference
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• 2004.11a
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• pp.56-58
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• 2004

프레스금형의 부품 중에서 펀치와 다이플레이트를 제작하는 방법은 공작기계만을 사용하여 제작하는 경우와 공작기계와 와이어 컷 방전가공기를(W-EDM)를 병행 사용하는 경우가 있다. 그런데 공작기계만을 사용하여 제작 할 때는 금형수명(Die Life)이 200만-230만 스트로크였는데 와이어 컷 방전가공기를 사용한 제작에서는 70만-80만 스트로크에서 금형수명을 다하고 있다. 이것은 W-EDM후에 발생되는 가공변질층으로 예측되므로 W-EDM전과 W-EDM후의 가공면에 대한 SEM촬영을 실시하여 가공변질충의 발생여부를 확인하고 이에 대한 제거방법을 연구하고자 하였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.12
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• pp.3899-3908
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• 1996

In order to clarify the effects of nonmetallic inclusion contents insteels (SM45C & SCM440) on the tool life, cutting experiment was performed under various cutting conditions. Tool life, cutting force, roughness of machined surface and cutting mechanism are examined on these two kinds of steel. The following conclusions were obtained from the analysis (1) Cutting force of the steels was not affected by chemical component and nonmetallic inclusion. (2) If the rate of amount, Ca/S has a value grater than about 0.2 and addition of less amount of Al, Mn, tool wear of tips decreasesinturning. (3) It is also proved that higher contents of nonmetallic inclusion improve roughness of the surface. (4) Less amount of Ca, higher amount of S, Mn and Al improve the chip breakability.

• The Korean Society of Law and Medicine
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• v.23 no.2
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• pp.67-96
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• 2022

"Aid in Dying" means that when a decision-making patient suffers from an incurable disease, a drug that can speed up death is prescribed by a doctor and used to lead to death. Since the suspension of life-sustaining treatment was institutionalized based on human dignity and patient autonomy, the question of whether assisted death can be legally justified in relation to the right to receive medical help to shorten one's life to die with dignity has recently been actively discussed. In Korea, since the suspension of life-sustaining treatment was institutionalized by the enactment of the Life-sustaining Treatment Decision Act in 2016, an amendment to the Life-sustaining Treatment Act was recently proposed to legalize Aid in Dying. The global trend is that human "Right to Die" is discussed in the division of life and death, from the suspension of life-sustaining treatment to assisted death, and again in the order of euthanasia. In this paper, we started discussing dignified death and institutionalized patients' right to self-determination, looked at the controversy in the United States, which legislated assisted death in many states since the 2000s, and analyzed the main contents of California's End of Life Option Act and the data after enforcement. The strict requirements for Aid in Dying, such as voluntary confirmation of patients' intentions and doctors' obligation to provide information, and the results of California's Aid in dying system, composed of relatively diverse races, were reviewed.

• Transactions of Materials Processing
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• v.23 no.2
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• pp.88-94
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• 2014

The under-drive brake piston is an essential part in the automatic transmissions of automobiles. This component is manufactured by forging after blanking from S55C plate with a thickness of 6mm. It is difficult to design the plate forging process using a thick plate approach since there will be limited material flow as well as large press loads. Furthermore, the under-drive brake piston has a complex shape with a right angle step, which often results in die unfill and abrupt increase in press load. To overcome these obstacles, a separate die for filling material sufficiently to the corner of the right angle step is proposed. However, this approach induces an uncontrolled workpiece surface between the dies, resulting in flash. This excess flash degrades the tool life in the final machining after cold forging as well as increases the cycle time to obtain the net-shape of the part. In the current study, we propose an optimum process design using a conventional die shaped with the benefit of finite element analysis. This approach enhanced the process efficiency without sacrificing the dimensional accuracy in the forged part. As the result, the optimum plate forging process was done with a two stage die, which reduces weight of by 6% compared with previous process for the under-drive brake piston.

• Journal of Biosystems Engineering
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• v.35 no.5
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• pp.336-342
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• 2010

This study was performed to develop extrusion pelletizer for pelletizing the compost waste food. The effect of water content on the shape of pellet, the relationship between diameter of pellet and of extrusion hole and the relationship between extrusion force and die angle were investigated. Considering the stable shape of compost pellet and the operation efficiency of pelletizer, the water content of 2~4% was considered as the best condition. And the compost pellet could not maintain it's shape at the water content of 10% or over. The strongest extrusion force was needs when the die angle had $90^{\circ}C$ in 6 mm extrusion hole diameter, on the other hand, the weakest extrusion force was need at the die angle of $45^{\circ}{\sim}65^{\circ}$. The compression strength of pellet shows the highest strength of 9.2Mpa when we make the compost pellet after screening the compost and make it with a size of 1.18 mm(No.16) or less.

• Design & Manufacturing
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• v.11 no.1
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• pp.7-13
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• 2017

The aim of this study is to develop the dies oven for energy-saving during the pre-heated process of extrusion dies. Applying high-efficiency near-infrared heater, single cell type dies oven was developed as a substitute for traditional chest type oven. Therefore the dies is individually heated uniformly to operation temperature so rapidly. By using the developed dies oven, electric-energy consumption of preheating extrusion dies reduced up to 30% and the waiting time in the oven also minimized up to 90min. In addition, the results have shown that it is possible to accurately control the dies temperature for improving the quality of extruded profile and to minimize die bearing oxidation and nitride layer degradation responsible for surface defects on the profile and shorter die life.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.942-945
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• 2005

Micron-sized metal wires are widely used in industries such as filtration, catalyst and composite materials, etc. In the wire drawing process, the die that is used conventionally is an effective and, at the same time, sensitive component. However, a typical array of the dies has caused many problems in the wire drawing process, e.g., large frictional force on the interface between wire and the resulting high heat generation, precise adjustment of the dies, extended cooling system, die abrasion, etc.. Because of these problems, there have been many works that are aiming at improving the efficiency of wire drawing process by analyzing the die geometry and by applying advanced die material to prolong the die life or even at developing a dieless wire drawing system. This paper is dealing with developing a new wire drawing system that is applicable to reduce the wire drawing steps with high draw ratio. The new wire drawing system does not use the dies, but use the self-induced heater that works on the basis of the resonant phenomenon of wire material. The electromagnetic wave is the heating source. The results of the study on the diameter reduction and microwave flow analysis show that the heating effectiveness of the wire is influenced by the energy distribution in the microwave propagation chamber. We can obtain diameter-reduced wires by using microwave in the dieless drawing process. Microwave as a heating source is capable of producing wires without applying dies in wire drawing process.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.