• 제목/요약/키워드: Die Soldering

검색결과 14건 처리시간 0.058초

Al 합금과 STD61강의 소착에 미치는 첨가원소 Fe, Mn의 영향 (Effects of Fe, Mn Contents on the Al Alloys and STD61 Steel Die Soldering)

  • 김유미;홍성길;최세원;김영찬;강창석
    • 한국재료학회지
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    • 제22권4호
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    • pp.169-173
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    • 2012
  • Recently, various attempts to produce a heat sink made of Al 6xxx alloys have been carried out using die-casting. In order to apply die-casting, the Al alloys should be verified for die-soldering ability with die steel. It is generally well known that both Fe and Mn contents have effects on decreasing die soldering, especially with aluminum alloys containing substantial amounts of Si. However, die soldering has not been widely studied for the low Si aluminum (1.0~2.0wt%) alloys. Therefore, in this study, an investigation was performed to consider how the soldering phenomena were affected by Fe and Mn contents in low Si aluminum alloys. Each aluminum alloy was melted and held at $680^{\circ}C$. Then, STD61 substrate was dipped for 2 hr in the melt. The specimens, which were air cooled, were observed using a scanning electron microscope and were line analyzed by an electron probe micro analyzer. The SEM results of the dipping soldering test showed an Al-Fe inter-metallic layer in the microstructure. With increasing Fe content up to 0.35%, the Al-Fe inter-metallic layer became thicker. In Al-1.0%Si alloy, the additional content of Mn also increased the thickness of the inter-metallic layer compared to that in the alloy without Mn. In addition, EPMA analysis showed that Al-Fe inter-metallic compounds such as $Al_2Fe$, $Al_3Fe$, and $Al_5Fe_2$ formed in the die soldering layers.

Al-9Si-0.3Mg 주조용 합금에서 Sludge 형성이 금형소착 반응층 두께에 미치는 영향 (Effect of Sludge Formation on the Thickness of Die Soldering Reaction Layer in Al-9Si-0.3Mg Casting Alloy)

  • 김헌주
    • 한국주조공학회지
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    • 제30권2호
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    • pp.76-82
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    • 2010
  • Effect of reaction time and sludge formation on the thickness of die soldering reaction layer has been studied in Al-9Si-0.3Mg casting alloy. Ternary ${\alpha}_{bcc}-Al_8Fe_2Si$ and ${\alpha}_{hcp}-Al_8Fe_2Si$ intermetallic compounds formed at the interface of SKD61 tool steel by interaction diffusion of Al, Fe and Si atoms after 0.5hr and 6hr immersion time, respectively. Binary ${\eta}-Fe_2Al_5$ additionally formed at the interface of SKD61 tool steel after 10hr immersion time. Thickness of soldering reaction layer in die surface increased as immersion time increased from 0.5hr to 24hr. Sludge formation was ascertained in the samples which were immersed in the melts more than 10hr. Reaction of die soldering after sludge formation was more accelerated than that of before sludge formation due to a decrease in Fe content, followed by higher diffusion rate of Al in the melt by sludge formation.

SKD61 금형강의 소착 반응층 두께에 미치는 Al-9wt%Si-0.3wt%Mg 합금의 Fe, Mn 영향 (Effect of Fe, Mn Contents of Al-9wt%Si-0.3wt%Mg Alloys on the Thickness of Die Soldering Reaction Layer for SKD61 Die Steel)

  • 김헌주;조치만;정창렬
    • 한국주조공학회지
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    • 제29권4호
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    • pp.169-175
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    • 2009
  • Effect of iron and manganese contents on die soldering reaction has been studied in Al-9wt.%Si-0.3wt.%Mg alloy. Ternary ${\alpha}_{hcp}-Al_8Fe_2Si$ and ${\alpha}_{bcc}-Al_8Fe_2Si$ intermetallic compounds formed by interaction diffusion between Al-Si-Mg system alloy melt and SKD61 die steel surface. Thickness of soldering reaction layer in die steel surface decreased as Fe and Mn contents of the melts increased : When Fe content of Al-9wt.%Si-0.3wt.%Mg melts at constant 0.5wt%Mn content was 0.15wt.%, 0.45wt.% and 0.6wt.%, thickness of soldered layer of each alloy was $64.5{\mu}m,\;57.3{\mu}m$ and $46.9{\mu}m$ respectively. For Mn content of the alloy melts at constant 0.45wt.%Fe content was 0.30wt.%, 0.50wt.% and 0.70wt.%, thickness of soldered layer of each alloy was $66.1{\mu}m,\;57.3{\mu}m$ and $48.3{\mu}m$ respectively.

다이캐스팅 금형의 내구 수명평가와 금형강 소재 선정에 대한 연구 (Study on Life Evaluation of Die Casting Mold and Selection of Mold Material)

  • 김진호;홍석무;이종찬
    • 한국기계가공학회지
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    • 제12권3호
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    • pp.7-12
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    • 2013
  • In Die casting process, the problem of die degradation is often issued. In oder to increase of die life the material degradation of die steel was investigated using test core pins. Three test core pins were positioned in front of the gate entry and observed washout and soldering resistance during Mg die casting process. The test parameters are set as different commercial die materials, coatings condition and hardness of die surface. Usign 220t magnesium die casting machine was employed to cast AZ91 magnesium alloys. After 150 shots, macroscopic observation of die surface was carried out. Additional 50 cycles later, test pins were chemically cleaned with 5% HCl aqueous solution to find out the existence of washout and soldering layers. Microstructural characterization of die surface and the die roughness measurement were performed together. Computational simulation using AnyCasting program was also beneficial to correlate the extent of die damage with the position of test pin inside die cavity. As results, the optimal combination of die steel with productive coating as well as its hardness was drawn out. it will be helpful to decide the material and condition considering increasing of tool life.

Numerical Analysis on the Die Pad/Epoxy Molding Compound(EMC) Interface Delamination in Plastic Packages under Thermal and Vapor Pressure Loadings

  • Jin Yu
    • 마이크로전자및패키징학회지
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    • 제5권2호
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    • pp.37-48
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    • 1998
  • The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

다꾸찌방법을 사용한 여러변수들이 패키지균열에 미치는 신뢰도 평가 (Estimate of package crack reliabilities on the various parameters using taguchi's method)

  • 권용수;박상선;박재완;채영석;최성렬
    • 대한기계학회논문집A
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    • 제21권6호
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    • pp.951-960
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    • 1997
  • Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.

Ag/Sn/Ag 샌드위치 구조를 갖는 Backside Metallization을 이용한 고온 반도체 접합 기술 (High-temperature Semiconductor Bonding using Backside Metallization with Ag/Sn/Ag Sandwich Structure)

  • 최진석;안성진
    • 마이크로전자및패키징학회지
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    • 제27권1호
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    • pp.1-7
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    • 2020
  • The backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process and high remelting temperature because the interfacial structure composed of intermetallic compounds with higher melting temperatures than pure metal layers after die attach process. Here, we introduce a die attach process with the Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we investigated the evolution of the interfacial structures and evaluated the shear strength of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge).

Sn-3.5Ag 무연 솔더를 이용한 Si-wafer와 FR-4기판의 상온접합 (Ultrasonic bonding between Si-wafer and FR-4 at room temperature using Sn-3.5Ag solder)

  • 김정모;조선연;김규석;이영우;정재필
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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    • pp.54-56
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    • 2005
  • Ultrasonic soldering using of Si-wafer to FR-4 PCB atroom temperature was investigated. Sn3.5Ag foil rolled $100{\mu}m$ was used for solder. The UBM of Si-die was Cu/ Ni/ Al from top to bottom and its thickness was $0.4{\mu}m$, $0.4{\mu}m$, $0.3{\mu}m$ respectively. Pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom and its thickness was $0.05{\mu}m$, $5{\mu}m$, $18{\mu}m$ respectively. The ultrasonic soldering time was changed from 0.5sec to 3.0sec and its power 1400W. As experimental result, reliable bond joint by ultrasonic at room temperature was obtained. The shear strength increased with soldering time up to 2.5 sec. That means at 2.5sec, the shear strength showed maximum rate of 65.23N. The strength decreased to 33.90N at 3.0 sec because the cracks generated along the intermetallic compound between Si-wafer and Sn-3.5mass%Ag solder. intermetallic compound produced by ultrasonic between the solder and the Si-die was $(Cu, Ni)_{6}Sn_{5}$ and the intermetallic compound between solder and pad on FR-4 was $(Ni, Cu)_{3}Sn_{4}$.

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Fabrication of Low Carbon Steel Coated with 18%Cr-2.5%Ni-Fe Powder by Laser Cladding and Its Application on Plastic Injection Mold for Aluminum Diecasting

  • Kim, Cheol-Woo;Yoo, Hyo-Sang;Cho, Kyun-Taek;Jeon, Jae-Yeol;Choi, Se-Weon;Kim, Young-Chan
    • 한국재료학회지
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    • 제31권11호
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    • pp.601-607
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    • 2021
  • Laser cladding a surface treatment process that grants superior characteristics such as toughness, hardness, and corrosion resistance to the surface, and rebuilds cracked molds; as such, it can be a strong tool to prolong service life of mold steel. Furthermore, compared with the other similar coating processes - thermal spray, etc., laser cladding provides superior bonding strength and precision coating on a local area. In this study, surface characteristics are studied after laser cladding of low carbon steel using 18%Cr-2.5%Ni-Fe powder (Rockit404), known for its high hardness and excellent corrosion resistance. A diode laser with wavelength of 900-1070 nm is adopted as laser source under argon atmosphere; electrical power for the laser cladding process is 5, 6, and 10 kW. Fundamental surface characteristics such as crossectional microstructure and hardness profile are observed and measured, and special evaluation, such as a soldering test with molten ALDC12 alloy, is conducted to investigate the corrosion resistance characteristics. As a result of the die-soldering test by immersion of low carbon alloy steel in ALDC12 molten metal, the clad layer's soldering thickness decreases.

알루미늄 주조용 SKD61 금형강의 표면처리 방법에 따른 특성 평가 (Characteristic Evaluation According to the Surface Treatment Method of SKD61 Mold Steel for Aluminum Casting)

  • 최세원;김철우;김용호;유효상
    • 열처리공학회지
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    • 제34권6호
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    • pp.281-286
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    • 2021
  • Arc ion plating (AIP), laser cladding, and nitriding are methods that can prevent mold damage or repair and create cracks and breakages on the die surface. The dissolution and soldering behavior of coated SKD61 by using arc ion plating, laser cladding, and nitriding was investigated. The structure of the coating was investigated as a function of deposition conditions by X-ray diffraction and the crystallographic orientation was determined using the texture factor. The TiAlN film deposited with AIP showed excellent corrosion resistance in the molten aluminum alloy at 680℃. In this paper, we have detailed the corrosion and mass loss phenomena associated with these steel-cast metal interactions.