Effect of Multiple Reflows on Mechanical and Electrical Properties of ENIG/Sn-3.5Ag/ENIG Ball Grid Array (BGA) Solder Joint (리플로우 횟수가 ENIG/Sn-3.5Ag/ENIG BGA 솔더 조인트의 기계적, 전기적 특성에 미치는 영향)
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- Journal of the Microelectronics and Packaging Society
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- v.16 no.1
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- pp.7-11
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- 2009