• Journal of the Korean Society for Precision Engineering
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• v.19 no.2
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• pp.114-125
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• 2002

As semi-solid forging (SSF) is compared with conventional easting such as gravity die-easting and squeeze casting, the product without inner defects can be obtained from semi-solid forming and globular microstructure as well. Generally speaking. SSF consists of reheating, forging, ejecting precesses. In the reheating process, the materials are heated up to the temperature between the solidus and liquidus line at which the materials exists in the form of liquid-solid mixture. The process variables such as reheating time, reheating temperature, reheating holding time, and induction heating power have much effect on the quality of the reheated billets. It is difficult to consider all the variables at the same time when predicting the quality. In this paper, Taguchi method, regression analysis and neural network were applied to analyze the relationship between processing conditions and solid fraction. A356 alloy was used for the present study, and the learning data were extracted by the reheating experiments. Results by neural network were on good agreement with those by experiment. Polynominal regression analysis was formulated by using the test data from neural network. Optimum processing condition was calculated to minimize the grain size, solid fraction standard deviation, otherwise, to maximize the specimen temperature average. In this time, discussion is liven about reheating process of row material and results are presented with regard to accurate process variables for proper solid fraction, specimen temperature and grain size.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.4
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• pp.7-21
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• 2000

This paper describes an overview of the thixoforming and thixomolding processes. Semi-solid metalworking (SSM), which is called the thixoforming process of aluminium materials, incorporates the elements of both casting and for the manufacture of near net shape parts. The SSM has some advantages such as net shape or near net shape manufacturing, the ability to form thin walls, excellent surface finish, tight tolerance, and excellent dimensional precision. The thixomolding process of Mg alloy (AZ9l) is a combination of two technologies both conventional die casting and plastic injection molding. The feed material used is a machined chip with a geometry of approximately 1 mm square and a length of 2~3 mm. The semi-solid forming (SSF) of high quality aluminium and magnesium parts will be established in the automotive and electronic industry, in the future. The hybrid method of casting/forging has been caused attention. This process uses a preformed material made by casting instead of the wrought material and finishes it by a single forging process. This process is expected to lower costs without sacrificing the mechanical and finishes it by a single forging process. The process is expected to lower costs without sacrificing the mechanical properties. The authors, intending that the casting/forging process contributes to a reduction in production cost of aluminum automotive parts in Korea, describes the feature of the casting/forging process, aluminum alloys suitable for the cast preform, microstructure and mechanical properties of the cast preform, application examples of cast/forging, and further study.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.47-52
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• 2013

Gold wire has long been used as a proven method of connecting a silicon die to a substrate in wide variety of package types, delivering high yield and productivity. However, with the high price of gold, the semiconductor packaging industry has been implementing an alternate wire material. These materials may include silver (Ag) or copper (Cu) alloys as an alternative to save material cost and maintain electrical performance. This paper will analyze and compare the electrical characteristics of several wire types. For the study, typical 0.6 mil, 0.8 mil and 1.0 mil diameter wires were selected from various alloy types (2N gold, Palladium (Pd) coated/doped copper, 88% and 96% silver) as well as respective pure metallic wires for comparison. Each wire model was validated by comparing it to electromagnetic simulation results and measurement data. Measurements from the implemented test boards were done using a vector network analyzer (VNA) and probe station setup. The test board layout consisted of three parts: 1. Analysis of the diameter, length and material characteristic of each wire; 2. Comparison between a microstrip line and the wire to microstrip line transition; and 3. Analysis of the wire's cross-talk. These areas will be discussed in detail along with all the extracted results from each type the wire.

• Journal of the Korean Society for Heat Treatment
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• v.13 no.6
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• pp.383-390
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• 2000

The static creep behaviour of AlSl 420F stainless steel was investigated over the temperature range of $540{\sim}585^{\circ}C$ and the stress range of $13{\sim}19kg/mm^2$ (127.4~186.2MPa). Constant stress creep tests were carried out in the experiment. Measured stress exponent, n, for the creep deformation of the alloy under the given conditions was found to vary at the range of 9.59, 9.15, 8.78, and 8.53 for the temperature of 540, 555, 570, and $585^{\circ}C$ respectively. The activation energy, Qc, for the creep deformation was 106.42, 102.58,97.81, and 94.58 kcal/mole for the stress of 13, 15, 17, and $19kg/mm^2$, respectively. Lason-Miller parameter, P, for the crept specimens for AlSl 420F stainless steel was measured as $P=T(log\;t_T+21)$. The empirical static creep rate obtained by the regression analysis was as follows. $${\varepsilon}={\exp}[(3.79{\times}10^{-2}{\sigma}+2.722)T-3.0747{\sigma}+28.109]{\times}{\sigma}^{(-2.367{\times}10^{-2}T+22.33)}{\exp}\left[-\frac{(-2.015{\sigma}+132.580){\times}10^3}{RT}\right]$$ The failure plane were observed, intergranular fracture was dominated by r (round) type crack over the experimental range.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.12
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• pp.1373-1377
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• 2014

Hot-stamping is a method of obtaining ultrahigh-strength steel by simultaneously forming and cooling boron steel in a press die after it has been heated at $900^{\circ}C$ or above. After heat treatment, boron steel has a strength of 1500 MPa or more. This material ensures a high level of quality because it overcomes the spring-back phenomenon, which is a problem associated with high-strength steel materials, and the degree of dimensional precision is improved by 90 or more because of the good formability compared with existing types of steel. In this study, the welding characteristics were identified through the butt and lap welding of hot-stamped steel using a disk laser. Full penetration was obtained at a faster speed with butt welding compared to lap welding, and a white band was observed in every specimen.

• Elastomers and Composites
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• v.47 no.3
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• pp.231-237
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• 2012

This study measured the mechanical and damping properties of EPDM compounds including fillers. Semi-reinforcing furnace black (SRF), high abrasion furnace black (HAF) and acetylene black were used as fillers. Dicumyl peroxide (DCP) were used as curing agents. The measurements were conducted using a moving die rheometer (MDR), durometer, universal testing machine (UTM), compression set and dynamic mechanical analysis (DMA). The tensile strength and elongation at break increased with increasing SRF contents in EPDM compounds. However, they decreased with increasing the amount of acetylene black. In the inspecting temperature range, EPDM compound filled acetylene black had stable storage modulus. Furthermore, the tan ${\delta}$ of the EPDM compounds obtained was enhanced by compounding with acetylene black.

• Advanced Composite Materials
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• v.17 no.1
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• pp.1-23
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• 2008

Robotized filament winding technology involves a robot that winds a roving impregnated by resin on a die along the directions of stresses to which the work-piece is submitted in applications. The robot moves a deposition head along a winding trajectory in order to deposit roving. The trajectory planning is a very critical aspect of robotized filament winding technology, since it is responsible for both the tension constancy and the winding time. The present work shows two original rules to plan the winding trajectory of structural parts, whose shape is obtained by sweeping a full section around a 3D curve that must be closed and not crossing in order to assure a continuous winding. The first rule plans the winding trajectory by approximating the part 3D shape with straight lines; it is called the discretized rule. The second rule defines the winding trajectory simply by offsetting a 3D curve that reproduces the part 3D shape, of a defined distance; it is called the offset rule. The two rules have been compared in terms of roving tension and winding time. The present work shows how the offset rule enables achievement of both the required aims: to manufacture parts of high structural performances by keeping the tension on the roving near to the nominal value and to markedly decrease the winding time. This is the first step towards the optimization of the robotized filament winding technology.

• Korean Journal of Materials Research
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• v.11 no.6
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• pp.441-447
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• 2001

A study on the TiN coating layer in small holes on the Purpose of die-casting dies application has been performed with a PACVD process. For the hole having diameter of 4 mm. the uniform TiN coating layer in the hole to the depth of 20 mm was achieved using DC pulsed power source. To understand the forming mechanism of TiN coating layer, plasma diagnosis on Ti, $N_{2}^{+}$ and A $r^{+}$ emissions was carried out during plasma coaling process by optical emirssion spectroscopy. When the duty ratio was equal or over 50%, the Peaks of Ti,$ N_{2}^{+}$ and A $r^{+}$ emission were obviously observed. While duty ratio was equal or under 28.6%, no peaks for Ti, $N_{2}^{+}$ and A $r^$ were observed and the formation of TiN coating layer was rarely observed. For the coating in 4 mm hole diameter, the coating layer with bipolar process was two times deeper than that with unipolar process.

• Korean Journal of Metals and Materials
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• v.50 no.10
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• pp.775-783
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• 2012

The effect of thermal annealing on the in-situ growth characteristics of intermetallics (IMCs) and the mechanical strength of Cu pillar/Sn-3.5Ag microbumps are systematically investigated. The $Cu_6Sn_5$ phase formed at the Cu/solder interface right after bonding and grew with increased annealing time, while the $Cu_3Sn$ phase formed at the $Cu/Cu_6Sn_5$ interface and grew with increased annealing time. IMC growth followed a linear relationship with the square root of the annealing time due to a diffusion-controlled mechanism. The shear strength measured by the die shear test monotonically increased with annealing time. It then changed the slope with further annealing, which correlated with the change in fracture modes from ductile to brittle at a critical transition time. This is ascribed not only to the increasing thickness of brittle IMCs but also to the decreasing thickness of the solder, as there exists a critical annealing time for a fracture mode transition in our thin solder-capped Cu pillar microbump structures.

• Design & Manufacturing
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• v.15 no.1
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• pp.57-65
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• 2021

Pump cap is a product that is widely used due to its ease of use and simple operation. These pump caps are applied to heterogeneous functional cosmetics and are being developed as dual pump caps. However, the conventional dual pump cap has a problem in that it is inconvenient to use and leakage occurs. In addition, it is formed of a plurality of materials, and there is a problem that is difficult to recycle. Lately, since the problem of environmental pollution is getting serious, the dual pump cap, which is difficult to recycle, cannot be used. Currently, eco-friendliness has been considered in Korea, and there are no dual pump cap containers with excellent sealing performance. Therefore, in this study, a dual pump cap container made of eco-friendly material was designed. In addition, finite element analysis was performed to verify the design feasibility of the product.