• Journal of the korean Society of Automotive Engineers
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• v.15 no.3
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• pp.96-110
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• 1993

A procedure has been developed so that a die-face for stamping automobile outer panels can be design and modelled efficiently. The procedure is composed of four parts each of which corresponds to modeling major components of a die-face, i.e. tipped product, blankholder, draw beads, and step draw. The modeling techniques developed specifically for die-face design enable a designer to generate the shape of a die-face quickly with the minimum input, and the resulting models can be used in FEM analysis and NC tool path generation. This will lead to the reductions in lead time and manhours required for the design and manufacture of the stamping dies.

• International Journal of Automotive Technology
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• v.7 no.7
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• pp.853-858
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• 2006

The method of die-face design based on the CAE platform for automobile panels can fast modify the die addendum. In contrast with the process of the die-face design based on the CAD platform, there are some special steps for the die-face design based on the CAE platform. The most obvious difference is that the auto-body part contour needs smoothing arlier than the design of addendum surfaces does. It is helpful to improve the design quality of addendum surface. In spite of extensive researches on the smoothing technique, here is still dearth of the published solutions about smoothing the part contour with additional surface. This paper attempts to analyze the difficulties and provides practical solutions. Main results include the algorithm to calculate the segments needing to be smoothed on boundary, the strategy to create the smoothing curve and the procedure of surface generation. The relevant function modules for parametric design are developed. A few examples and suggestions for future work conclude the paper.

• Journal of information and communication convergence engineering
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• v.13 no.3
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• pp.172-179
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• 2015

Face-to-face (F2F) bonding in three-dimensional integrated circuits (3D ICs), compared with other bonding styles, is closer to commercialization because of its benefits in terms of density, yield, and cost. However, despite the benefits that F2F bonding expect to provide, it's physical nature has not been studied thoroughly. In this study, we, for the first time, extract cross-die (inter-die) parasitic elements from F2F bonds on the full-chip scale and compare them with the intra-die elements. This allows us to demonstrate the significant impact of field sharing across dies in F2F bonding on full-chip noise and critical path delay values. The baseline method used is the die-by-die method, where the parasitic elements of individual dies are extracted separately and the cross-die parasitic elements are ignored. Compared with this inaccurate method, which was the only method available until now, our first-of-its-kind holistic method corrects the delay error by 25.48% and the noise error by 175%.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.1-7
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• 2021

In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (P_in) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P_1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.

• Journal of the Korean Society for Precision Engineering
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• v.10 no.3
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• pp.161-167
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• 1993

This paper deals with a new method for the machining of a die cavity defined by sculptured surfaces. In machining die cavities or pockets, process planners have been faced with some troulbes. One of the troubles ius to rebove a great deal of material within a given boundary while avoiding cutter interference. Cutter interference is a ciritical problem in NC machining of a die cavity. Even though this cavity machining has been implemented in many CAM systems, most of them can handle limited shapes of cavities or pockets. In this paper, a procedure has been developed to machine die cavity or pocket of a sculptured surface. The offset surfaces of the part surfaces and boundary surfaces are determined to calculate the intersection curves. These intersection curves form a FACE on the part surface, and the interference free tool pathe is generated by eliminating the points outside the FACE when computing the cutter contact (CC) data. Additionally, the cutter location (CL) data obtained from the CC data convert to an NC data. The NC data generated through this algorithm are verified on the CINCINNATI milling machine. A propotype die cavity machining system has been implemented in FORTRAN language and FIGARO graphics library on IRIS workstation.

• Journal for History of Mathematics
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• v.19 no.3
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• pp.43-56
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• 2006

This paper aims to introduce a construction method for the 'Wooden Die for Drinking Game' and to find some geometrical structures and mathematics educational viewpoints. As the results, we get two methods which are eventually same with Figure 5 and Figure 6-3. We proved the ground that classical probability of this Die's each side showing up is one out of fourteen and introduced few other empirical probabilities with Table 1 to Table 3. Also, some Chinese characters were corrected and re-interpreted. In fact, 象人打鼻 changed to 衆人打鼻, and 醜物 is interpreted as 'ugly animal' such as frog, toad, earthworm or pine caterpillar.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.5
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• pp.131-141
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• 2004

In this study a 3-D automatic die design supporting system for a bonnet panel has been developed using Pro/ROGRAM of the widespread CAD software Pro/ENGINEER A standard drawing die was defined in terms of the punch profile, the die face geometry, and the blank sheet size. The strip layout of a trimming die was defined, in addition, in terms of the trimming line and the locations of scrap cutters. Necessary relations for each design step are formulated and rules for bottom-up type 3-D die design were set up for the automatic design of drawing and trimming dies of a bonnet. With the input geometric data of punch profile, die face, and blank sheet, this 3-D design supporting system could complete the basic design process, in case of the bonnet drawing die, in a time 78% shorter than that required by a typical 2-D CAD system. The new design system showed remarkable design efficiency also when it was applied to the case of redesign and modification of the previous standard output for a different car type.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.6
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• pp.1389-1403
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• 1993

A procedure has be developed to optimize the product's tipping position in designing a die face for manufacturing automobile outer panels. Two design requirements are considered in optimizing the tipping position. One is to satisfy that all the points on the product should have a uniform distribution of drawing depths. The other is to guarantee that the user-specified area on the product should first contact with the binder wrap. The problem to satisfy the design requirements described above is analogous to the flatness calculation problem in the area of metrology if some constraints can be imposed. Thus the problem can be solved by the simulated annealing method, which is one of the optimization methods. The developed procedure was tested with the real die face design problem and the usefulness was verified by the diagram of the drawing depth.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.45-50
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• 2012

A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the center-bonded devices (DDR3, DDR4 and LPDDR3 ${\times}16$ die) and for the face up wirebonded ${\times}32$ LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.26-30
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• 1996

This paper presents the performance of CBN tools in the machining of hardened die-materials, SKD11 and SKD61 steel with HRC 50, by high-speed face milling. Generally, grinding or EDM is being used in machining of hardened materials but the cost is very high. If those can be replaced by cutting, it will be a greatly economical advantage. CBN tool has been recognized as an effective tool in turning, but it has not been in milling. So wear and surface roughness mode of CBN tool for hardened SKD11 and SKD61 steel were investigated by high-speed face milling in this study Also the relation between cutting force and wear mode of CBN tools was investigated.