• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2006년도 추계 학술대회논문집
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• pp.83-88
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• 2006

Natural convection flows in a cubical air-filled cavity that has one pair of opposing faces isothermal at different temperatures, $T_h\;and\;T_c$ respectively, the remaining four faces having a linear variation from $T_c\;to\;T_h$ are numerically simulated by a solution code(PowerCFD) using unstructured cell-centered method. An extension to a previously published work, special attention of this work is paid to three-dimensional flow and thermal characteristics in nature convection according to new orientation at Ra= $1{\times}105$. Comparisons of the average Nusselt number at the cold face are made with benchmark solutions and experimental results found in the literature. It is demonstrated that the average Nusselt number on the cold face has a maximum value around the diamond-type inclination angle of $43.2^{\circ}\;at\;Ra=1{\times}105$. We also report the effect of new orientation on the type of flow and temperature structure in a cubical-cavity.

• 설비공학논문집
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• 제18권9호
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• pp.722-728
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• 2006

Natural convection flows in a cubical air-filled slanted cavity that has one pair of opposing faces isothermal at different temperatures, $T_h\;and\;T_c$, respectively, the remaining four faces having a linear variation from $T_c\;toT_h$ are numerically simulated by a solution code (PowerCFD) using unstructured cell-centered method. Special attention is paid to three-dimensional flow and thermal characteristics according to a new orientation (diamond type) for the cubical-cavity benchmark problem in natural convection. Comparisons of the average Nusselt number at the cold face are made with experimental benchmark solutions found in the literature. It is found that the code is capable of producing accurately the nature of the laminar convection in a cubical air-filled slanted cavity with differentially heated walls.

• 한국표면공학회지
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• 제20권3호
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• pp.106-117
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• 1987

The microhardness and the structural characteristics of the chemically vapor deposited TiN film on the 430 stainless steel substrate have been investigated with various deposition parameters such as the deposition time, the total flow rate, the flow rate ratio $(H_2/N_2)$, and the deposition temperature. The most important factor to affect the microhardness of the TiN film in this study was the denseness of the structure in connection with the degree of the lattice strain. The relationship between the lattice parameter changes and the grain size variation under all deposition conditions generally followed the grain boundary relaxation model. The (111) preferred orientation prevailed in the early stage of the deposition conditions, however, the (200) preferred orientation was developed in the later stage. The surface morphology at optimum conditions displayed a dense diamond shaped structure and the microhardness of the films was high (1700-2400Hv) regardless of the type of the substrates used.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.543-546
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• 2005

We have investigated the alignment ability of multi-domains by using ion beam irradiation on diamond-like carbon (DLC) thin film layers. The DLC thin films were deposited by plasma enhanced chemical vapor deposition (PECVD) system and the low energy ion beam is irradiated from Kaufman type ion gun. The direction of liquid crystal alignment is varied by the direction of Ar ion beam irradiation.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1507-1510
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• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• 한국정밀공학회지
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• 제23권8호
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• pp.171-177
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• 2006

This study was performed as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-{\mu}m$-deep indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.51 GPa and 104 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$ ) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46- 0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined are a during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• 한국광물학회지
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• 제23권3호
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• pp.267-272
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• 2010

${\alpha}$-크리스토발라이트 구조의 $GaPO_4$에 대한 고압 x-선 회절 실험을 상온에서 8.9 GPa까지 시행하였다. 정방정계에 속하는 출발결정구조는 1 GPa 이하의 압력에서 회절피크가 분리되는 변화를 보이는데, 아마도 망상구조를 이루고 있는 사면체의 방향성이 압력에 의해 흐트러지면서 상-I'로 상변이가 유도된 것 같다. 압력을 증가시키면, 상-I'는 2 GPa와 3 GPa 사이에서 정방정계에 속하는 고압상(상-III)으로 상변이를 하고 있다. 이 결과는 최근 동일한 시료를 이용하여 얻은 고압실험결과(Ming et al., 2007)와 일치하지 않는다. 최고압력에 도달한 다음, 압력을 대기압으로 내리면 상-III이 그대로 유지되는 것으로 나타났다.