• Journal of the Optical Society of Korea
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• 제17권1호
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• pp.50-56
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• 2013

Optical-fiber electronic speckle pattern interferometry (ESPI) is a non-contact, non-destructive examination technique with the advantages of rapid measurement, high accuracy, and full-field measurement. The optical-fiber ESPI system used in this study was compact and portable with the advantages of easy set-up and signal acquisition. By suitably configuring the optical-fiber ESPI system, producing an image signal in a charge-coupled device camera, and periodically modulating beam phases, we obtained phase information from the speckle pattern using a four-step phase shifting algorithm. Moreover, we compared the actual defect size with that of interference fringes which appeared on a screen after calculating the pixel value according to the distance between the object and the CCD camera. Conventional methods of measuring defects are time-consuming and resource-intensive because the estimated values are relative. However, our simple method could quantitatively estimate the defect length by carrying out numerical analysis for obtaining values on the X-axis in a line profile. The results showed reliable values for average error rates and a decrease in the error rate with increasing defect length or pressure.

• 한국기계가공학회지
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• 제19권11호
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• pp.64-69
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• 2020

To determine the effective factors for microparticle blasting with precise sequence position control in the x-axis and y-axis directions, we conducted a statistical experimental analysis of blasted square shapes by considering five condition factors. The control input and output were operated simultaneously by rotation-linear motion conversion and fine particles were blasted onto the aluminum specimen by precise position control driving using multiple execution codes. The micro-driving device used for processing was capable of microparticle blasting and of controlling the system through contact with a limit sensor at high speed and a two-degree-of-freedom driving mechanism. Our experiments were conducted on 1,050 specimens of pure aluminum (containing <1% of other elements). The effects of several factors (e.g., particle and nozzle diameters, blasting pressure, and federate and blasting cycle numbers) on the surface roughness and blasted surface's depth were verified through a statistical experimental analysis by applying the dispersion analysis method. This statistical analysis revealed that the nozzle diameter, the blasting pressure, and the blasting cycle number were the dominant factors.

• 마이크로전자및패키징학회지
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• 제29권1호
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• Membrane and Water Treatment
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• 제13권5호
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• pp.219-225
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• 2022

5th Assessment Report of the Intergovernmental Panel on Climate Change Weather (AR5) predicts that recent severe hydrological events will affect the quality of water and increase water pollution. To analyze changes in water quality due to future climate change, input data (precipitation, average temperature, relative humidity, average wind speed, and solar radiation) were compiled into a representative concentration curve (RC), defined using 8.5. AR5 and future use are calculated based on land use. Semi-distributed emission model Calculate emissions for each target period. Meteorological factors affecting water quality (precipitation, temperature, and flow) were input into a multiple linear regression (MLR) model and an artificial neural network (ANN) to analyze the data. Extensive experimental studies of flow properties have been carried out. In addition, an Acoustic Doppler Velocity (ADV) device was used to monitor the flow of a large open channel connection in a wastewater treatment plant in Ho Chi Minh City. Observations were made along different streams at different locations and at different depths. Analysis of measurement data shows average speed profile, aspect ratio, vertical position Measure, and ratio the vertical to bottom distance for maximum speed and water depth. This result indicates that the transport effect of the compound was considered when preparing the hazard analysis.

• 한국기계가공학회지
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• 제21권8호
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• pp.53-59
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• 2022

In this study, an experimental device was fabricated to evaluate the hovering flight performance of a single rotor on a hexacopter used for river surveillance, and a thrust performance test was conducted. In addition, the 3D profile of the propeller was extracted by 3D scanning and CFD analysis was performed using ANSYS CFD 14.5 based on the extracted 3D model of the propeller. The aerodynamic characteristics were compared with the results of the performance tests and CFD analysis, and the vortex structure corresponding to each motor rotational speed in revolutions per minute (rpm) was identified. In the future, we plan to provide valuable data for multicopter propeller design and performance verification.

• Applied Microscopy
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• 제50권
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• pp.17.1-17.9
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• 2020

Recent advances in fabrication have enabled radial-junction architectures for cost-effective and high-performance optoelectronic devices. Unlike a planar PN junction, a radial-junction geometry maximizes the optical interaction in the three-dimensional (3D) structures, while effectively extracting the generated carriers via the conformal PN junction. In this paper, we report characterizations of radial PN junctions that consist of p-type Si micropillars created by deep reactive-ion etching (DRIE) and an n-type layer formed by phosphorus gas diffusion. We use electron-beam induced current (EBIC) microscopy to access the 3D junction profile from the sidewall of the pillars. Our EBIC images reveal uniform PN junctions conformally constructed on the 3D pillar array. Based on Monte-Carlo simulations and EBIC modeling, we estimate local carrier separation/collection efficiency that reflects the quality of the PN junction. We find the EBIC efficiency of the pillar array increases with the incident electron beam energy, consistent with the EBIC behaviors observed in a high-quality planar PN junction. The magnitude of the EBIC efficiency of our pillar array is about 70% at 10 kV, slightly lower than that of the planar device (≈ 81%). We suggest that this reduction could be attributed to the unpassivated pillar surface and the unintended recombination centers in the pillar cores introduced during the DRIE processes. Our results support that the depth-dependent EBIC approach is ideally suitable for evaluating PN junctions formed on micro/nanostructured semiconductors with various geometry.

• International Journal of Korean Welding Society
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• 제2권1호
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• pp.45-51
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• 2002

In the multi-pass welding of pressure vessels or ships, the mechanical touch sensor system is generally used together with a manipulator to measure the gap and depth of the narrow gap to perform seam tracking. Unfortunately, such mechanical touch sensors may commit measuring errors caused by the deterioration of the measuring device. An automation system of narrow gap multi-pass welding using a laser vision system which can track the seam line of narrow gap and which can control welding power has been developed. The joint profile of the narrow gap, with 250mm depth and 28mm width, can be captured by laser vision camera. The image is then processed for defining tracking positions of the torch during welding. Then, the real-time correction of lateral and vertical position of the torch can be done by the laser vision system. The adaptive control of welding conditions like welding currents and welding speeds, can also be performed by the laser vision system, which cannot be done by conventional mechanical touch systems. The developed automation system will be adopted to reduce the idle time of welders, which happens frequently in conventional long welding processes, and to improve the reliability of the weld quality as well.

• 한국인터넷방송통신학회논문지
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• 제24권2호
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• pp.155-160
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• 2024

편광 선택적 빔 분리 격자는 수많은 광학 정보처리 시스템에서 널리 사용되고 있다. 본 논문에서는 고효율 플라즈마 편광 빔 분리기 (PBS)를 설계하기 위하여 Littrow 구조에서 Ag 금속 층으로 구성된 소자를 구현하였다. 구현한 PBS는 투과되는 0차 TE 편광과 반사되는 0차 TM 편광에서 높은 회절효율을 달성할 수 있도록 격자깊이 및 격자 비율을 정확한 모드 전송선로 이론 (Modal Transmission-Line Theory)을 사용하여 최적화하였다. 최적화된 결과로부터 PBS는 입사 파장과 각도에 대한 광대역 특성의 장점을 가지고 있으며, TE, TM 편광 모두에 대하여 95% 보다 높은 효율을 나타내었다. 그러므로, 높은 흡광비를 갖는 이 고효율 PBS 광대역 격자는 우수한 광 회절 장치로 사용될 수 있다.

• Radiation Oncology Journal
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• 제5권1호
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• pp.49-58
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• 1987

환부에 열을 가하여 종양을 치료할 수 있는 온열요법의 생물학적 효과는 상당히 고무적이며 새로운 암 치료 수단으로 등장되었다. 그러나 체내 깊숙히 위치하고 있는 종양에 일정한 열을 계속 부여하면서 온도와 열의 분포를 정확히 측정하기가 어려웠다. 연세 암센터는 연세대학교 공과대학과 녹십자 의료 공업주식회사와 산학협동으로 라디오파 유전가열형 온열장치(가칭 Greenytherm-GY8)를 개발 제작하고 임상응용을 위해 기초 연구를 실시하였다. 개발된 온열장치는 $8{\sim}10MHz$ 라디오파 발생기와 유전가열 전극, 온도계측용 열정대, 냉각장치 및 제어용 개인 컴퓨터로 구성되었다. 온열장치의 성능을 시험하기 위하여 인체크기의 한천팬텀과 동물 및 인체의 악성종양에 대한 치료온도와 온열분포를 측정하였다. 라디오파 발생전력을 $200{\sim}1,500W$까지 조절할 수 있으며 유전가열을 위한 라디오파의 주파수는 $8{\sim}10MHz$ 범위를 얻을 수 있었다. 피부에 근접된 종양의 가열온도는 $200{\sim}500W$의 RF 전력으로 10분이 내 치료가능온도$(42.5^{\circ}C)$ 이상으로 가열할 수 있었으며 정상조직 쪽의 전극은 $5{\sim}10^{\circ}C$로 냉각시키므로서 피부손상을 방지할 수 있었다. $5{\sim}10cm$ 깊이에 존재하는 종양의 가열온도는 치료 가능한 $40{\sim}43^{\circ}C$까지 가열이 가능하였으며 냉각보러스와 정합회로에 의해 피부의 자극을 줄일 수 있었다. 이상과 같은 실험결과로 유전가열형 온열장치는 임상응용에 적합하다고 판단되며 임상경험을 통하여 더 예민한 정합장치와 전기적 자극을 완전히 줄일 수 있는 방법 및 편리한 전극 등의 개발이 가능한 기본자료가 될 수 있다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.220-220
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• 2013

Surface-normal transmission electro-absorption modulator (EAM) are attractive for high-definition (HD) three-dimensional (3D) imaging application due to its features such as small system volume and simple epitaxial structure [1,2]. However, EAM in order to be used for HD 3D imaging system requires uniform modulation performance over large area. To achieve highly uniform modulation performance of EAM at the operating wavelength of 850 nm, it is extremely important to remove the GaAs substrate over large area since GaAs material has high absorption coefficient below 870 nm which corresponds to band-edge energy of GaAs (1.424 eV). In this study, we propose and experimentally demonstrate a transmission EAM in which highly selective backside etching methods which include lapping, dry etching and wet etching is carried out to remove the GaAs substrate for achieving highly uniform modulation performance. First, lapping process on GaAs substrate was carried out for different lapping speeds (5 rpm, 7 rpm, 10 rpm) and the thickness was measured over different areas of surface. For a lapping speed of 5 rpm, a highly uniform surface over a large area ($2{\times}1\;mm^2$) was obtained. Second, optimization of inductive coupled plasma-reactive ion etching (ICP-RIE) was carried out to achieve anisotropy and high etch rate. The dry etching carried out using a gas mixture of SiCl4 and Ar, each having a flow rate of 10 sccm and 40 sccm, respectively with an RF power of 50 W, ICP power of 400 W and chamber pressure of 2 mTorr was the optimum etching condition. Last, the rest of GaAs substrate was successfully removed by highly selective backside wet etching with pH adjusted solution of citric acid and hydrogen peroxide. Citric acid/hydrogen peroxide etching solution having a volume ratio of 5:1 was the best etching condition which provides not only high selectivity of 235:1 between GaAs and AlAs but also good etching profile [3]. The fabricated transmission EAM array have an amplitude modulation of more than 50% at the bias voltage of -9 V and maintains high uniformity of >90% over large area ($2{\times}1\;mm^2$). These results show that the fabricated transmission EAM with substrate removed is an excellent candidate to be used as an optical shutter for HD 3D imaging application.