• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.415-418
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• 2005

In recent years, Magnesium (Mg) and its alloys have become a center of special interest in the automotive industry. Due to their high specific mechanical properties, they offer a significant weight saving potential in modem vehicle constructions. Most Mg alloys show very good machinability and processability, and even the most complicated die casting parts can be easily produced. The die casting process is a fast production method capable of a high degree of automation for which certain Mg alloys are ideally suited. Although Mg alloys are fulfilling the demands for low specific weight materials with excellent machining and casting abilities, they are still not used in die casting process to the same extent as the competing material aluminium. One of the reasons is that effects of various forming variables for die casting process is not closely examined from the viewpoint of die design. In this study, step die and flowability tests for AM60 were performed by die casting process according to various combination of casting pressure and plunger velocity. Microstructure and Victors hardness tests were examined and performed for each specimen to verify effects of forming conditions.

• Polymer(Korea)
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• v.30 no.6
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• pp.532-537
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• 2006

In order to successfully meet the environmental and recycling problems, natural polymer and their derivatives are recognized as a promising biodegradable material. In this study, the biodegradable composites of cellulose diacetate and starch were prepared, and their physical and thermal properties were investigated. For the melting processing, triacetine was added as a plasticizer into the composites. The processability of cellulose diacetate was further enhanced by increasing the amount of starch in the composites. The tensile stress and Young's modulus were decreased and elongation was increased with increasing the amount of starch in them. A $T_g$ value was decreased with increasing the amount of starch in the composites. Also, the morphology of the composites were observed with the SEM.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.5
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• pp.454-462
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• 2023

Flash lamp annealing (FLA) of metal nanoparticle (NP) ink has provided powerful strategies to fabricate high-performance electrodes on a flexible substrate because of its rapid processing capability (in milliseconds), low-temperature process, and compatibility with to roll-to-roll process. However, metal NPs [e.g., gold (Au), silver (Ag), copper (Cu), etc.] have limitations such as difficulty in synthesizing fine metal NPs (diameter less than 10 nm), high price, and degradation during ink storage and FLA processing. In this regard, organometallic ink has been proposed as a material that can replace metal NPs due to their low-cost (usually 1/100 times cheaper than metal nano inks), low-temperature processability, and high material stability. Despite these advantages, the fabrication of flexible electrodes through FLA treatment of organometallic compounds has not been extensively researched. In this paper, we experimentally guide how to determine the optimal conditions for forming electrodes on flexible substrates by considering material parameters, and flashlight processing parameters (energy density, pulse duration, etc) to minimize the difficulties that may arise during the FLA of organometallic ink.

• Journal of the Korean institute of surface engineering
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• v.55 no.6
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• pp.448-459
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• 2022

Generally, steel is the most commonly used in the industry because of good strength, processability and cost-effectiveness. Steel can be surface-treated such as coating or used as an alloy by adding elements such as Cr, Ni, Zr, and Al to increase corrosion resistance. However, even if steel is used in same environment corrosion resistance is sharply lowered when it is exposed to a high temperature for a fixed or extended period of time due to an overload or other factors. In particular, the use of hot-dip aluminized plated steel, which is used in high-temperature atmospheres, is increasing due to the surface Al₂O₃ oxide film. This steel necessitates an urgent solution as issues of corrosion resistance limitations often appear. It is an important issue that not only cause analysis but also the research for the surface treatment method that can be solved. Thus, in this study, Cr in which it is expected to be effective in corrosion resistance and heat resistance attempted to deposit on hot dip aluminized plated steel with PVD sputtering. And it was possible to present the surface treatment application of various types of industrial equipment exposed to high temperature and basic design guidelines for use by confirming the corrosion resistance of hot dip Al-Si plated steel with Cr film deposited at high temperature.

• Journal of the Korean Institute of Gas
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• v.25 no.2
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• pp.64-71
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• 2021

Research on polymer matrix composites with excellent molding processability and mechanical properties in the automotive field including hydrogen fuel cell electric vehicles is expanding to Computer-Aided Engineering (CAE) to support the design of materials with specific mechanical properties. CAE automation requires the prediction of the mechanical properties and behavior of materials. Unlike single materials, the mechanical properties prediction of polymer matrix composites is difficult to explain with formulas because the mechanical behavior is complicated to be explained only by the relationship between the matrix and the filler. In this study, the stress-strain curve according to the composition of polymer matrix composites, which was difficult to predict due to its sensitivity to large plastic deformation and composition, was predicted based on machine learning of the test data. The developed model finds a complex correlation between matrix and filler types and compositions, and predicts the total stress-strain curve meaningfully even in the absence of learned test data. It is expected that the material design AI system can be completed in the future based on the developed model that predicts the mechanical properties of polymer matrix composites even for the combination and composition that have not been learned.

• Macromolecular Research
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• v.11 no.4
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• pp.207-223
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• 2003

For last five years, we are developing the novel local drug delivery devices using biodegradable polymers, especially polylactide (PLA) and poly(D,L-lactide-co-glycolide) (PLGA) due to its relatively good biocompatibility, easily controlled biodegradability, good processability and only FDA approved synthetic degradable polymers. The relationship between various kinds of drug [water soluble small molecule drugs: gentamicin sulfate (GS), fentanyl citrate (FC), BCNU, azidothymidine (AZT), pamidronate (ADP), $1,25(OH)_2$ vitamin $D_3$, water insoluble small molecule drugs: fentanyl, ipriflavone (IP) and nifedipine, and water soluble large peptide molecule drug: nerve growth factor (NGF), and Japanese encephalitis virus (JEV)], different types of geometrical devices [microspheres (MSs), microcapsule, nanoparticle, wafers, pellet, beads, multiple-layered beads, implants, fiber, scaffolds, and films], and pharmacological activity are proposed and discussed for the application of pharmaceutics and tissue engineering. Also, local drug delivery devices proposed in this work are introduced in view of preparation method, drug release behavior, biocompatibility, pharmacological effect, and animal studies. In conclusion, we can control the drug release profiles varying with the preparation, formulation and geometrical parameters. Moreover, any types of drug were successfully applicable to achieve linear sustained release from short period ($1{\sim}3$ days) to long period (over 2 months). It is very important to design a suitable formulation for the wanting period of bioactive molecules loaded in biodegradable polymers for the local delivery of drug. The drug release is affected by many factors such as hydrophilicity of drug, electric charge of drug, drug loading amount, polymer molecular weight, the monomer composition, the size of implants, the applied fabrication techniques, and so on. It is well known that the commercialization of new drug needs a lot of cost of money (average: over 10 million US dollar per one drug) and time (average: above 9 years) whereas the development of DDS and high effective generic drug might be need relatively low investment with a short time period. Also, one core technology of DDS can be applicable to many drugs for the market needs. From these reasons, the DDS research on potent generic drugs might be suitable for less risk and high return.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.