• Journal of Broadcast Engineering
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• v.16 no.5
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• pp.883-893
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• 2011

In this paper, we propose a novel focus measure that determines in-focus and out-of-focus region in an image. In addition, we achieved extended depth of field by blending the acquired image and Wiener filtered image using a decision map based on the designed focus measure. Since conventional focus measures are based on the amount of high frequency components in an acquired image, the measures may not be accurate if there exist high frequency components in out-of-focused region. To overcome the problem, we designed the novel focus measure based on effective band pass filtering. In simulations and experiments, the proposed method showed better performance than existing methods.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.224-226
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• 2004

CMP process requirements become tighter especially in sub-100nm technology. Especially, high planarity and low defectivity appear as leading issues in CMP technology. Also, the introduction of new materials and advanced lithography technique increases CMP applications. Here are listed some major issues and challenges in CMP technology, which can be categorized following four items. These have practical significance and should be considered more concretely for future generation.