• 한국정보전자통신기술학회논문지
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• 제14권2호
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• pp.122-127
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• 2021

본 논문은 ITO 유리를 기판으로 사용하여 CdS 박막을 제작하였다. MDS (Multiplex Deposition Sputter System)을 이용하여 RF power와 증착시간을 변화시키면서 소자를 제작하였다. 제작된 시편은 광학적 특성에 대해 분석을 하였다. 본 논문의 목적은 태양전지의 광흡수층에 적용될 수 있는 제작조건을 찾는 것이다. RF power가 50W이고 증착 시간이 10분 일 때, 두께는 64Å로 측정되었다. 100W일?, 두께는 406Å로 측정되었고, 150W일 때는 두꼐는 889Å로 측정되었다. 박막은 RF power가 증가할수록 두께가 증가되는 것을 확인하였다. 광투과율 측정한 결과, 550~850nm는 RF power가 50W, 100W, 150W일 때 모두 투과율이 대략 70% 이상으로 관찰되었다. RF power가 증가되면 두께가 증가되고 입자 크기가 커지므로 박막의 밀도가 증가되어 광투과율이 감소되었다. RF power를 100W로 하고 증착시간을 15분 일 때, 밴드갭은 3.998eV로 계산되었다. 증착시간을 20분일 때, 3.987eV이고 150W는 15분에서는 3.965eV이며 20분에서는 3.831eV이다. RF power가 증가하면 밴드갭이 증가하는 것으로 측정되었다. XRD 분석에서 RF power와 증착시간의 변화에 관계없이 2Θ=26.44에서의 회절 피크를 관찰할 수가 있었다. 반치폭은 증착시간이 증가하면 감소되는 것을 알 수가 있었다. 그리고 RF power를 일정하게 하고 증착시간을 증가하면 입자크기는 증가되는 것으로 측정되었다.

• 한국기계가공학회지
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• 제10권5호
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• pp.44-50
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• 2011

The effect of deposition time in arc ion plating on surface properties of the TiN-coated SM45C steel is presented in this paper. The surface roughness, micro-particle, micro-hardness, coated thickness, atomic distribution of TiN, and adhesion strength are measured for various deposition times. It has been shown that the deposition time has a considerable effect on the micro-hardness, the coated thickness, and the atomic distribution of TiN of the SM45C steels but that it has little influence on the surface roughness and adhesion strength.

• Journal of Mechanical Science and Technology
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• 제20권10호
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• pp.1646-1652
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• 2006

A model of mechanical behavior of microcantilever due to intrinsic strain during deposition of MEMS structures is derived. A linear ordinary differential equation is derived for the beam deflection as a function of the thickness of the deposited layer. Closed-form solutions are not possible, but numerical solutions are plotted for various dimensionless ratios of the beam stiffness, the intrinsic strain, and the elastic moduli of the substrate and deposited layer. This model predicts the deflection of the cantilever as a function of the deposited layer thickness and the residual stress distribution during deposition. The usefulness of these equations is that they are indicative of the real time behavior of the structures, i.e. it predicts the deflection of the beam continuously during deposition process.

• Applied Microscopy
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• 제45권3호
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• pp.119-125
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• 2015

Two-dimensional (2D) transition metal dichalcogenides (TMDCs) have attracted significant attention due to their unique and exotic properties attributed to their low dimensionality. In particular, semiconducting 2D TMDCs such as $MoS_2$, $WS_2$, $MoSe_2$, and $WSe_2$ have been demonstrated to be feasible for various advanced electronic and optical applications. In these regards, process to synthesize high quality 2D TMDCs layers with high reliability, wafer-scale uniformity, controllable layer number and excellent electronic properties is essential in order to use 2D TMDCs in practical applications. Vapor deposition techniques, such as physical vapor deposition, chemical vapor deposition and atomic layer deposition, could be promising processes to produce high quality 2D TMDCs due to high purity, thickness controllability and thickness uniformity. In this article, we briefly review recent research trend on vapor deposition techniques to synthesize 2D TMDCs.

• E2M - 전기 전자와 첨단 소재
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• 제7권6호
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• pp.511-519
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• 1994

The effect of the deposition conditions, such as the base pressure, working pressure, sputtering power, pre-sputtering, and deposition thickness in facing targets sputtering system(FTS), on the oxidation of the TbFeCo thin films was studied by investigating the magneto-optical properties as well as oxygen analysis by the AES depth profiles. The results showed that the base pressure did not affect the magnetic properties so much, probably due to the short flight distance of the sputtered particles. At the higher sputtering power and lower working pressure with pre-sputtering the oxidation of TbFeCo thin films was decreased. As the film thickness increased the TbFeCo thin films showed the perpendicular anisotropy from in-plane anisotropy overcoming the oxidation effect at the beginning of the sputtering.

• 한국정밀공학회지
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• 제26권10호
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• pp.74-80
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• 2009

This paper presents a study on fluid flow analysis of organic semiconductor thin film deposition process using the computational numerical method. In the production process, the thickness of deposited organic thin film depends on distribution of nozzle size in the linear cell system, so we analyze to decide the optimal nozzle system for uniform thickness of organic thin film. The results of deposited thickness of thin film by numerical analysis are in good agreement with those of the experimental measurements.

• 열처리공학회지
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• 제5권1호
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• pp.1-12
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• 1992

In order to improve adhesive force of TiN film, we sputtered titanium as interlayer before TiN deposition by Plasma Enhanced Chemical Vapour Deposition. We observed changes of hardness and adhesion at a various thickness of titanium interlayer and also examined analysis. At the critical thickness of the titanium interlayer(about $0.2{\mu}$), adhesive force of TiN films were promoted mostly. But over the critical thickness, a marked reduction of adhesive force was showed, because of the internal stress of titanium interlayer. From AES analysis, the adhesion improvement of TiN films was mainly caused by nitrogen diffusion into titanium interlayer during TiN deposition process which relieved stress concentration at TiN coating-substrate interface.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 춘계학술대회 논문집
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• pp.103-107
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• 1994

An experimental study was carried out to investigate the fabrication process and electrical breakdown of electrodeposted polyimide film from nonaqueous emulsion onto metal electrode surface. The thickness of imide film control led by the deposition voltage and time are proportional to the voltage or time. From the results, yeilds is proportional to the total elctrical charge flow through the electrode. When electrophoretic deposition voltage is 30 [V] deposition time is 30 sec, 40 sec, 50 sec, then the thickness of the films are 2.13 $\mu\textrm{m}$, 2.69 $\mu\textrm{m}$, 3.16 $\mu\textrm{m}$, 3.94 $\mu\textrm{m}$, respectively Electrical breakdown voltage of polyimide thin film shows very high. As film thicknes increase, the breakdown voltage are increased, but are net directly proprotional to thickness of the film.

• Progress in Superconductivity
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• 제5권1호
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• pp.75-79
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• 2003

YBCO films were deposited with various thicknesses from 100nm to 1.6$\mu\textrm{m}$ on single crystal $SrTiO_3$ substrates by pulsed laser deposition (PLD). The effects of different deposition conditions, especially different deposition rates by means of changing the pulsed laser frequency up to 200Hz, on the J$_{c}$ value were studied. For YBCO film with the thickness of 200nm, the $J_{c}$ value of $2.1MA/\textrm{cm}^2$ has been achieved under the high deposition rate of 3.2nm/s (190nm/min). The $J_{c}$ can be maintained greater than $1M/\textrm{cm}^2$ with the thickness less than 1$\mu\textrm{m}$. The X-ray analysis was used to examine the texture, crystallization and surface quality. The SEM was employed to analyze the surface of YBCO, and it was shown the surface of YBCO film became rougher with increasing the thickness. There were many large singular outgrowths and networks of outgrowths on the surface of YBCO films which lowered the density of thick YBCO film. The outgrowth network was probably the a-axis YBCO corresponding to XRD $\theta$-2$\theta$scan and $\chi$-scan which were used to characterize a-axis orientation of YBCO film. The reason for J$_{c}$ declining with increasing the thickness was studied and discussed.sed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.186-187
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• 2009

The $Sr_{0.7}Bi_{2.3}Nb_2O_9$(SBN) thin films are deposited on Pt-coated electrode(Pt/Ti/$SiO_2$/Si) using RF sputtering method at various deposition conditions. Thickness of SBN thin films was about 250[nm] in 70/30 of $Ar/O_2$ ratio. The thickness and deposition rate of SBN thin films were increased with increase of RF power. The capacitance of SBN thin films were increased with the increase of deposition temperature.