• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.257-258
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• 2006

ZnO thin films were prepared by RF magnetron sputter deposition on p-Si(100) wafer with various cooling rates of substrate temperature such as the substrates were pre-heated to $400^{\circ}C$ before the deposition and then cooled down naturally or slowly to $300^{\circ}C$, $200^{\circ}C$, $100^{\circ}C$, and R.T., by the temperature controller during the deposition. The crystall me and micro-structural characteristics of the films were investigated by XRD and SEM ZnO films which cooled down naturally or slowly by temperature controller during deposition, especially the film were deposited with cooling down from $400^{\circ}C$ to $200^{\circ}C$ slowly, showed the most outstanding c-axis preferred orientation.

• Korean Journal of Materials Research
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• v.5 no.2
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• pp.197-202
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• 1995

The surface morphology and grain growth of amophous silicon (a-Si) films deposited by low pressure chemical vapor deposition (LPCVD) have been investigated as a function of deposition and in sltu annealing condition. The film deposited at the amorphous to polycrystalline transition temperature has an extra-rough, rugged surface with (311) t.exture. At the same deposition temperature, the grain structure tends to shirr. from the polycrystalline to the amorphous phase with increasing the film thickness. It is found that nucleation of a-Si during in situ annealing at the transition temperature without breaking the vacuum starts to occur from surface Si atom migration in contrast to a heterogeneous nucleation during film deposition.

• Electrical & Electronic Materials
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• v.10 no.3
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• pp.217-225
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• 1997

In this study, the PVDF organic thin film was fabricated by the physical vapor deposition method to be dry-process. The distance of heat source and substrate was 5[cm] and the temperature of substrate was 30[.deg. C], when the pressure had reached 2.0 x 10$^{-5}$ [Torr], the temperature of heat source was reached to 285[.deg. C] to heat at 6-8[.deg. C/min] rate, the shutter was opened and deposition was started. TG-DTA(Thermogravimetric-Differential Thermal Analysis) spectrum of PVDF pellets showed that endothermic peak arose at 170[.deg. C] and exothermic peak at 524[.deg. C], but that of thin PVDF film showed that endothermic peak arose at 145[.deg. C] and exothermic peak at 443[.deg C]. The current density was increased linearly with increasing voltage but increased nonlinearly with higher electric field than 250[kV/cm] and activation energy was about 0.667[eV] at the temperature of 30-90[.deg. C].

• Journal of the Korean Ceramic Society
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• v.35 no.7
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• pp.733-739
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• 1998

C-axis oriented zinc oxide thin films were deposited on Cornign 1737 glass substrate by an rf magnetron sputtering technique. The effects of deposition parameters and post heat-treatment on the crystallinity and electical properties of ZnO films were investigaed. As-deposited ZnO films showed the strong c-axis growth and excellent crystallinity under the deposition conditions as follows: substrate temperature 350$^{\circ}C$ ; growth and excellent crystallinity under the deposition conditions as follows ; substrate temperature 350$^{\circ}C$ rf power 75W ; gas pressure 6m Torr; percentage of oxygen 50% The higher heat-treating temperatue was the stronger c-axis growth and the better crystallinity of the deposited ZnO films were. The resistivity of ZnO films was significantly affected by deposition parameters and post heat-treatment. With increasing increased. After post heat-treating at 400$^{\circ}C$ in air the resistivity of ZnO films increased but post heat-treat-ing temperature 500$^{\circ}C$ rather diminished the film resistivity.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.5
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• pp.1624-1638
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• 1996

A study of thermophoretic particle deposition has been carried out for a particle laden stagnation flow considering the effect of radiative heat transfer. Energy, concentration and radiative transfer equations are all coupled and have been solved iteratively assuming that absorption and scattering coefficients were proportional to the local concentration of particles. Radiative heat transfer was shown to strongly affect the profiles of temperature and particle concentration. e. g., radiation increases the thickness of thermal boundary layer and wall temperature gradients significantly. As the wall temperature gradients increase, the particle concentration at the wall decreases due to thermophoretic particle transport. The deposition rate that is thermophoretic velocity times particle concentration at the wall decreases as the effects of radiation increases. The effects of optical thickness, conduction to radiation parameter and wall emissivity have been determined. The effects of anisotropic scattering are shown as insignificant.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.4
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• pp.135-140
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• 2005

Thermal-fluid analysis was performed to understand the thermal behavior in the horizontal CVD reactor thereby to design a susceptor which has a uniform deposition rate during silicon EPI growing. Four different types of susceptor designs, standard (no hole susceptor), hole $\sharp$1 (240 mm), hole $\sharp$2 (150 mm) and hole $\sharp$3 (60 mm), were simulated by CFD (Computational Fluid Dynamics) tool. Temperature, gas flow, deposition rate and growth rate were calculated and analyzed. The degree of flatness of EPI wafer loaded on the susceptor was computed in terms of silicon growth rate. The simulation results show that the temperature and thermal distribution in the wafer are greatly dependent on inner diameter of hole susceptor and demonstrate that the introduction of hole in the susceptor can degrade wafer flatness. Maximum temperature difference appeared around holes. As the diameter of the hole decreases, flatness of the wafer becomes poor. Among the threes types of susceptors with the hole, optimal design which resulted a good uniform flatness ($5\%$) was obtained when using hole $\sharp$1.

• Journal of the Korean Ceramic Society
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• v.45 no.12
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• pp.796-801
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• 2008

$LaGaO_3$ thin film was prepared on Ni-Fe metal porous substrate by Pulsed Laser Deposition method. By the thermal reduction, the dense $NiO-{Fe_3}{O_4}$ substrate is changed to a porous Ni-Fe metal substrate. The volumetric shrinkage and porosity of the substrate are controlled by the reduction temperature. It was found that a thermal expansion property of the Ni-Fe porous metal substrate is almost the same with that of $LaGaO_3$ based oxide. $LaGaO_3$ based electrolyte films are prepared by the pulsed laser deposition (PLD) method. The film composition is sensitively affected by the deposition temperature. The obtained film is amorphous state after deposition. After post annealing at 1073K in air, the single phase of $LaGaO_3$ perovskite was obtained. Since the thermal expansion coefficient of the film is almost the same with that of LSGM film, the obtained metal support LSGM film cell shows the high tolerance against a thermal shock and after 6 min startup from room temperature, the cell shows the almost theoretical open circuit potential.

• Korean Journal of Materials Research
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• v.14 no.6
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• pp.443-450
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• 2004

Parylene polymer thin film shows excellent homogeneous coverage chracteristics when it was deposited onto very complex three dimensional solid matters, such as deep hole and micro crack. The parylene deposition process can be conducted at room temperature although most of chemical vapor deposition processes request relatively high processing temperature. Therefore, the parylene coating process does not induce any thermal problems. Parylene thin film is transparent and has extremly high chemical stability. For example, it shows high chemical stability with high reactive chemical solutions such as strong acid, strong alkali and acetone. The bio-stability of this material gives good chances to use for a packaging of biomedical devices and electronic devices such as display. In this review article, principle of deposition process, properties and application fields of parylene polymer thin film are introduced.

• Progress in Superconductivity and Cryogenics
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• v.14 no.1
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• pp.1-3
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• 2012

LMO($LaMnO_3$) buffer layer of superconducting coated conductor was deposited on IBAD-MgO template in the plasma atmosphere at $650^{\circ}C$ which is relatively low compared with conventional deposition temperature of more than $800^{\circ}C$. Deposition method of LMO was DC sputtering, and target and deposition chamber were connected to the cathode and anode respectively. When DC voltage was applied between target and chamber, plasma was formed on the surface of target. The tape substrate was located with the distance of 10 cm between target and tape substrate. When anode bias was connected to the tape substrate, electrons were attracted from plasma in target surface to the tape substrate, and only tape substrate was heated by electron bombardment without heating any other zone. The effect of electron bombardment on the surface of substrate was investigated by increasing bias voltage to the substrate. We found out that the sample of electron bombardment had the effect of surface heating and had good texturing at low controlling temperature.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.5
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• pp.303-308
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• 1999

Dielectric thin films of PLT(28) ($(Pb_{0.72}La_{0.28})Ti_{0.93}O_3$) have been deposited on $Pt/Ti/SiO_2/Si$ substrates in situ by a laser ablation. We have systematically changed the laser fluence from 0.4 J/$cm^2$ to 3 J/$cm^2$, and deposition temperature from $450^{\circ}C\; to\; 700^{\circ}C$. The surface morphology was changed from planar grain structure to columnar structure as the nucleation energy was increased. The PLT thin film with columnar structure showed good dielectric properties. The deposition temperature influenced on nucleation energy much stronger than the laser energy density did.