• 한국표면공학회지
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• 제18권3호
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• pp.116-124
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• 1985

Chemical vapor deposition of $SnO_2$ on Pyrex glass substrate has been investigated using $SnCl_4$ and Oxygen at relatively low temperatures(300-500$^{\circ}C$). The critical flow rate, which delineated the surface reaction controlled region from the mass transfer controlled region, was increased with deposition temperature. The apparent activation energy obtained in surface reaction controlled region was about 6Kcal/mole. The results show that deposition rate, electrical conductivity and transmittance were affected mainly by partial pressure of $SnCl_4$, but little by partial pressure f oxygen. The % transmission of 5000A-thick $SnO_2$ film was about 90% in visible spectrum region and sheet resistance was varied in 0.1-10${\Omega}$ per square shaped portion of the outer surface of the oxide.

• 설비공학논문집
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• 제5권2호
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• pp.130-140
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• 1993

Average particle deposition velocity toward a horizontal semiconductor wafer in vertical airflow is measured by a wafer surface scanner(PMS SAS-3600). Use of wafer surface scanner requires very short exposure time normally ranging from 10 to 30 minutes, and hence makes repetition of experiment much easier. Polystyrene latex (PSL) spheres of diameter between 0.2 and $1.0{\mu}m$ are used. The present range of particle sizes is very important in controlling particle deposition on a wafer surface in industrial applications. For the present experiment, convection, diffusion, and sedimentation comprise important agents for deposition mechanisms. To investigate confidence interval of experimental data, mean and standard deviation of average deposition velocities are obtained from more than ten data set for each PSL sphere size. It is found that the distribution of mean of average deposition velocities from the measurement agrees well with the predictions of Liu and Ahn(1987) and Emi et al.(1989).

• 한국표면공학회지
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• 제28권1호
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• pp.3-13
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• 1995

Electroless Ni and Cu platings were conducted on $B_4C$ and SiC. In the electroless Ni plating, the deposition rate on $B_4C$ was higher than on SiC. However, the electroless Cu deposition occured with high deposition rate regardless of the carbide substrates used in this study. Uniformity of the deposits was better in the electroless Cu deposition than in the electroless Ni deposition. In the topographies of the electroless depositions, Ni deposits have grown as colony, whereas Cu deposits have grown as fine individual grains.

• 한국표면공학회지
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• 제41권1호
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• pp.6-11
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• 2008

An Indium Zinc Oxide(IZO) transparent conductive layer was deposited on a large size glass substrate by using magnetron dc sputtering method with varying a deposition temperature. As the deposition temperature decreased to a room temperature, the sheet resistance of IZO film increased. But this deposition temperature range is included in an applicable to a device. From a standpoint of the sheet resistance, the differences of the sheet resistance were not great and the uniformity of the layer was uniformed around 10%. Crystallization particles were shown on the surface of the layer as deposition temperature increased, but these particles were not shown on the surface of the layer as deposition temperature decreased to the room temperature. It didn't make a scrap of difference in a transmittance of varying deposition temperature. Therefore, it is concluded that IZO thin film manufactured by the room temperature deposition condition can be used as a large size transparent conductive layer of a liquid crystal display device.

• 설비공학논문집
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• 제12권2호
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• pp.113-119
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• 2000

An experimental study has been carried out in order to investigate on a particle deposition on a circular cylinder surface. The present study is focused on the particulate fouling occurring in a heat exchanger for a seawater desalinization, in a laminar flow over circular cylindrical tubes. The objective is to investigate how NaCl concentration influences the $SiO2$ particle deposition on the surface of a glass circular cylinder. The NaCl concentration was changed from 0 g/L to 40 g/L. As the experimental results of $SiO2$ particle which is deposited on the glass circular cylinder surface showed, particle deposition rate per unit time increases rapidly with the increase of NaCl concentration between 0 g/L and 15 g/L. After the maximum of particle deposition rate was found at the NaCl concentration of 15 g/L, particle deposition rate remains unchanged or decreases gradually with the NaCl concentration from 15 g/L to 40 g/L. Also the $SiO2$ deposition rate of particles does not have serious variations with the position at present glass surface.

• 한국전기전자재료학회논문지
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• 제18권9호
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• pp.793-797
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• 2005

This study introduces Electro-chemical Mechanical Deposition(ECMD) lot making Cu interconnect. ECMD is a novel technique that has ability to deposit planar conductive films on non-planar substrate surfaces. Technique involves electrochemical deposition(ECD) and mechanical sweeping of the substrate surface Preferential deposition into the cavities on the substrate surface nay be achieved through two difference mechanisms. The first mechanism is more chemical and essential. It involves enhancing deposition into the cavities where mechanical sweeping does not reach. The second mechanism involves reducing deposition onto surface that is swept. In this study, we demonstrate ECMD process and characteristic. We proceeded this experiment by changing of distribution of current density on divided water area zones and use different pad types.

• Journal of Welding and Joining
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• 제34권4호
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• pp.17-22
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• 2016

In this study, we compared the physical and chemical properties evaluation for each size in the SUS316L metal powder produced by water atomization and gas atomization. and we analyzed the experimental data in order to find the basis of a suitable metal powder (SUS316L) for DED (Direct Energy Deposition) processing. Also it evaluated the properties of each layered surface and cross section according to the number of deposition and deposition speed. In the result of optical microscopy measurements, the metal powder by water atomization was the crack generated between the deposition layer, the deposition layer was poor quality. However, metal powder by gas atomization was obtained a relatively good deposition results than metal powder by water atomization.

• 대한치과보철학회지
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• 제45권6호
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• pp.795-804
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• 2007

Statement of problem. Nano-scale calcium-phosphate coating on the anodizing titanium surface using ion beam-assisted deposition (IBAD) has been recently introduced to improve the early osseointegration. However, not much is known about their surface characteristics that have influence on tissue-implant interaction. Purpose. This study was aimed to investigate microtopography, surface roughness, surface composition, and wettability of the titanium surface modified by the anodic oxidation and calcium phosphate coating using IBAD. Material and methods. Commercially pure titanium disks were used as substrates. The experiment was composed of four groups. Group MA surfaces represented machined surface. Group AN was anodized surface. Group CaP/AN was anodic oxidized and calcium phosphate coated surfaces. Group SLA surfaces were sandblasted and acid etched surfaces. The prepared titanium discs were examined as follows. The surface morphology of the discs was examined using SEM. The surface roughness was measured by a confocal laser scanning microscope. Phase components were analyzed using thin-film x-ray diffraction. Wettability analyses were performed by contact angle measurement with distilled water, formamide, bromonaphtalene and surface free energy calculation. Results. (1) The four groups showed specific microtopography respectively. Anodized and calcium phosphate coated specimens showed multiple micropores and tiny homogeneously distributed crystalline particles. (2) The order of surface roughness values were, from the lowest to the highest, machined group, anodized group, anodized and calcium phosphate deposited group, and sandblasted and acid etched group. (3) Anodized and calcium phosphate deposited group was found to have titanium and titanium anatase oxides and exhibited calcium phosphorous crystalline structures. (4) Surface wettability was increased in the order of calcium phosphate deposited group, machined group, anodized group, sandblasted and acid etched group. Conclusion. After ion beam-assisted deposition on anodized titanium, the microporous structure remained on the surface and many small calcium phosphorous crystals were formed on the porous surface. Nanoscale calcium phosphorous deposition induced roughness on the microporous surface but hydrophobicity was increased.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2006년도 추계학술대회
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• pp.372-375
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• 2006

SOFC is a high temperature fuelcell with many advantages, but it also have several demerits. One of the Issues is cathode poisoning of Cr coming from stainless steel interconnects. Diffusion process of Cr evaporated from the surface of interconnect steel was calculated by using CFD technique to understand factors for Cr deposition. It has been cleared that factors concerned in Cr deposition and how they affect Cr deposition. Major variables for Cr deposit ion are diffusion coefficient, air velocity and temperature If diffusion coefficient decreases, Cr concentration increases in the air but decreases on the cathode surface. Increasing in air velocity, Cr concentration decreases in the air and on the cathode surface. Increase in temperature leads to rising Cr concentration on the cathode surface because of diffusion coefficient increment.

• 한국기계가공학회지
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• 제10권5호
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• pp.44-50
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• 2011

The effect of deposition time in arc ion plating on surface properties of the TiN-coated SM45C steel is presented in this paper. The surface roughness, micro-particle, micro-hardness, coated thickness, atomic distribution of TiN, and adhesion strength are measured for various deposition times. It has been shown that the deposition time has a considerable effect on the micro-hardness, the coated thickness, and the atomic distribution of TiN of the SM45C steels but that it has little influence on the surface roughness and adhesion strength.